Polymer Property : Viscosity = 30000 cP Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Viscosity	15000 - 30000 cP @Temperature 25.0 °C	15000 - 30000 cP @Temperature 77.0 °F	Uncured
Permabond ES562 Epoxy Resin PERMABOND® ES562 is a single-part epoxy adhesive which flows like solder when heated during curing. The adhesive has excellent adhesion to metal surfaces and composites. The high bond strength of t..
Viscosity	0.0300 - 30000 cP	0.0300 - 30000 cP	Average value: 5130 cP Grade Count:23
Overview of materials for Styrenic Elastomer (TES) This property data is a summary of similar materials in the MatWeb database for the category "Styrenic Elastomer (TES)". Each property range of values reported is minimum and maximum values of appro..
Viscosity	575 - 30000 cP @Temperature 140 - 190 °C	575 - 30000 cP @Temperature 284 - 374 °F	Average value: 5530 cP Grade Count:12
Overview of materials for Ethylene Acrylic Acid This property data is a summary of similar materials in the MatWeb database for the category "Ethylene Acrylic Acid". Each property range of values reported is minimum and maximum values of appropri..
Viscosity	10000 - 30000 cP	10000 - 30000 cP
Huntsman Araldite 94-105 Water-Based Hardener Base Resin is ECN 1280. Typical Solids Content 55%. Mean Particle Size 2Âµm. Weight per Epoxide (EEW, g/eq), solids basis, 230 to 251.Comments/Applications: Adhesives; Fiber-Sizing; Textiles; A..
Viscosity	15000 - 30000 cP @Temperature 25.0 Â°C	15000 - 30000 cP @Temperature 77.0 Â°F
Lucite International Colacryl Â® TS1631 Acrylic Solution Resin Acrylic copolymer with reactive groupsA highly flexible resin with good handle. It exhibits good adhesion, resistance to ageing and light stability.Suggested Use: Coating and lamination of nylon and..
Viscosity	10000 - 30000 cP @Shear Rate 50.0 1/s, Temperature 25.0 Â°C	10000 - 30000 cP @Shear Rate 50.0 1/s, Temperature 77.0 Â°F	Bohlin CVO 100
Gwent Electronic Materials C2110127D3 Nanocopper based Paste This product is a nanocopper based paste for screen printing that is compatible with low temperature substrates such as paper. Produced using nanoparticles of negligible oxide content resulting in a..
Viscosity	10000 - 30000 cP @Shear Rate 50.0 1/s, Temperature 25.0 Â°C	10000 - 30000 cP @Shear Rate 50.0 1/s, Temperature 77.0 Â°F	Bohlin CVO 100
Gwent Electronic Materials C2121119D9 Nanocopper based Paste This product is a nanocopper based paste that is designed for flat bed screens. The product is compatible with printing on PET substrates such as the DuPont Melinex ST-505. Produced using nano-par..
Viscosity	10000 - 30000 cP @Temperature 40.0 Â°C	10000 - 30000 cP @Temperature 104 Â°F
Taiwan PU Corporation PTMG CPU-100L Polyurethane Casting Elastomer A urethane elastomer that can be cured by reacting with a polyamine or a polyolhardener. The molding process is composed of pre-heating, degassing, maxing with a hardener, pouring into the mold, cu..
Viscosity	20000 - 30000 cP	20000 - 30000 cP	30% solid in Anone
Taiwan Sheen Soon SheenthaneÂ® A7810H TPU for Ink Thermoplastic polyurethane elastomer for inkAbrasion resistant, flexible, soft, excellent adhesion, high solubility in MEK and Anone. Used for transfer coating, screen printing, and spray applicati..
Viscosity	20000 - 30000 cP	20000 - 30000 cP	30% solid in Anone
Taiwan Sheen Soon SheenthaneÂ® A8510H TPU for Ink Thermoplastic polyurethane elastomer for inkAbrasion resistant, flexible, soft, excellent adhesion, high solubility in MEK and Anone. Used for transfer coating, screen printing, and spray applicati..
Viscosity	20000 - 30000 cP	20000 - 30000 cP	30% solid in Anone
Taiwan Sheen Soon SheenthaneÂ® A8511H TPU for Ink Thermoplastic polyurethane elastomer for inkAbrasion resistant, flexible, soft, excellent adhesion, high solubility in MEK and Anone. Used for transfer coating, screen printing, and spray applicati..
Viscosity	20000 - 30000 cP	20000 - 30000 cP	30% solid in Anone/MEK
Taiwan Sheen Soon SheenthaneÂ® A9513H TPU for Ink Thermoplastic polyurethane elastomer for inkAbrasion resistant, flexible, soft, excellent adhesion, high solubility in MEK and Anone. Used for transfer coating, screen printing, and spray applicati..
Viscosity	25000 - 30000 cP @Temperature 23.0 °C	25000 - 30000 cP @Temperature 73.4 °F
Master Bond EP21FRSPLV Flame Resistant Two Component Epoxy Master Bond Polymer System EP21FRSPLV is a two component, room temperature curable, flame resistant compound for potting, encapsulating and casting. EP21FRSPLV has a one to one mix ratio, by weight...
Viscosity	20000 - 30000 cP	20000 - 30000 cP	Part A
Master Bond EP37-3FLFAN Electrically Isolating, Flexible Epoxy Description: Master Bond Polymer System EP37-3FLFAN is a two component system for high performance potting, bonding, sealing and coating that is formulated to cure at room temperature or more rapidl..
Viscosity	27000 - 30000 cP	27000 - 30000 cP
Master Bond EP46HT-1 Epoxy For Serviceability Up To 600°F Description: Master Bond EP46HT-1 is a two component epoxy system for high performance structural bonding and sealing suitable for applications where resistance to temperatures from -100°F to +550°..
Viscosity	15000 - 30000 cP	15000 - 30000 cP	Part A
Master Bond EP21TPFL-1AO Two Part, Flexible, Lower Viscosity Epoxy Polysulfide System Product Description: Master Bond EP21TPFL-1AO is a two component, low viscosity epoxy polysulfide for high performance bonding, sealing, coating and casting offering thermal conductivity, electrical..
Viscosity	20000 - 30000 cP @Temperature 23.0 °C	20000 - 30000 cP @Temperature 73.4 °F	10 rpm
Epoxy Technology EPO-TEK® OE188 High Temperature Silica-Filled Epoxy Product Description: EPO-TEK® OE188 is a low CTE, designed for semiconductor and fiber optic applications. Advantages & Application Notes: Paste-like viscosity allows for application by dispensing..
Viscosity	20000 - 30000 cP @Temperature 23.0 °C	20000 - 30000 cP @Temperature 73.4 °F	10 rpm
Epoxy Technology EPO-TEK® OG116-31 UV Cure Optical Epoxy Product Description: EPO-TEK® OG116-31 is a single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, medical..
Viscosity	10000 - 30000 cP	10000 - 30000 cP
Beijing Ranger Chem SM-634X90 Solvent Based Epoxy Resin Information provided by Beijing Ranger Chemical Co.