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Polymer Property : Cure Time = 24.0 hour Product List
Processing PropertiesTips: 30 items are displayed at most.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time |
1440
min <br>@Temperature 25.0 °C
|
24.0
hour <br>@Temperature 77.0 °F
|
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NextGen Adhesives P907-26 Optical Assembly Adhesive
Description: NGAC P907-26 is a low viscosity and room temperature curing adhesive specifically formulated for optical applications where clarity is critical.Advantages and Applications: Uses include..
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| Cure Time |
1440
min <br>@Temperature 23.0 °C
|
24.0
hour <br>@Temperature 73.4 °F
|
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Resin Technology Group 401 Oxy-Bond™ Electrically Conductive Epoxy Adhesive
Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
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| Cure Time |
1440
min <br>@Temperature 23.0 °C
|
24.0
hour <br>@Temperature 73.4 °F
|
Aluminum, working strength |
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Permabond HL126 Anaerobic Threadlocker
PERMABOND® HL126 Threadlocker is a water thin product for locking pre-assembled parts through wicking action. PERMABOND® HL126 Threadlocker prevents vibration loosening. Because of the low viscosi..
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| Cure Time |
1440
-
2880
min <br>@Temperature 23.0 °C
|
24.0
-
48.0
hour <br>@Temperature 73.4 °F
|
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Master Bond EP21TDC Toughened, Shock Resistant Two Component Epoxy System
Master Bond Polymer Adhesive EP21TDC is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one ..
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| Cure Time |
1440
-
2880
min <br>@Temperature 23.9 °C
|
24.0
-
48.0
hour <br>@Temperature 75.0 °F
|
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Master Bond EP30HT-LO NASA Low Outgassing, Optically Clear Coating
Description: Master Bond EP30HT-LO is a moderate viscosity, two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a four to one mix ratio..
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| Cure Time |
1440
min <br>@Temperature 25.0 °C
|
24.0
hour <br>@Temperature 77.0 °F
|
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Tra-Con Tra-Bond FDA15 Food and Drug Application Epoxy Adhesive
TRA-BOND FDA-15 is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Adminis..
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| Cure Time |
1440
min <br>@Temperature 25.0 °C
|
24.0
hour <br>@Temperature 77.0 °F
|
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|
Tra-Con Tra-Bond FDA8T Food and Drug Application Thixotropic Flexible Epoxy Adhesive
TRA-BOND FDA-8T EPOXY ADHESIVE is a thixotropic epoxy resin system specifically developed for bonding applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admini..
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| Cure Time |
1440
min <br>@Temperature 25.0 °C
|
24.0
hour <br>@Temperature 77.0 °F
|
|
|
Tra-Con Tra-Cast 3108 General Purpose Epoxy Casting Compound
TRA-CAST 3108 is a low viscosity two-part formulation recommended for underfill and encapsulating applications where the combination of good mechanical thermal and electrical properties are required..
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| Cure Time |
1440
min <br>@Temperature 25.0 °C
|
24.0
hour <br>@Temperature 77.0 °F
|
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Tra-Con Tra-Duct 2919 Room Temperature Conductive, Flexible Silver Epoxy Adhesive
TRA-DUCT 2919 is a non-bleeding, electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled ..
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| Cure Time |
1440
min <br>@Temperature 25.0 °C
|
24.0
hour <br>@Temperature 77.0 °F
|
|
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Tra-Con Tra-Duct 916H03 Room Temperature Cure High Conductivity Silver Epoxy Adhesive
TRA-DUCT 916H03 is recommended for electronic bonding and sealing applications that require the combination of high conductivity coupled with good mechanical properties. This two part smooth paste s..
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| Cure Time |
1440
min <br>@Temperature 23.0 °C
|
24.0
hour <br>@Temperature 73.4 °F
|
|
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Master Bond EP30-2 Low Outgassing, Low Viscosity Two Component Epoxy
Master Bond Polymer System EP30-2 is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly a..
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| Cure Time |
1440
min <br>@Temperature 23.9 °C
|
24.0
hour <br>@Temperature 75.0 °F
|
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Master Bond EP30ND Non-Drip, Dimensionally Stable Epoxy Adhesive
Description: Master Bond Polymer System EP30ND is a high viscosity, two component epoxy adhesive/sealant with a paste consistency. It will cure at room temperature or more rapidly at elevated temper..
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| Cure Time |
1440
min <br>@Temperature 25.0 °C
|
24.0
hour <br>@Temperature 77.0 °F
|
|
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Tra-Con Tra-Bond F109 Fiber Optic Epoxy Adhesive
TRA-BOND F109 is specially designed to be used in fiber optic connectors where connections must be made in high humidity environments. This two part, low viscosity epoxy remains at a constant viscos..
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| Cure Time |
1440
min <br>@Temperature 32.0 °C
|
24.0
hour <br>@Temperature 89.6 °F
|
Overcoat End |
|
Chesterton ARC PW Potable Water Coating
Description: ARC PW is a 100% solids lining certified for NSF/ANSI 61 potable water, cold water service. It is recommended to be applied by brush, roll or spray at 500-750 microns (20-30 mils) total..
