Master Bond EP21TDCSFL Flexible Two Component Silver Conductive Epoxy

Category	Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer	Master Bond Inc.
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Master Bond EP21TDCSFL Flexible Two Component Silver Conductive Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most salient features are its high flexibility and elongation. This easy to handle two part silver conductive epoxy has a one-to-one mix ratio, by weight or volume. Its high flexibility combined with its inherently low shrinkage enables the cured system to exert very little mechanical stress on sensitive components and substrates

Mechanical Properties	Metric	English	Comments
Elongation at Break	>= 60 %	>= 60 %
Adhesive Bond Strength	>= 5.52 MPa	>= 800 psi	shear, Al/Al, after 30 days water immersion
	>= 5.86 MPa	>= 850 psi	shear, Al/Al
Peel Strength	>= 3.51 kN/m	>= 20.0 pli

Thermal Properties	Metric	English
Thermal Conductivity	1.59 W/m-K	11.0 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	121 °C	250 °F
Minimum Service Temperature, Air	-269 °C	-452 °F

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.0010 ohm-cm	<= 0.0010 ohm-cm

Processing Properties	Metric	English	Comments
Cure Time	120 - 180 min @Temperature 65.6 °C	2.00 - 3.00 hour @Temperature 150 °F
	1440 - 2880 min @Temperature 23.9 °C	24.0 - 48.0 hour @Temperature 75.0 °F
Pot Life	60 - 75 min	60 - 75 min	100 gram mass
	75 - 90 min	75 - 90 min	50 gram mass
Shelf Life	3.00 Month	3.00 Month	in syringe
	6.00 Month	6.00 Month	in glass jar

Descriptive Properties	Value	Comments
Mixing Ratio (A to B)	1/1
Viscosity	smooth paste

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