Master Bond Supreme 11HT-LO Adhesive and Sealant Serviceable to +400°F

Description: Master Bond Polymer System Supreme 11HT-LO is an easy to use two part epoxy adhesive/sealant combining both high shear and high peel strengths along with a relatively fast cure at room temperature (a more rapid cure at elevated temperatures). It offers a convenient one to one mix ratio by weight or volume. Supreme 11HT-LO produces good performance bonds with high shear and high peel strengths for service over the wide temperature range of below -100°F to 400°F. It offers resistance to impact, thermal shock, vibration and stress fatigue cracking, while maintaining the moisture, creep, corrosion and thermal resistance typical of epoxy resin adhesives. It is 100% reactive and does not contain any diluents or solvents, or any hazardous ingredients. Master Bond Polymer System Supreme 11HT-LO produces durable, high strength, tough bonds which are resistant to severe thermal cycling and many chemicals including water, oil, fuels and some organic solvents even upon prolonged exposures. Tensile shear strengths in excess of 2000 psi and T-peel strengths of greater than 15 pli are readily obtained. Adhesion to metals, glass, ceramics, and many plastics is excellent. The hardened adhesive is a superior electrical insulator. Color of part A is gray, part B is amber. Supreme 11HT-LO offers the convenience of a fast room temperature cure with a uniquely favorable performance profile for use in even the most difficult applications in the aerospace, electronic, electrical, computer and chemical industries for up to 400°F service. SUPREME 11HT-LO passes NASA low outgassing specifications. If cured at room temperature, a post cure of 150°F for 2 hours is recommended for best low outgassing results. Product Advantages: Convenient mixing; non-critical mixing ratio (part A/part B: 100/100), by weight or volume. Easy application; contact pressure only required for cure; adhesive spreads evenly and smoothly. Versatile cure schedules; ambient temperature cure or faster elevated temperature cures as required. High shear and peel bonding strength to similar and dissimilar substrates over the remarkably wide temperature range of below -100°F to +400°F. Good electrical insulating properties and chemical resistance. Superior thermal shock, impact and stress cracking fatigue resistance. Excellent long term durability. Passes NASA low outgassing specifications.Information provided by MasterBond®