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Polymer Property : CTE, linear = 36.1 µin/in-°F Product List

Thermal Properties

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Thermal Properties Metric English Comments
CTE, linear 55.0 - 65.0 µm/m-°C
30.6 - 36.1 µin/in-°F
Polykemi
Polykemi AB POLYelast TPE HJ752 Thermoplastic Elastomer, PP/Elastomer, Mineral Reinforced
Information provided by Polykemi AB
CTE, linear 55.0 - 65.0 µm/m-°C
30.6 - 36.1 µin/in-°F
Polykemi
Polykemi AB POLYelast TPE HJ753 Thermoplastic Elastomer, PP/Elastomer, Mineral Reinforced
Information provided by Polykemi AB
CTE, linear 9.00 - 65.0 µm/m-°C
5.00 - 36.1 µin/in-°F
Average value: 44.3 µm/m-°C Grade Count:10
Overview of materials for Polyetheretherketone, PTFE Filled
This property data is a summary of similar materials in the MatWeb database for the category "Polyetheretherketone, PTFE Filled". Each property range of values reported is minimum and maximum values..
CTE, linear 55.0 - 65.0 µm/m-°C
30.6 - 36.1 µin/in-°F
Polykemi
Polykemi AB POLYfill PP HJ752 Polypropylene/Elastomer, Mineral Reinforced
Information provided by Polykemi AB
CTE, linear 55.0 - 65.0 µm/m-°C
30.6 - 36.1 µin/in-°F
Polykemi
Polykemi AB POLYfill PP HJ752 UV Polypropylene/Elastomer, Mineral Reinforced
Information provided by Polykemi AB
CTE, linear 45.0 - 65.0 µm/m-°C

@Temperature 20.0 °C
25.0 - 36.1 µin/in-°F

@Temperature 68.0 °F
Hybrid Plastics NanoBondâ„¢ UV Curable Adhesive
Generally used for dental and optical applications.Information provided by Hybrid Plastics
CTE, linear 55.0 - 65.0 µm/m-°C
30.6 - 36.1 µin/in-°F
Master Bond EP30FLAO Flexibilized, Thermally Conductive Epoxy Adhesive
Master Bond Polymer System EP30FLAO is a two component epoxy resin system for high performance potting, bonding, sealing and coating. It is formulated to cure at room temperature or more rapidly at ..
CTE, linear 60.0 - 65.0 µm/m-°C
33.3 - 36.1 µin/in-°F
Master Bond EP37-3FLFAN Electrically Isolating, Flexible Epoxy
Description: Master Bond Polymer System EP37-3FLFAN is a two component system for high performance potting, bonding, sealing and coating that is formulated to cure at room temperature or more rapidl..
CTE, linear 60.0 - 65.0 µm/m-°C
33.3 - 36.1 µin/in-°F
Master Bond LED401 One Component LED Curable Adhesive System
Master Bond LED401 is a highly innovative, one part LED type system that cures fully upon exposure to a 405 nm wavelength light source where the presence of any UV light is minimal or incidental. In..
CTE, linear 60.0 - 65.0 µm/m-°C
33.3 - 36.1 µin/in-°F
Master Bond LED401 White One Part, LED Curable Compound
Description: Master Bond LED401 White is a one part LED type system that cures fully upon exposure to a 405 nm wavelength light source where the presence of any UV light is minimal or incidental. In..
CTE, linear 60.0 - 65.0 µm/m-°C
33.3 - 36.1 µin/in-°F
Master Bond LED403Med USP Class VI, One Component, LED Curable System
Master Bond LED403Med is a one part LED system that cures fully upon exposure to a 405 nm wavelength light that is generated by an LED source and. In fact, this material will fully cure tack-free wi..
CTE, linear 55.0 - 65.0 µm/m-°C
30.6 - 36.1 µin/in-°F
Master Bond UV15DC80 One Component, UV and Heat Curable Epoxy System
Master Bond UV15DC80 is a special dual cure epoxy based system which offers a primary cure utilizing UV light along with a secondary heat curing mechanism. This system addresses the problem of curin..
CTE, linear 60.0 - 65.0 µm/m-°C

@Temperature 20.0 °C
33.3 - 36.1 µin/in-°F

@Temperature 68.0 °F
Abatron AboCast/AboCure 8109-1
High melting point.Processing: 100/30 pbw; mix at 130-140°C (270 °F); cures in 16 h/120°C (250°F), 10 h/140°C (285°F), 8 h/160°C (320°F), 2 h/ 200°C (390°F).Applications: Heavy duty castin..
CTE, linear 55.0 - 65.0 µm/m-°C

@Temperature 20.0 °C
30.6 - 36.1 µin/in-°F

@Temperature 68.0 °F
Abatron AboCast/AboCure 8109-5
High heat resistance. Easy to use.Processing: 100/20 pbw; Potlife: 7-10 days/20°C (68°F), 5-7h/60°C (140°F); mix at RT; cures in: 4 h/100°C (212°F) + 3 h/190°C (375°F) postcure.Applications..
CTE, linear 55.0 - 65.0 µm/m-°C

@Temperature 20.0 °C
30.6 - 36.1 µin/in-°F

@Temperature 68.0 °F
Abatron AboCast/AboCure 8109-6
High heat resistance. Easy to use.Processing: 100/90 pbw; Potlife: 15-20 days/20°C (68°F), 7-10 h/120°C (250°F); mix at RT; cures in: 3 h/100°C (212°F) + 3 h/190°C (375°F) postcure.Applicat..
CTE, linear 60.0 - 65.0 µm/m-°C
33.3 - 36.1 µin/in-°F
Abatron AboCast/AboCure 8502-1 Epoxy
AboCast/AboCure 8502-1 is a solventless clear Epoxy System, used as a casting, adhesive, and impregnating resin for transformers, capacitors, coils, and other electronic components requiring a low-v..
CTE, linear 55.0 - 65.0 µm/m-°C
30.6 - 36.1 µin/in-°F
Polykemi
Polykemi AB POLYfill PP HJ752 UV2 Polypropylene/Elastomer, Mineral Reinforced
Information provided by Polykemi AB
CTE, linear 55.0 - 65.0 µm/m-°C
30.6 - 36.1 µin/in-°F
Polykemi
Polykemi AB POLYfill PPH BF405510 VT1 Polypropylene Homopolymer, Reinforced, Heat Resistant
Information provided by Polykemi AB
CTE, linear 55.0 - 65.0 µm/m-°C

@Temperature 20.0 °C
30.6 - 36.1 µin/in-°F

@Temperature 68.0 °F
Abatron AboCast/AboCure 8109-7
Processing: 100/80 pbw; Potlife: 6-7 days/20°C (68°F), 12-24 h/40°C (105°F), 0.75-7 h /60°C (140°F); mix at 50-80°C (120-175°F); cures in: 1 h/100°C (212°F) + 4 h/150°C (300°F) postcure...
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