Category | Polymer , Thermoplastic , Nylon , Nylon 66 , Nylon 66, 40% Mineral Filled |
Manufacturer | CP-Polymer-Technik GmbH & Co. |
Trade Name | Wellamid® |
Port | Ningbo port,China |
Trade Terms | FOB, CFR, CIF |
Payment Terms | L/C, T/T, Western Union |
Download PDF | CP-Polymer-Technik Wellamid® 6600 MR 409 HWCP 40% Mineral Nylon 66, Heat Stabilized, Conditioned.pdf |
Price | EMAIL US sales@lookpolymers.com |
Physical Properties | Metric | English | Comments |
---|---|---|---|
Density | 1.45 g/cc | 0.0524 lb/in³ | ISO 1183 |
Moisture Absorption at Equilibrium | 1.5 - 2.0 % | 1.5 - 2.0 % | 23°C/50%RH, Starting when dry; DIN 53495 |
Linear Mold Shrinkage | 0.0090 - 0.011 cm/cm @Thickness 4.00 mm |
0.0090 - 0.011 in/in @Thickness 0.157 in |
Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Tensile Strength at Break | 60.0 MPa | 8700 psi | 5 mm/min; ISO 527 |
Elongation at Break | 15 % | 15 % | 5 mm/min; ISO 527 |
Tensile Modulus | 3.50 GPa | 508 ksi | ISO 527 |
Charpy Impact Unnotched | 6.50 J/cm² @Temperature 23.0 °C |
30.9 ft-lb/in² @Temperature 73.4 °F |
ISO 179 |
Charpy Impact, Notched | 1.00 J/cm² @Temperature 23.0 °C |
4.76 ft-lb/in² @Temperature 73.4 °F |
ISO 179 |
Thermal Properties | Metric | English | Comments |
---|---|---|---|
Melting Point | 255 °C | 491 °F | Kofler |
Electrical Properties | Metric | English | Comments |
---|---|---|---|
Volume Resistivity | 1.00e+12 ohm-cm | 1.00e+12 ohm-cm | IEC 93 |
Surface Resistance | 1.00e+10 ohm | 1.00e+10 ohm | ISO 3915 |
Dielectric Constant | 6.0 @Frequency 1e+6 Hz |
6.0 @Frequency 1e+6 Hz |
IEC 250 |
Dielectric Strength | 35.0 kV/mm | 889 kV/in | IEC 243-1 |
Dielectric Loss Index | 0.060 | 0.060 | At 1 MHz; IEC 250 |
Processing Properties | Metric | English | Comments |
---|---|---|---|
Melt Temperature | 265 - 295 °C | 509 - 563 °F | |
Mold Temperature | 80.0 - 100 °C | 176 - 212 °F |
Descriptive Properties | Value | Comments |
---|---|---|
Back Pressure | Low | |
Holding Pressure | High | |
Injection Speed | High | |
Screw Speed | Medium |