Polymer Property : CTE, linear = 103 µin/in-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	185 - 189 µm/m-°C @Temperature 100 - 150 °C	103 - 105 µin/in-°F @Temperature 212 - 302 °F	ASTM E831-00
Proto3000 WaterShed® XC 11122 Stereolithography (SLA) Prototyping Polymer WaterShed XC is a low viscosity liquid photopolymer that produces strong, tough, water-resistant, ABS-like parts. Most importantly parts created with WaterShed 11122 are nearly colorless, and look ..
CTE, linear	185 - 189 µm/m-°C @Temperature 100 - 150 °C	103 - 105 µin/in-°F @Temperature 212 - 302 °F	UV Postcure; ASTM E831-05
DSM Somos® BioClear Parts created with Somos® BioClear are designed for medical applications that are non-implant and have limited contact with the body such as device prototyping. They are shatter-resistant so they w..
CTE, linear	185 - 189 µm/m-°C @Temperature 100 - 150 °C	103 - 105 µin/in-°F @Temperature 212 - 302 °F	ASTM E831-00
DSM Somos® WaterShed® XC 11122 Water-resistant resin for stereolithography DescriptionWaterShed XC is a low viscosity liquid photopolymer that produces strong, tough, water-resistant, ABS-like parts. Most importantly parts created with WaterShed 11122 are nearly colorless..
CTE, linear	185 µm/m-°C @Temperature 20.0 °C	103 µin/in-°F @Temperature 68.0 °F	Cured property; alpha 2; JMTP P200
Aptek 2100-A7C/B Low modulus urethane staking compound APTEK 2100-A7C/B is a thixotropic, two component, electrically insulating, low modulus urethane system designed for the staking of electrical/electronic components to printed circuit boards. Althoug..
CTE, linear	185 µm/m-°C @Temperature 20.0 °C	103 µin/in-°F @Temperature 68.0 °F	Cured property; alpha 2; JMTP P200
Aptek 2205 A/B Low modulus urethane stacking compound APTEK 2205-A/B is a thixotropic, two component, electrically insulating, low modulus urethane system designed for the staking of electrical/electronic components to printed circuit boards. Although..