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Polymer Property : Cure Time = 24.0 hour Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
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| NextGen Adhesives P907-03 Fiber Optic Adhesive Description: NGAC P907-03 is a low viscosity and room temperature curing adhesive specifically formulated for fiber optic terminations.Advantages and Applications: Uses include the termination of si.. |
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| Cure Time | 1440 min @Temperature 23.0 °C |
24.0 hour @Temperature 73.4 °F |
M10 steel, full strength |
| Permabond HM118 Anaerobic Threadlocker Permabond® HM118 Threadlocker is an excellent general-purpose threadlocker and sealant. It is used for locking bolts, nuts and screws that require permanent assembly. Cure is fast and reliable on s.. |
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| Cure Time | 1440 min @Temperature 23.0 °C |
24.0 hour @Temperature 73.4 °F |
Zinc, working strength |
| Permabond LH050P Pure Anaerobic Threadsealant PERMABOND® LH050 PURE anaerobic pipe sealant is single component paste that cures only when in contact with metal parts and oxygen is excluded. The sealant fills up the entire space between male an.. |
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| Cure Time | 1440 - 2880 min @Temperature 25.0 °C |
24.0 - 48.0 hour @Temperature 77.0 °F |
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| Resinlab® EP1390 Medium Viscosity, Self Extinguishing Flame Retardant Epoxy Casting Resin System Resinlab™ EP1390 is a RoHS compliant, medium viscosity, self extinguishing flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Labor.. |
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| Cure Time | 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
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| NextGen Adhesives G907-21 Structural Epoxy Adhesive Description: NGAC G907-21 is a high viscosity and thixotropic adhesive system that is specifically formulated for structural bonding applications: industrial, electronics and aerospace.Advantages an.. |
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| Cure Time | 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
Initial |
| Lord Adhesives Thermosetâ„¢ UR-329 Two Component Urethane Potting Compound Lord UR-329 is a flexible, two-component, room temperature curing, urethane, encapsulating compound. UR-329 maintains low hardness and modulus over a wide temperature range, which imparts minimal st.. |
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| Cure Time | 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
Through, 50% RH |
| Momentive Performance Materials N-Sil® RTV122 Silicone Modified Alkoxy Adhesive Sealants, White N-Sil® adhesive sealants are one-component, ready-to-use, and cure to a tough, resilient silicone rubber on exposure to atmospheric moisture at room temperature.Key Performance Properties: Primer.. |
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| Cure Time | 1440 - 2880 min @Temperature 23.9 °C |
24.0 - 48.0 hour @Temperature 75.0 °F |
|
| Master Bond EP76M-F Electrically Conductive, Two Part Epoxy Description: Master Bond EP76M-F is a two component, nickel filled, electrically conductive epoxy system for high performance bonding, sealing, and coating formulated to cure at room temperature or .. |
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| Cure Time | 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
|
| Tra-Con Tra-Bond 2123 Metal Repair Steel/Epoxy Adhesive TRA-BOND 2123 is a versatile steel metal/epoxy adhesive formulation developed for modern industrial repair, casting and bonding applications where a steel-like or cast iron finish is required. This .. |
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| Cure Time | 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
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| Tra-Con Tra-Bond FDA22BK01 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-22BK01 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance. This two-part black adhesive is easily mixed, used and cured at .. |
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| Cure Time | 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
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| Tra-Con Tra-Cast 3103 General Purpose Epoxy Casting Compound TRA-CAST 3103 is a low viscosity two-part formulation recommended for general purpose electrical potting and encapsulating application where the combination of good mechanical thermal and electrical.. |
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| Cure Time | 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
|
| Tra-Con Tra-Duct 916H04 Room Temperature Cure, Conductive Silver Epoxy Adhesive TRA-DUCT 916H04 is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical pr.. |
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| Cure Time | 1440 min @Temperature 65.0 °C |
24.0 hour @Temperature 149 °F |
|