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| Cure Time |
1440
min <br>@Temperature 25.0 °C
|
24.0
hour <br>@Temperature 77.0 °F
|
Full Load |
|
Chesterton MRS S2 Metal Rebuilding System
An advanced ceramic composite for the resurfacing and protection of all metal surfaces. It is normally applied at a thickness of 250 microns (10 mils) per coat. Non-shrinking, 100% solids. MRS S2 is..
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| Cure Time |
1440
min <br>@Temperature 23.0 °C
|
24.0
hour <br>@Temperature 73.4 °F
|
|
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Epoxy Technology EPO-TEK® 302-3M Optically Transparent Epoxy
Product Description: EPO-TEK® 302-3M is a two component epoxy used for optical, medical, fiber optic, and semiconductor applications. The epoxy is good for adhesive joining, sealing, potting, or as..
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| Cure Time |
1440
min <br>@Temperature 23.0 °C
|
24.0
hour <br>@Temperature 73.4 °F
|
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Epoxy Technology EPO-TEK® 305 Spectrally Transparent Epoxy
Product Description: EPO-TEK® 305 is a two component, semi-rigid, optical grade epoxy for semiconductor packaging of fiber optics, optoelectronics and medical devices. It is an electrically and th..
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| Cure Time |
1440
min <br>@Temperature 23.0 °C
|
24.0
hour <br>@Temperature 73.4 °F
|
minimum |
|
Epoxy Technology EPO-TEK® 731 Epoxy Adhesive
Material Description: A two component, thixotropic, room temperature-curing epoxy adhesive. It is an electrically and thermally insulating epoxy designed for general applications in semiconductor p..
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| Cure Time |
1440
min <br>@Temperature 25.0 °C
|
24.0
hour <br>@Temperature 77.0 °F
|
|
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Epoxyset Epoxibond EB-301 Low Expansion Epoxy Adhesive
EB-301 is a highly filled, low expansion, epoxy adhesive. This low out-gassing adhesive exhibits excellent wettability without preheating metal bonding surfaces and has a good dimensional stability ..
|
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| Cure Time |
1440
min <br>@Temperature 25.0 °C
|
24.0
hour <br>@Temperature 77.0 °F
|
|
|
Atom Adhesives AA-BOND 2113 Epoxy Adhesive
AA-BOND 2113 is a clear, low viscosity epoxy adhesive system that contains no solvents, cures at room temperature, has excellent flow ability and wetting characteristics, and adheres strongly to gla..
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| Cure Time |
1440
min <br>@Temperature 25.0 °C
|
24.0
hour <br>@Temperature 77.0 °F
|
|
|
Atom Adhesives AA-BOND 428 Epoxy Adhesive
AA-BOND 428 is a two part, heat-resistant and low exotherm, epoxy adhesive formulation. It is a 100% solid epoxy adhesive, with superior chemical resistance and shear strength. AA-BOND 428 contains ..
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| Cure Time |
1440
min <br>@Temperature 25.0 °C
|
24.0
hour <br>@Temperature 77.0 °F
|
|
|
Atom Adhesives AA-DUCT 2919 Epoxy Adhesive
AA-DUCT 2919 is a non-bleeding, electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require good flexibility coupled w..
|
|||
| Cure Time |
1440
min <br>@Temperature 25.0 °C
|
24.0
hour <br>@Temperature 77.0 °F
|
|
|
Atom Adhesives AA-BOND F110 Epoxy Adhesive
AA-BOND F110 is a rigid, optically clear adhesive with a very low viscosity. AA-BOND F110 is room temperature system an excellent choice for thin bond-line assembly and repair applications of prisms..
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| Cure Time |
1440
-
2880
min <br>@Temperature 79.4 °C
|
24.0
-
48.0
hour <br>@Temperature 175 °F
|
recommended cure |
|
Aremco Aremco-Bond™ 2320 High Performance Epoxide
Toughened, Unfilled, Fast-Setting, BPA Free, 2:1, High Peel & Shear Strength
|
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| Cure Time |
1440
min <br>@Temperature 22.0 °C
|
24.0
hour <br>@Temperature 71.6 °F
|
50% RH; Full Cure |
|
Parker Chomerics CHO-FORM 5528 Conductive Form-In-Place Gaskets
Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material..
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| Cure Time |
1440
min <br>@Temperature 23.0 °C
|
24.0
hour <br>@Temperature 73.4 °F
|
Stainless steel, working strength |
|
Permabond MH052 Anaerobic Threadsealant
Permabond® MH052 is ideal for the sealing of threaded joints. It is approved for use with natural gas and LPG for working pressure up to 20 bar (290 psi) and also for gaseous oxygen up to 10 bar (1..
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| Cure Time |
1440
min <br>@Temperature 43.0 °C
|
24.0
hour <br>@Temperature 109 °F
|
Full Chemical |
|
Chesterton MRS 58 Metal Rebuilding System
An advanced ceramic composite for the repair and protection of all metal surfaces subjected to erosion, corrosion and chemical attack. It is normally applied at a thickness of 1.5 mm (60 mils) or mo..
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