Master Bond EP21FL Flexibilized and Toughened Low Viscosity Epoxy

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer	Master Bond Inc.
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Master Bond EP21FL Flexibilized and Toughened Low Viscosity Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Master Bond Polymer System EP21FL is a lower viscosity, two component, flexibilized epoxy resin system for high performance bonding, coating, sealing and encapsulating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a four to one mix ratio by weight. This compound is 100% reactive and does not contain any solvents or volatiles. It bonds well to a variety of substrates, including metals, glass, ceramics and many plastics.

Physical Properties	Metric	English	Comments
Viscosity	3000 - 4000 cP @Temperature 23.0 °C	3000 - 4000 cP @Temperature 73.4 °F

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	121 °C	250 °F
Minimum Service Temperature, Air	-51.1 °C	-60.0 °F

Processing Properties	Metric	English	Comments
Cure Time	120 - 180 min @Temperature 93.3 °C	2.00 - 3.00 hour @Temperature 200 °F
	1440 - 2880 min @Temperature 23.0 °C	24.0 - 48.0 hour @Temperature 73.4 °F

Descriptive Properties	Value	Comments
Color Code	"A" Amber; "B" Amber
Mix Ratio By Weight	100/25
Set-Up Time, minutes	120-180	At Room Temperature

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