Polymer Property : Processing Temperature = 85.0 °C Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Processing Temperature	85.0 °C	185 °F	Prepolymer Temperature
Northstar Polymers MSB-D60A High Performance Polyurethane Cast Elastomer System This is an Ester/MDI base high-performance polyurethane casting system. This systems is recommended to applications in which the part requires some lord bearing, high tensile strength, cut/tear res..
Processing Temperature	85.0 Â°C	185 Â°F	Working Temperature, Prepolymer
Taiwan PU Corporation PPG CPU-1090C Polyurethane Casting Elastomer A urethane elastomer that can be cured by reacting with a polyamine or a polyolhardener. The molding process is composed of pre-heating, degassing, maxing with a hardener, pouring into the mold, cu..
Processing Temperature	85.0 Â°C	185 Â°F	Working Temperature, Prepolymer
Taiwan PU Corporation PPG CPU-2095 Polyurethane Casting Elastomer A urethane elastomer that can be cured by reacting with a polyamine or a polyolhardener. The molding process is composed of pre-heating, degassing, maxing with a hardener, pouring into the mold, cu..
Processing Temperature	85.0 Â°C	185 Â°F	Working Temperature, Prepolymer
Taiwan PU Corporation PPG CPU-2172 Polyurethane Casting Elastomer A urethane elastomer that can be cured by reacting with a polyamine or a polyolhardener. The molding process is composed of pre-heating, degassing, maxing with a hardener, pouring into the mold, cu..
Processing Temperature	85.0 Â°C	185 Â°F	Working Temperature, Prepolymer
Taiwan PU Corporation PTMG CPU-167L Polyurethane Casting Elastomer A urethane elastomer that can be cured by reacting with a polyamine or a polyolhardener. The molding process is composed of pre-heating, degassing, maxing with a hardener, pouring into the mold, cu..
Processing Temperature	85.0 Â°C	185 Â°F	Working Temperature, Prepolymer
Taiwan PU Corporation PTMG CPU-325L Polyurethane Casting Elastomer A urethane elastomer that can be cured by reacting with a polyamine or a polyolhardener. The molding process is composed of pre-heating, degassing, maxing with a hardener, pouring into the mold, cu..
Processing Temperature	85.0 °C	185 °F	Seal initiation temperature
Dow AFFINITY™ PL 1880 Polyolefin Plastomer AFFINITY® PL 1880 polyolefin plastomer is an ethylene alpha-olefin resin designed for use in a variety of demanding packaging applications including high-speed, form-fill seal products. AFFINITY PL..
Processing Temperature	85.0 °C	185 °F	Applied Temperature
Bales Mold Service AMS-2404-C, AMS-2405-B Mold Coating Description: Bales's application of .0002-.0003 Electroless Nickel with 10.5% to 12% phosphorus offers excellent corrosion protection against P.V.C. and other corrosive materials. Cores, cavitie..
Processing Temperature	85.0 °C	185 °F	Applied Temperature
Bales Mold Service Nibore® Electroless Nickel - Boron Nitride Mold Coating Nibore® is an electroless nickel phosphorus coating that incorporates boron nitride particles in a co-deposited nickel matrix. This unique process is formulated to produce a uniformly dispersed bor..
Processing Temperature	85.0 °C	185 °F	Applied Temperature
Bales Mold Service Nicklon® Nickel-P.T.F.E. Mold Coating Autocatalytic application provides a uniform layer of 22%-24% PTFE over the deepest ribs and most complex details. It is also corrosion resistant.Excellent Release Properties for: Deep Ribs"No Draft..
Processing Temperature	85.0 °C	185 °F	Applied Temperature
Bales Mold Service Ni-Hard® (Nickel-Cobalt) Mold Coating Description: NiHard® is made up of an ultra pure chemistry of Nickel and Cobalt that offers extreme wear resistance and longer mold life.Applications: Uniform deposit for complex details and good c..
Processing Temperature	85.0 °C	185 °F	Cure 5 hrs
Aptek 2120 PMF Low modulus urethane staking compound Premixed-frozen, low modulus urethane staking compoundAPTEK 2120-PMF is a one component, premixed-frozen, thixotropic, electrically insulating soft urethane adhesive. It was designed for the stakin..
Processing Temperature	85.0 °C	185 °F	Cure 4 hrs
Aptek 2205 A/B Low modulus urethane stacking compound APTEK 2205-A/B is a thixotropic, two component, electrically insulating, low modulus urethane system designed for the staking of electrical/electronic components to printed circuit boards. Although..
Processing Temperature	85.0 °C	185 °F	Cure 120 min.
Aptek 2313-PMF Hybrid Epoxy Adhesive Snap-cure, silver-filled; long pot-life/stable viscosity-excellent for robotics. Thermal shock resistant.Production-oriented, snap-cure technology for surface mount applications-allows cure during s..
Processing Temperature	85.0 °C	185 °F	Cure 30 min.
Aptek 2506-A/B Room temperature curing, low modulus urethane conformal coating Room temperature curing, low modulus urethane conformal coatingAPTEK 2506-A/B is an unfilled, two component, electrically insulating, transparent, flexible urethane coating system designed for the e..
Processing Temperature	85.0 - 150 °C	185 - 302 °F	Bonding Temperature
Aquabond Technologies Aquabond™ ABS-85 Water Soluble Adhesive and Bonding Thermoplastic Description: Aquabond's water soluble thermoplastic is designed for temporary mounting of hard materials for slicing, dicing, grinding, lapping and polishing and comes in 3 different bonding tem..
Processing Temperature	85.0 °C	185 °F	Cure 6 hrs
Aptek 2503-A/B Low modulus urethane conformal coating APTEK 2503-A/B is an unfilled, two component, electrically insulating, transparent, flexible urethane coating system designed for the encapsulation and protection of electronic services mounted on p..
Processing Temperature	85.0 °C	185 °F	Cure 2 hrs
Aptek 6512-PMF Electronic grade, conductive epoxy adhesive APTEK 6512-PMF is a one component, 100% solid, silver-filled, electrically conductive epoxy adhesive specifically designed for the attachment of electronic components to printed circuit boards. APT..