Polymer Property : Thermal Conductivity = 1.44 W/m-K Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.167 - 1.44 W/m-K	1.16 - 10.0 BTU-in/hr-ft²-°F	Average value: 0.838 W/m-K Grade Count:12
Overview of materials for Epoxy, High Temperature This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Encapsulating, Mineral Filled". Each property range of values reported is minimum and maximum val..
Thermal Conductivity	0.200 - 1.44 W/m-K @Temperature 80.0 - 250 °C	1.39 - 9.99 BTU-in/hr-ft²-°F @Temperature 176 - 482 °F	Average value: 0.480 W/m-K Grade Count:18
Overview of materials for Polytetrafluoroethylene (PTFE), Glass Filled, Molded This property data is a summary of similar materials in the MatWeb database for the category "Polytetrafluoroethylene (PTFE), Glass Filled, Molded". Each property range of values reported is minimum..
Thermal Conductivity	1.30 - 1.44 W/m-K	9.00 - 10.0 BTU-in/hr-ft²-°F
Master Bond EP112FLAO-1 Toughened, Two component, Heat Curing Epoxy Master Bond EP112FLAO-1 is a toughened two component, high performance epoxy resin system featuring very good temperature resistance, fine thermal conductivity and electrical insulation values with ..
Thermal Conductivity	1.30 - 1.44 W/m-K	9.00 - 10.0 BTU-in/hr-ft²-°F
Master Bond EP30AOHT Dimensionally Stable, Two Component Epoxy Description: Master Bond Polymer System EP30AOHT is a two component epoxy resin system for high performance bonding, potting, sealing and coating, formulated to cure at room temperature or more rapi..
Thermal Conductivity	1.30 - 1.44 W/m-K	9.00 - 10.0 BTU-in/hr-ft²-°F
Master Bond EP45HTAO Heat Resistant Epoxy for Structural Bonding Description: Master Bond Polymer Compound EP45HTAO is a two component thermally conductive epoxy compound for high performance structural bonding, and casting. It is suitable for applications where ..
Thermal Conductivity	1.30 - 1.44 W/m-K	9.00 - 10.0 BTU-in/hr-ft²-°F
Master Bond FLM36 B-staged film for high performance bonding and sealing Master Bond FLM36 is a film adhesive with exceptional strength properties, high temperature resistance and first class thermal conductivity and electrical insulation properties. Based on the Master ..
Thermal Conductivity	1.30 - 1.44 W/m-K	9.00 - 10.0 BTU-in/hr-ft²-°F
Master Bond Supreme 10AOHT-LO High Shear and Peel Strength Epoxy Description: Master Bond Supreme 10AOHT-LO has a combination of properties consisting of excellent thermal conductivity, superior electrical insulation, great adhesion to a wide variety of substrate..
Thermal Conductivity	1.30 - 1.44 W/m-K	9.00 - 10.0 BTU-in/hr-ft²-°F
Master Bond EP42HT-2AO-1 Two Part, Cryogenically Serviceable Epoxy Description: Master Bond EP42HT-2AO-1 Black is a room temperature curable, two component epoxy adhesive, sealant, coating and casting material that meets NASA low outgassing specifications. It featu..
Thermal Conductivity	1.30 - 1.44 W/m-K	9.00 - 10.0 BTU-in/hr-ft²-°F
Master Bond Supreme 11AOHTLO Epoxy Passes NASA Low Outgassing Tests Description: Master Bond Supreme 11AOHTLO is a two component epoxy resin system for high performance bonding and sealing. Although, it is formulated to cure at room temperature, the best cure schedu..
Thermal Conductivity	1.30 - 1.44 W/m-K	9.00 - 10.0 BTU-in/hr-ft²-°F
Master Bond EP21TDC-2LO Two component, highly flexibilized epoxy resin compound Product Description: Master Bond Polymer System EP21TDC-2LO is a two component, highly flexible epoxy resin compound for high performance bonding, sealing, coating, and encapsulation. It is formulat..