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Master Bond EP21TDC-2LO Two component, highly flexibilized epoxy resin compound

Category Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer Master Bond Inc.
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP21TDC-2LO Two component, highly flexibilized epoxy resin compound.pdf
Price EMAIL US    sales@lookpolymers.com
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Material Notes:
Product Description: Master Bond Polymer System EP21TDC-2LO is a two component, highly flexible epoxy resin compound for high performance bonding, sealing, coating, and encapsulation. It is formulated to cure fully at room temperature or more quickly at elevated temperatures with an easy to use one to three mixing ratio by weight. EP21TDC-2LO has good toughness and, unlike most flexibilized epoxies, it passes NASA low outgassing test criteria. The cured compound exhibits a high elongation (greater than 25%), good for a thermally conductive epoxy. EP21TDC-2LO produces very little heat after mixing, which allows for a long working life. This epoxy resin compound exhibits good tensile shear and peel strength for bonding and sealing many different substrates including metals, glass, ceramics, vulcanized rubber and many plastics. The cured epoxy is an excellent electrical insulator with good chemical resistance to water, fuels and many solvents. Its able to withstand thermal shock, thermal cycling and mechanical shock. It has a service temperature range of 4K to +250°F and has been successfully employed in a number of cryogenic applications. Master Bond EP21TDC-2LO is an exceptionally versatile system that offers the structural benefits of an epoxy, yet incorporates flexibility and very good thermal conductivity. It is widely used in the electronic, electro-optical and related industries. The color of Part A is white; Part B is off-white. Product Advantages: Convenient mixing: non-critical one to three mix ratio by weight Easy application: product spreads evenly and smoothly; long working life NASA low outgassing approved Versatile cure schedules: ambient temperature cures or fast elevated temperature cures High peel strength and elongation Excellent flexibility; exceptional thermal shock and chemical resistance Bonding properties on similar and dissimilar substrates, superb impact resistance High thermal conductivity combined with good electrical insulation properties Cryogenically serviceable down to 4KInformation provided by MasterBond®
Physical Properties Metric English Comments
Viscosity 35000 - 85000 cP
35000 - 85000 cP
Part A
300000 - 800000 cP
300000 - 800000 cP
Part B
Mechanical Properties Metric English Comments
Hardness, Shore D 30 - 40
30 - 40
Tensile Strength at Break >= 20.7 MPa

@Temperature 23.9 °C
>= 3000 psi

@Temperature 75.0 °F
Shear Strength >= 5.52 MPa
>= 800 psi
Al/Al, Tensile
Peel Strength >= 2.63 kN/m
>= 15.0 pli
T-peel
Thermal Properties Metric English Comments
CTE, linear 80.0 - 90.0 µm/m-°C
44.4 - 50.0 µin/in-°F
Thermal Conductivity 1.30 - 1.44 W/m-K
9.00 - 10.0 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 121 °C
250 °F
Minimum Service Temperature, Air -269 °C
-452 °F
Electrical Properties Metric English Comments
Volume Resistivity >= 1.00e+14 ohm-cm
>= 1.00e+14 ohm-cm
Processing Properties Metric English Comments
Cure Time 120 - 180 min

@Temperature 93.3 °C
2.00 - 3.00 hour

@Temperature 200 °F
2880 - 4320 min

@Temperature 23.9 °C
48.0 - 72.0 hour

@Temperature 75.0 °F
Pot Life >= 60 min
>= 60 min
100 gram mass
Descriptive Properties Value Comments
Mixing Ratio (A to B) 1:3
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