Polymer Property : Cure Time = 24.0 hour Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F
NextGen Adhesives M907-11 Medical Grade Epoxy Adhesive Description: NGAC M907-11 is a medium viscosity adhesive system that is specifically formulated for medical device assembly applications.Advantages and Applications: Uses include laminating, bonding..
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F	Complete Cure Cycle
Northstar Polymers MPS-F08A Hand-Mixable Flexible Foam This foam formulation is designed to make molded flexible foam parts/sheets/dies/blocks by hand-mixing or machine casting by the meter dispensing equipment. The components are stable and liquid at ..
Cure Time	1440 min @Temperature 23.0 °C	24.0 hour @Temperature 73.4 °F	M10 steel, full strength
Permabond HM128 Anaerobic Threadlocker Permabond® HM128 Threadlocker is a high strength adhesive for permanent assembly. It is typically used for preventing vibration loosening of bolts, studs and cap screws. Full cure to a cross-linked..
Cure Time	1440 - 2880 min @Temperature 25.0 °C	24.0 - 48.0 hour @Temperature 77.0 °F
Resinlab® EP1390 Medium Viscosity, Self Extinguishing Flame Retardant Epoxy Casting Resin System Resinlab™ EP1390 is a RoHS compliant, medium viscosity, self extinguishing flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Labor..
Cure Time	1440 min @Temperature 23.0 °C	24.0 hour @Temperature 73.4 °F	M10 steel, full strength
Permabond HH040 Pure NSF 61 Approved Anaerobic Retainer Permabond® HH040 PURE is a single component liquid that cures only when in contact with metal parts and oxygen is excluded. The liquid adhesive fills the “air space” between parts and upon cure u..
Cure Time	1440 - 2880 min @Temperature 23.9 °C	24.0 - 48.0 hour @Temperature 75.0 °F
Master Bond EP30AOHT Dimensionally Stable, Two Component Epoxy Description: Master Bond Polymer System EP30AOHT is a two component epoxy resin system for high performance bonding, potting, sealing and coating, formulated to cure at room temperature or more rapi..
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F
Tra-Con Tra-Bond 2159 Heat Conductive Electrically Insulating Compound TRA-BOND 2159 is a flexible, thermal conductive epoxy system. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards..
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F
Tra-Con Tra-Bond FS420 Flexible Plastic Adhesive TRA-BOND FS-420 is a flexible thixotropic bonding adhesive designed for bonding all types of plastics including nylon, PVC, polyethylene, acrylic, lexan, polypropylene, kapton or almost any thermopl..
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F
Tra-Con Tra-Duct 916H03 Room Temperature Cure High Conductivity Silver Epoxy Adhesive TRA-DUCT 916H03 is recommended for electronic bonding and sealing applications that require the combination of high conductivity coupled with good mechanical properties. This two part smooth paste s..
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F
Trelleborg Emerson & Cuming Eccobond® 24 Two-Component High Strength-Impact Resistant Epoxy Adhesive Emerson & Cuming 24 Eccobond® Two-Component High Strength-Impact Resistant Epoxy AdhesiveClear, low viscosity, room temperature curing, epoxy adhesive. Exhibits resilient bonds when joining dissimi..
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F
Tra-Con Tra-Bond 2115 Clear High Strength Epoxy Adhesive TRA-BOND 2115 is a clear, low viscosity epoxy formulation used in the fabrication of lasers. It is capable of withstanding 30 seconds of 60 watt direct laser energy. The low cure shrinkage (using a ..
Cure Time	1440 min @Temperature 10.0 °C	24.0 hour @Temperature 50.0 °F	Light Load
Chesterton ARC 791 Composite Description: A quartz reinforced composite designed to resurface and restore concrete surfaces, to protect new concrete, and to repair concrete damaged by chemical and physical abuse. ARC 791 has ex..
Cure Time	1440 min @Temperature 16.0 °C	24.0 hour @Temperature 60.8 °F	Light Load
Chesterton ARC 890 Course Grade Sliding Wear Compound An advanced ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is normally applied at the thickness of 6 mm (1/4”)..
Cure Time	1440 min @Temperature 16.0 °C	24.0 hour @Temperature 60.8 °F	Light Load
Chesterton ARC 897 Fine Grade Sliding Wear Compound Description: ARC 897 is an advanced ceramic reinforced composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is applied at a t..
Cure Time	1440 min @Temperature 32.0 °C	24.0 hour @Temperature 89.6 °F	Overcoat End
Chesterton ARC PW Potable Water Coating Description: ARC PW is a 100% solids lining certified for NSF/ANSI 61 potable water, cold water service. It is recommended to be applied by brush, roll or spray at 500-750 microns (20-30 mils) total..
Cure Time	1440 min @Temperature 32.0 °C	24.0 hour @Temperature 89.6 °F	Full Chemical
Chesterton ARC S2 Ceramic reinforced erosion resistant coating Description: An advanced ceramic composite for the resurfacing and protection of all metal surfaces. It is normally applied at a thickness of 250 microns (10 mils) per coat. Non-shrinking, 100% soli..
Cure Time	1440 min @Temperature 23.0 °C	24.0 hour @Temperature 73.4 °F
Epoxy Technology EPO-TEK® 320NC-2 Optically Opaque Epoxy Material Description: A two component, black colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a modific..
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F
Atom Adhesives AA-BOND 2153 Epoxy Adhesive AA-BOND 2153 is a thixotropic (smooth paste) thermal conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits..
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F
Atom Adhesives AA-BOND G298 Epoxy Adhesive AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Appearance: Resin: Brown, Hardener: Dark Bro..
Cure Time	>= 1440 min @Temperature 22.0 - 30.0 °C	>= 24.0 hour @Temperature 71.6 - 86.0 °F
Abatron 8509-4 A/B Carbon-Filled Electrically Conductive Epoxy Compound 8509-4 A/B is a solventless carbon-epoxy system used as an adhesive and silk-screening material with anti-static and other lower-conductivity requirements.
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F
Atom Adhesives AA-BOND F162 Epoxy Adhesive AA-BOND F162 is a thixotropic electrical insulating epoxy adhesive system with low vapor pressure and outgassing characteristics. AA-BOND F162 was specifically developed for fiber optic, laser, phot..
Cure Time	1440 - 4320 min @Temperature 25.0 °C	24.0 - 72.0 hour @Temperature 77.0 °F
Resinlab® SEC1233 Silver Filled Epoxy Adhesive Resinlab™ SEC1233 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1233 provides excellent electrical conductivit..
Cure Time	1440 min @Temperature 21.0 °C	24.0 hour @Temperature 69.8 °F	Full Chemical
Chesterton ARC NVE VC Vinyl Ester Sealer Description: ARC NVE VC (Veil Coat) is a two-component, modified epoxy novolac vinyl ester sealer coat formulated for application by brush, roller or spray at 0.15-0.25 mm (0.07-0.010”) wet film th..