Polymer Property : Cure Time = 48.0 hour Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	1440 - 2880 min @Temperature 25.0 °C	24.0 - 48.0 hour @Temperature 77.0 °F
Resinlab® EP1295 Black Medium Viscosity, Halogen Free, Flame Retardant Epoxy Casting Resin Resinlab™ EP1295 Black is a medium viscosity, halogen free, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (..
Cure Time	1440 - 2880 min @Temperature 25.0 °C	24.0 - 48.0 hour @Temperature 77.0 °F
Resinlab® EP1340 Medium Viscosity, Flame Retardant Epoxy Casting Resin System Resinlab™ EP1340 is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034) for U..
Cure Time	1440 - 2880 min @Temperature 22.2 °C	24.0 - 48.0 hour @Temperature 72.0 °F
Master Bond EP21ARHTND Two component epoxy adhesive, sealant, coating and encapsulating system Product Description: Master Bond EP21ARHTND is a two component epoxy resin system for high performance bonding, sealing and coating. It has a convenient 100 to 50 mix ratio by weight and is formulat..
Cure Time	1440 - 2880 min @Temperature 23.0 °C	24.0 - 48.0 hour @Temperature 73.4 °F
Master Bond EP21HT High Temperature Resistant Two Component Epoxy Master Bond Polymer System EP21HT is a two component, room temperature curing epoxy adhesive, sealant and coating with high temperature resistance up to 400°F. EP21HT produces high strength, durabl..
Cure Time	1440 - 2880 min @Temperature 23.9 °C	24.0 - 48.0 hour @Temperature 75.0 °F
Master Bond EP21LV35Med Two Component, Flexible USP Class VI Epoxy System Master Bond Polymer System EP21LV3/5Med is a two part, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting that cures flexible. It cures readil..
Cure Time	1440 - 2880 min @Temperature 23.0 °C	24.0 - 48.0 hour @Temperature 73.4 °F
Master Bond EP21ND Non Drip Room Temperature Curing Epoxy System Master Bond Polymer System EP21ND is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties. EP21ND can be mixed by weight or volume and is available in a ..
Cure Time	1440 - 2880 min @Temperature 23.9 °C	24.0 - 48.0 hour @Temperature 75.0 °F
Master Bond EP21TDCSFL Flexible Two Component Silver Conductive Epoxy Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidl..
Cure Time	1440 - 2880 min @Temperature 23.9 °C	24.0 - 48.0 hour @Temperature 75.0 °F
Master Bond EP21TDCSMed Two Component, Silver Conductive USP Class VI Epoxy Master Bond Polymer System EP21TDCS MED is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. The high strength..
Cure Time	1440 - 2880 min @Temperature 23.9 °C	24.0 - 48.0 hour @Temperature 75.0 °F
Master Bond EP30ANHT Two Part, Electrically Isolating Epoxy Adhesive Description: Master Bond Polymer System EP30ANHT is a two part epoxy system with terrific thermal conductivity, while maintaining electrical insulation. One noteworthy property is its wide service t..
Cure Time	1440 - 2880 min @Temperature 23.9 °C	24.0 - 48.0 hour @Temperature 75.0 °F
Master Bond EP30AOHT Dimensionally Stable, Two Component Epoxy Description: Master Bond Polymer System EP30AOHT is a two component epoxy resin system for high performance bonding, potting, sealing and coating, formulated to cure at room temperature or more rapi..
Cure Time	1440 - 2880 min @Temperature 23.9 °C	24.0 - 48.0 hour @Temperature 75.0 °F
Master Bond EP30HT-LO NASA Low Outgassing, Optically Clear Coating Description: Master Bond EP30HT-LO is a moderate viscosity, two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a four to one mix ratio..
Cure Time	1440 - 2880 min @Temperature 23.9 °C	24.0 - 48.0 hour @Temperature 75.0 °F
Master Bond EP41S-1HT Solvent Resistant Adhesive, Sealant and Coating Description: Master Bond EP41S-1HT is a two component epoxy resin system for high performance bonding, sealing, coating and encapsulating. It has a 100 to 30 mix ratio by weight and is formulated to..
Cure Time	1440 - 2880 min @Temperature 23.9 °C	24.0 - 48.0 hour @Temperature 75.0 °F
Master Bond EP41S-1HTND Non-Drip, High Performance Epoxy Adhesive Description: Master Bond EP41S-1HTND is a two component epoxy resin system for high performance bonding, sealing and coating. It has a 100 to 30 mix ratio by weight and its viscosity is a smooth pas..
