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Master Bond EP30ANHT Two Part, Electrically Isolating Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Master Bond Inc.
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP30ANHT Two Part, Electrically Isolating Epoxy Adhesive.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
Description: Master Bond Polymer System EP30ANHT is a two part epoxy system with terrific thermal conductivity, while maintaining electrical insulation. One noteworthy property is its wide service temperature range of -60°F to 400°F. Other salient characteristics include dimensional stability, outstanding physical strength and good flowability. This latter property enables it to be readily used for potting and encapsulation applications. EP30ANHT is also brushable and can be used as an adhesive, coating and sealant. In this regard, it bonds well to metals, many plastics, ceramics and glass. It resists a variety of chemicals including water, oils, fuels, acids and bases. EP30ANHT has a very low coefficient of thermal expansion (CTE). It is formulated to cure at room temperature or more rapidly at elevated temperatures and has a ten to one (10:1) mix ratio by weight. The color of Part A is gray and Part B is clear. Master Bond EP30ANHT is widely used in the electronic, electrical, computer, chemical, electro-optical and related industries where maximum heat transfer and superior electrical isolation are required. Product Advantages: Easy application: adhesive spreads or pours evenly and smoothly. Versatile cure schedules: ambient temperature cures or fast elevated temperature cures. High bond strength to a wide variety of substrates; very good adhesive properties. Accomplished electrical insulator with impressively high capacity for heat transfer. Great dimensional stability, high compressive strength and low CTE. Low viscosity with excellent flowability; ideal for potting and encapsulation.Information provided by MasterBond®
Physical Properties Metric English Comments
Viscosity 280 - 500 cP
280 - 500 cP
Part B
60000 - 110000 cP
60000 - 110000 cP
Part A
Mechanical Properties Metric English Comments
Hardness, Shore D 90
90
Tensile Strength at Break >= 41.4 MPa
>= 6000 psi
Compressive Strength >= 117 MPa
>= 17000 psi
Shear Strength >= 6.21 MPa
>= 900 psi
Tensile, Al to Al
Thermal Properties Metric English Comments
CTE, linear 22.0 - 25.0 µm/m-°C
12.2 - 13.9 µin/in-°F
Thermal Conductivity 3.17 - 3.60 W/m-K
22.0 - 25.0 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 204 °C
400 °F
Minimum Service Temperature, Air -51.1 °C
-60.0 °F
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+14 ohm-cm
1.00e+14 ohm-cm
Dielectric Constant 4.6

@Frequency 60.0 Hz,
Temperature 25.0 °C
4.6

@Frequency 60.0 Hz,
Temperature 77.0 °F
Dielectric Strength >= 15.7 kV/mm

@Thickness 3.17 mm
>= 400 kV/in

@Thickness 0.125 in
Processing Properties Metric English Comments
Cure Time 60.0 - 120 min

@Temperature 93.3 °C
1.00 - 2.00 hour

@Temperature 200 °F
1440 - 2880 min

@Temperature 23.9 °C
24.0 - 48.0 hour

@Temperature 75.0 °F
Pot Life 40 - 60 min
40 - 60 min
100 gram batch
Shelf Life 6.00 Month

@Temperature 23.9 °C
6.00 Month

@Temperature 75.0 °F
in original unopened container
Descriptive Properties Value Comments
Mixing Ratio (A to B) 10:1
by weight
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