Songhan Plastic Technology Co.,Ltd.

Aptek 2205 A/B Low modulus urethane stacking compound

Category Polymer , Adhesive , Thermoset , Polyurethane, TS , Thermoset Polyurethane, Adhesive
Manufacturer Aptek Laboratories
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Aptek 2205 A/B Low modulus urethane stacking compound.pdf
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Material Notes:
APTEK 2205-A/B is a thixotropic, two component, electrically insulating, low modulus urethane system designed for the staking of electrical/electronic components to printed circuit boards. Although APTEK 2205-A/B is capable of achieving full cure at room temperature, a short term exposure to moderate heat will greatly reduce processing time and optimize cured properties. Good wet strength holds components in place allowing for the movement of the circuit boards during processing; 100% solids, solvent free system that will not form voids during cure or service life; Low Tg for excellent low-temperature cycling and performance; Very good substrate adhesion, superior to silicones; Available at two levels of reactivity to meet various productivity needs; available in pre-weighted kits to minimize handling time; ideal for field repair operationsAPTEK 2205-A is a filled polyol resin that is safe to handle when used properly.. APTEK 2205-B is an organic isocyanate which make cause severe eye and skin irritation with direct contact..Information provided by Aptek Laboratories, Inc.
Physical Properties Metric English Comments
Density 0.990 g/cc
0.0358 lb/in³
A Component; ASTM D1475
1.21 g/cc
0.0437 lb/in³
B Component; ASTM D1475
Viscosity 88 cP
88 cP
B Component; ASTM D1824
Mechanical Properties Metric English Comments
Hardness, Shore A 65
Cured property; ASTM D2240
Tensile Strength, Ultimate 6.03 MPa
875 psi
Cured property; ASTM D412
Elongation at Break 265 %
265 %
Cured property; ASTM D412
Thermal Properties Metric English Comments
CTE, linear 79.0 µm/m-°C

@Temperature 20.0 °C
43.9 µin/in-°F

@Temperature 68.0 °F
Cured property; alpha 1; JMTP P200
185 µm/m-°C

@Temperature 20.0 °C
103 µin/in-°F

@Temperature 68.0 °F
Cured property; alpha 2; JMTP P200
Glass Transition Temp, Tg -70.0 °C
-94.0 °F
Cured property; JMTP P-200
Flash Point >= 125 °C
>= 257 °F
B Component; ASTM D92
>= 150 °C
>= 302 °F
A Component; ASTM D92
Electrical Properties Metric English Comments
Volume Resistivity 1.30e+15 ohm-cm
1.30e+15 ohm-cm
Cured property; ASTM D257
Dielectric Constant 3.5

@Frequency 1000 Hz

@Frequency 1000 Hz
Cured property; ASTM D150
Dissipation Factor 0.030

@Frequency 1000 Hz

@Frequency 1000 Hz
Cured property; ASTM D150
Processing Properties Metric English Comments
Processing Temperature 85.0 °C
185 °F
Cure 4 hrs
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