Polymer Property : CTE, linear = 18.9 µin/in-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	34.0 - 34.0 µm/m-°C @Temperature 40.0 - 130 °C	18.9 - 18.9 µin/in-°F @Temperature 104 - 266 °F	Average value: 34.0 µm/m-°C Grade Count:1
Overview of materials for Phenolic, Resole, Mineral/Flock Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Resole, Mineral/Flock Filled". Each property range of values reported is minimum and maximum v..
CTE, linear	34.1 - 38.3 Âµm/m-Â°C @Temperature -60.0 - 60.0 Â°C	18.9 - 21.3 Âµin/in-Â°F @Temperature -76.0 - 140 Â°F
Mateck Potassium Chloride (KCl) Optical crystals
CTE, linear	34.0 µm/m-°C @Temperature 40.0 - 130 °C	18.9 µin/in-°F @Temperature 104 - 266 °F	TMA; ASTM E831
Plenco 4527 Phenolic, Granular, Injection Molded PLENCO 04527 is a heat resistant, mineral and flock filled phenolic molding compound, offering excellent mechanical strength, and resistance to cracking in a wet-dry environment. UL recognized under..
CTE, linear	34.0 µm/m-°C @Temperature 20.0 °C	18.9 µin/in-°F @Temperature 68.0 °F	ASTM D696
Devcon Brushable Ceramic - Red, Blue Epoxy Precision Repair EpoxyComments: Low-viscosity, alumina-filled, brushable epoxy compound, when applied to a 15-20 mil coating, provides a smooth, protective barrier against wear, abrasion, corrosion,..
CTE, linear	34.0 µm/m-°C @Temperature 20.0 °C	18.9 µin/in-°F @Temperature 68.0 °F	ASTM D696
Devcon Brushable Ceramic - White Epoxy Precision Repair EpoxyComments: Low-viscosity, alumina-filled, brushable epoxy compound, when applied to a 15-20 mil coating, provides a smooth, protective barrier against wear, abrasion, corrosion,..
CTE, linear	34.0 µm/m-°C @Temperature 20.0 °C	18.9 µin/in-°F @Temperature 68.0 °F	ASTM D696
Devcon Sprayable Ceramic™ Epoxy Precision Repair EpoxyComments: A sprayable ceramic-reinforced composite that can be sprayed in a manner similar to high-solid paints. Ideal for protecting pumps, paper machines, stacks, pump pads,..
CTE, linear	34.0 µm/m-°C	18.9 µin/in-°F	Below Tg
Epoxy Technology EPO-TEK® 383ND High Temperature Epoxy Material Description: A slightly longer pot life version of EPO-TEK®353ND designed for high temperature, optical and structural applications inside the semiconductor, hybrid, electronic, fiber opti..
CTE, linear	34.0 µm/m-°C	18.9 µin/in-°F	Below Tg
Epoxy Technology EPO-TEK® EE149-6 Epoxy Material Description: A single component, silver-filled, B-stageable epoxy designed for semiconductor flip chip packaging or hybrid micro-electronic substrate attach or lid-sealing.Information Provi..
CTE, linear	34.0 µm/m-°C @Temperature 20.0 °C	18.9 µin/in-°F @Temperature 68.0 °F
Armstrong A-1/A Epoxy Adhesive A brown epoxy paste formulated with enhanced wetting capabilities to hard rubbers and rigid thermoplastics. Has low outgassing characteristics at temperatures below 250°FInformation provided by El..
CTE, linear	34.0 µm/m-°C @Temperature 20.0 °C	18.9 µin/in-°F @Temperature 68.0 °F
Armstrong A-1/V Epoxy Adhesive A brown epoxy paste formulated with enhanced wetting capabilities to hard rubbers and rigid thermoplastics. Has low outgassing characteristics at temperatures below 250°FInformation provided by El..
CTE, linear	34.0 µm/m-°C @Temperature 20.0 °C	18.9 µin/in-°F @Temperature 68.0 °F
Armstrong C-1/E Epoxy Adhesive A versatile, low viscosity, unfilled resin used for electrical potting and laminating applications. It is an excellent insulator, and provides outstanding chemical resistance to most compoundsInfor..
CTE, linear	34.0 µm/m-°C @Temperature 20.0 °C	18.9 µin/in-°F @Temperature 68.0 °F	TMA; ASTM E831
LNP Thermocomp® HF-1006 Polyamide 11, Glass Fiber Reinforcement (discontinued **) Forms: PelletsProcessing Method: Injection MoldingInformation provided by LNP, a GE Plastics Company.This data sheet is labeled Discontinued; however many LNP grades are still active under new names..
CTE, linear	34.0 µm/m-°C @Temperature 20.0 °C	18.9 µin/in-°F @Temperature 68.0 °F
Loctite® 3889 Rapid Cure Isotropic Epoxy Adhesive Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona..
CTE, linear	34.0 - 42.0 µm/m-°C	18.9 - 23.3 µin/in-°F	Average value: 38.7 µm/m-°C Grade Count:3
Overview of materials for Thermoset Polyurethane, Liquid, Quartz Filled This property data is a summary of similar materials in the MatWeb database for the category "Thermoset Polyurethane, Liquid, Quartz Filled". Each property range of values reported is minimum and ma..