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- Polymer Property : Cure Time = 180 min
Polymer Property : Cure Time = 180 min Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 60.0 - 180 min @Temperature 23.0 °C |
1.00 - 3.00 hour @Temperature 73.4 °F |
M10 steel, working strength |
| Permabond HM128 Anaerobic Threadlocker Permabond® HM128 Threadlocker is a high strength adhesive for permanent assembly. It is typically used for preventing vibration loosening of bolts, studs and cap screws. Full cure to a cross-linked.. |
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| Cure Time | 120 - 180 min @Temperature 25.0 °C |
2.00 - 3.00 hour @Temperature 77.0 °F |
Tack Free; 50% relative humidity |
| Lord Adhesives Aeroglaze® Z307 Absorptive Conductive Polyurethane Aeroglaze® Z307 black absorptive conductive polyurethane coating is primarily for application to substrates used on spacecraft. These applications include those where coatings must exhibit low ou.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
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| Master Bond EP21ANHT Two Component, Room Temperature Curing Epoxy Adhesive Product Description: Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that combines high thermal conductivity and electrical insulation .. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
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| Master Bond EP21LVMed Two Component, Low Viscosity USP Class VI Epoxy Master Bond EP21LVMed is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room tempera.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
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| Master Bond EP21SC-1 Two Component Epoxy Resin System Product Description: Master Bond Polymer System EP21SC-1 is a two component epoxy system featuring abrasion resistance. This high performance compound utilizes silicon carbide as a filler material a.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
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| Master Bond EP21TDC-2ND Two component, highly flexibilized, non-drip epoxy resin compound Product Description: Master Bond EP21TDC-2ND is a two component highly flexible epoxy resin system for high performance bonding, sealing and coating with a non-drip consistency. It has a forgiving o.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP21TDCHT-LO Room Temperature Curing, Toughened Two Component Epoxy Master Bond Polymer Adhesive EP21TDCHT-LO is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one .. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP30DPMed USP Class VI, Two Component Epoxy Urethane System Master Bond Polymer System EP30DPMED is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding,.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP41S-1HT Solvent Resistant Adhesive, Sealant and Coating Description: Master Bond EP41S-1HT is a two component epoxy resin system for high performance bonding, sealing, coating and encapsulating. It has a 100 to 30 mix ratio by weight and is formulated to.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP41S-1HTND Non-Drip, High Performance Epoxy Adhesive Description: Master Bond EP41S-1HTND is a two component epoxy resin system for high performance bonding, sealing and coating. It has a 100 to 30 mix ratio by weight and its viscosity is a smooth pas.. |
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| Cure Time | 120 - 180 min @Temperature 177 - 204 °C |
2.00 - 3.00 hour @Temperature 350 - 400 °F |
Post cure (recommended for optimal properties) |
| Master Bond Ep46HT-2 Two Component, Heat Resistant Epoxy System Master Bond Polymer System EP46HT-2 is a two component epoxy system for bonding, sealing and casting applications where resistance to temperatures from -100°F to +500°F is required. It is 100% rea.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond MasterSil 153Med Silicone Paste for Medical Applications Description: Master Bond MasterSil 153Med is a two component silicone compound with a paste consistency for high performance bonding and sealing. It can be used for medical device applications as it.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP21CLV Two Component Epoxy System Product Description: Master Bond EP21CLV is a two component, lower viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting. It features easy handling a.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP21FL Flexibilized and Toughened Low Viscosity Epoxy Master Bond Polymer System EP21FL is a lower viscosity, two component, flexibilized epoxy resin system for high performance bonding, coating, sealing and encapsulating. It is formulated to cure at r.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP30DP Abrasion Resistant Cryogenic Epoxy Urethane System Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, se.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP42HT-2 Epoxy Adhesive Resists Sterilization Description: Master Bond Polymer System EP42HT-2 is a room temperature curable, two component epoxy adhesive, sealant, coating and casting material featuring high temperature resistance along with o.. |