| Tra-Con Tra-Duct 921M01 Low Viscosity Long Pot Life Silver-Filled Epoxy TRA-DUCT 921M01 is a two component, silver-filled electrically conductive epoxy adhesive designed for applications which require electrical conductivity and a long pot life at a relatively low heat .. |
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| Cure Time | 1440 min @Temperature 16.0 °C |
24.0 hour @Temperature 60.8 °F |
Light Load |
| Chesterton ARC 897 Fine Grade Sliding Wear Compound Description: ARC 897 is an advanced ceramic reinforced composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is applied at a t.. |
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| Cure Time | 1440 min @Temperature 43.0 °C |
24.0 hour @Temperature 109 °F |
Full Chemical |
| Chesterton ARC 897 Fine Grade Sliding Wear Compound Description: ARC 897 is an advanced ceramic reinforced composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is applied at a t.. |
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| Cure Time | 1440 min @Temperature 23.0 °C |
24.0 hour @Temperature 73.4 °F |
|
| Epoxy Technology EPO-TEK® 301 Spectrally Transparent Epoxy Product Description: EPO-TEK® 301 is a two component, room temperature curing epoxy featuring very low viscosity, and excellent optical-mechanical properties.Advantages & Application Notes: Semicon.. |
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| Cure Time | 1440 min @Temperature 23.0 °C |
24.0 hour @Temperature 73.4 °F |
|
| Epoxy Technology EPO-TEK® 320NC Optically Opaque Epoxy Material Description: A two component, black-colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a modific.. |
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| Cure Time | 1440 min @Temperature 23.0 °C |
24.0 hour @Temperature 73.4 °F |
minimum |
| Epoxy Technology EPO-TEK® 731 Epoxy Adhesive Material Description: A two component, thixotropic, room temperature-curing epoxy adhesive. It is an electrically and thermally insulating epoxy designed for general applications in semiconductor p.. |
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| Cure Time | 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
|
| Epoxyset Epoxibond EB-135 Unfilled Epoxy Adhesive A two-component, unfilled epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries. EB-135 has excellent bond strength to various substrat.. |
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| Cure Time | >= 1440 min @Temperature 22.0 - 30.0 °C |
>= 24.0 hour @Temperature 71.6 - 86.0 °F |
|
| Abatron AboWeld 8505-1 A/B Silver-Filled Electrically Conductive Epoxy Compound AboWeld 8505-1 A/B is a solventless silver-epoxy adhesive and resurfacer. It has high rigidity, chemical and heat resistance. It also has good adhesion to most rigid materials. |
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| Cure Time | 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
|
| Atom Adhesives AA-BOND F123BK Epoxy Adhesive AA-BOND F123BK is a low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating single or mul.. |
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| Cure Time | 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
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| Atom Adhesives AA-BOND FDA2 Epoxy Adhesive AA-BOND FDA2 is a medium viscosity epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and recei.. |
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| Cure Time | 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
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| Atom Adhesives AA-BOND F125 Epoxy Adhesive AA-BOND F125 is a 8 minutes gelling epoxy recommended for use in fiber optic connectors, optical and industrial bonding applications. AA-BOND F125 is clear, two part system is easily mixed and used .. |
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| Cure Time | 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
|
| Atom Adhesives AA-DUCT 906 Epoxy Adhesive AA-DUCT 906 represents the newest technology since the introduction of electrically conductive silver compounds. This unique formulation is based on a silver coated ceramic that results in lower mat.. |
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| Cure Time | 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
|
| Tra-Con Tra-Bond 2130 Medium Viscosity Epoxy Adhesive TRA-BOND 2130 is a clear, near transparent, medium viscosity epoxy adhesive formulation developed for rigid laminating, sealing and bonding applications where the combination of good wetting plus im.. |
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| Cure Time | 1440 - 4320 min @Temperature 25.0 °C |
24.0 - 72.0 hour @Temperature 77.0 °F |
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| Resinlab® EP1056LC Urethane Modified Epoxy Adhesive Resinlab™ EP1056LC is a two part urethane modified epoxy adhesive designed to give good adhesion to metals and hard to bond surfaces such as PVC. It is thixotropic to provide good gap filling abili.. |
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