Cure Time	1440 - 2880 min @Temperature 23.9 °C	24.0 - 48.0 hour @Temperature 75.0 °F
Master Bond EP79 Two Component, Silver Coated, Nickel Filled Conductive Epoxy Master Bond Polymer System EP79 is a two component, silver coated, nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or ..
Cure Time	1440 - 2880 min @Temperature 23.0 °C	24.0 - 48.0 hour @Temperature 73.4 °F
Master Bond Mastersil 151 Two Component Low Viscosity Silicone Compound Master Bond MasterSil 151 is a two component, low viscosity silicone compound for high performance potting and encapsulation. MasterSil 151 is an addition cured system and does not require exposure..
Cure Time	1440 - 2880 min @Temperature 23.9 °C	24.0 - 48.0 hour @Temperature 75.0 °F
Master Bond EP21TDCSLO Two Component Silver Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rap..
Cure Time	1440 - 2880 min @Temperature 23.9 °C	24.0 - 48.0 hour @Temperature 75.0 °F
Master Bond EP30QF Quartz Filled, Two Component Epoxy System Master Bond Polymer System EP30QF is a quartz filled, two component epoxy for high performance bonding, sealing, coating and casting that is formulated to cure at room temperature or more rapidly at..
Cure Time	1440 - 2880 min @Temperature 23.0 °C	24.0 - 48.0 hour @Temperature 73.4 °F
Master Bond EP34 Room Temperature Curing Two Component Epoxy System Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. Adhesion to metals, glass, ceramics, woo..
Cure Time	1440 - 2880 min @Temperature 23.9 °C	24.0 - 48.0 hour @Temperature 75.0 °F
Master Bond Supreme 11HT-LO Adhesive and Sealant Serviceable to +400°F Description: Master Bond Polymer System Supreme 11HT-LO is an easy to use two part epoxy adhesive/sealant combining both high shear and high peel strengths along with a relatively fast cure at room ..
Cure Time	1440 - 2880 min @Temperature 25.0 °C	24.0 - 48.0 hour @Temperature 77.0 °F
Cytec (Conap) FR-1271 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Cure Time	1440 - 2880 min @Temperature 25.0 °C	24.0 - 48.0 hour @Temperature 77.0 °F
Epoxyset Epoxiohm EO-30M-1 Electrically Conductive Epoxy Adhesive EO-30M-1 is a two part, semi-rigid, silver filled, epoxy adhesive. EO-30M-1 exhibits superior adhesion to a wide variety of substrates including most metals, ceramics, glass and plastics.Information..
Cure Time	1440 - 2880 min @Temperature 23.0 °C	24.0 - 48.0 hour @Temperature 73.4 °F	Recommended Cure
Aremco Aremco-Bond™ 2200 High Performance Epoxide Glass Fiber- and Kevlar-Reinforced, Epoxy-Novolac; High Strength, Excellent Abrasion and Corrosion Resistance
Cure Time	1440 - 2880 min @Temperature 23.0 °C	24.0 - 48.0 hour @Temperature 73.4 °F	Recommended Cure
Aremco Aremco-Bond™ 2210 High Performance Epoxide Aluminum and Ceramic-Filled, Vibration and Impact Resistant, for Repairing Aluminum Mold and Wear Surfaces.
Cure Time	1440 - 2880 min @Temperature 23.0 °C	24.0 - 48.0 hour @Temperature 73.4 °F	Alternate Cure
Aremco Aremco-Bond™ 568 High Performance Epoxide Aluminum-Filled, 1:1, Good Bond Strength and High Thermal Conductivity.
Cure Time	1440 - 2880 min @Temperature 23.0 °C	24.0 - 48.0 hour @Temperature 73.4 °F	at RT, Alternate Cure
Aremco Aremco-Bond™ 631 High Performance Epoxide Clear-Amber, 1:1, Good Bond Strength and Corrosion Resistance.Also available filled with aluminum oxide (Alumina) or pigments.
Cure Time	1440 - 2880 min @Temperature 23.0 °C	24.0 - 48.0 hour @Temperature 73.4 °F	Alternate
Aremco Aremco-Bond™ 657 High Performance Epoxide Stainless Steel-Filled, High Corrosion Resistance.
Cure Time	1440 - 2880 min @Temperature 93.3 °C	24.0 - 48.0 hour @Temperature 200 °F
Master Bond EP30M4LV Chemically Resistant, Low Viscosity Adhesive Description: Master Bond EP30M4LV is a two component, low viscosity epoxy system for high performance bonding, sealing and encapsulation. This system features a forgiving 100 to 60 mix ratio by weig..