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| Cure Time | 120 - 180 min @Temperature 150 - 160 °C |
2.00 - 3.00 hour @Temperature 302 - 320 °F |
|
| Abatron AboCast/AboCure 8502-1 Epoxy AboCast/AboCure 8502-1 is a solventless clear Epoxy System, used as a casting, adhesive, and impregnating resin for transformers, capacitors, coils, and other electronic components requiring a low-v.. |
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| Cure Time | 30.0 - 180 min @Temperature 50.0 - 100 °C |
0.500 - 3.00 hour @Temperature 122 - 212 °F |
|
| Abatron AboCoat 8709-8/AboCure 50-12 Nickel-Filled Electrically Conductive Epoxy Compound AboCoat 8709-8/AboCure 50-12 is a versatile nickel-epoxy conductive coating. |
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| Cure Time | 120 - 180 min @Temperature 121 °C |
2.00 - 3.00 hour @Temperature 250 °F |
|
| Abatron AboWeld 8708-8 One-Component Structural/Dielectric Epoxy AboWeld 8708-8 is a highly filled, class H (180°C) structural, heat-conductive adhesive paste for FAST high-temperature curing. Suggested Uses: Structural bonding; Casting; Potting; Encapsulating;.. |
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| Cure Time | 30.0 - 180 min @Temperature 50.0 - 100 °C |
0.500 - 3.00 hour @Temperature 122 - 212 °F |
Optional |
| Abatron 8509-1 A/B Carbon-Filled Electrically Conductive Epoxy Compound 8509-1 A/B is a solventless carbon-epoxy system used as an adhesive and silk-screening material with anti-static and other lower-conductivity requirements. |
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| Cure Time | 30.0 - 180 min @Temperature 50.0 - 100 °C |
0.500 - 3.00 hour @Temperature 122 - 212 °F |
Optional |
| Abatron 8509-4 A/B Carbon-Filled Electrically Conductive Epoxy Compound 8509-4 A/B is a solventless carbon-epoxy system used as an adhesive and silk-screening material with anti-static and other lower-conductivity requirements. |
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| Cure Time | 120 - 180 min @Temperature 100 °C |
2.00 - 3.00 hour @Temperature 212 °F |
|
| Abatron AboCast 8103-20 High-Performance Dielectric Epoxy AboCast 8103-20 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system is unique .. |
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| Cure Time | 120 - 180 min @Temperature 100 °C |
2.00 - 3.00 hour @Temperature 212 °F |
|
| Abatron AboCast 8103-23 High-Performance Dielectric Epoxy AboCast 8103-23 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system has a comb.. |
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| Cure Time | 120 - 180 min @Temperature 100 °C |
2.00 - 3.00 hour @Temperature 212 °F |
|
| Abatron AboCast 8103-25 High-Performance Dielectric Epoxy AboCast 8103-25 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system combines o.. |
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| Cure Time | 120 - 180 min @Temperature 121 °C |
2.00 - 3.00 hour @Temperature 250 °F |
|
| Abatron AboCast 8708-10 One-Component Structural/Dielectric Epoxy AboCast 8708-10 is a highly filled, class H (180°C) structural, castable adhesive compound for FAST high-temperature curing. Suggested Uses: Structural bonding; Casting; Potting; Encapsulating; Em.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP21TDC-2LO Two component, highly flexibilized epoxy resin compound Product Description: Master Bond Polymer System EP21TDC-2LO is a two component, highly flexible epoxy resin compound for high performance bonding, sealing, coating, and encapsulation. It is formulat.. |
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| Cure Time | 60.0 - 180 min @Temperature 80.0 - 110 °C |
1.00 - 3.00 hour @Temperature 176 - 230 °F |
|
| Abatron AboCast/AboCure 7606-1 Epoxy AboCast 7606-1 is a transparent, light amber resin with a weight of 9.5 lbs/gallon and a viscosity of 2100 cps approx. @ 25°C. AboCure 7606-1 is a transparent, light amber converter with a weight o.. |
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| Cure Time | 120 - 180 min @Temperature 100 °C |
2.00 - 3.00 hour @Temperature 212 °F |
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| Master Bond EP42HT-2LO Low Outgassing, Heat Resistant Two Component Epoxy Master Bond Polymer System EP42HT-2LO is a room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring high temperature resistance along with outstanding .. |
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