Master Bond EP21TDCSLO Two Component Silver Conductive Epoxy Adhesive

Category	Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer	Master Bond Inc.
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Master Bond EP21TDCSLO Two Component Silver Conductive Epoxy Adhesive.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. The high strength bonds are remarkably adaptable to thermal cycling and resistant to chemicals including water, oil and most organic solvents. Adhesion to metals, glass, ceramics, vulcanized rubbers and many plastics is excellent.

Mechanical Properties	Metric	English	Comments
Adhesive Bond Strength	>= 5.52 MPa	>= 800 psi	shear, Al/Al, after 30 days water immersion
	>= 5.86 MPa	>= 850 psi	shear, Al/Al
Peel Strength	>= 0.877 kN/m	>= 5.00 pli

Thermal Properties	Metric	English
Thermal Conductivity	1.59 W/m-K	11.0 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	135 °C	275 °F
Minimum Service Temperature, Air	-269 °C	-452 °F

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.0010 ohm-cm	<= 0.0010 ohm-cm

Processing Properties	Metric	English	Comments
Cure Time	60.0 - 120 min @Temperature 93.3 °C	1.00 - 2.00 hour @Temperature 200 °F
	1440 - 2880 min @Temperature 23.9 °C	24.0 - 48.0 hour @Temperature 75.0 °F
Pot Life	30 - 40 min	30 - 40 min	50 gram mass
Shelf Life	3.00 - 6.00 Month	3.00 - 6.00 Month

Descriptive Properties	Value	Comments
Mixing Ratio (A to B)	1/1
Viscosity	smooth paste

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