Master Bond EP21ANHT Two Component, Room Temperature Curing Epoxy Adhesive

Product Description: Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that combines high thermal conductivity and electrical insulation properties, along with elevated temperature resistance. It has a forgiving one to one mix ratio by weight or volume. Although the system cures at room temperature, its physical properties are optimized by a post cure at 150°F for 2-3 hours. EP21ANHT adheres well to a wide variety of substrates including metals glass and many plastics. Its tensile shear strength exceeds 1,100 psi, enabling it to be used in many applications where high strength bonds are required. Other features include superior dimensional stability and a long working life. EP21ANHT offers good resistance to a wide range of chemicals including water, oil, fuels, and various solvents over the temperature range of -60°F to +400°F. The color of Part A is light gray; Part B is gray in color. EP21ANHT is widely used in electronic, electrooptical and related industries where excellent heat transfer and electrical insulation are required. Product Advantages: Convenient mixing: non-critical equal weight or volume ratio. Long working life. Easy application: contact pressure only required for cure; adhesive spreads evenly.Low coefficient of expansion, low shrinkage, superb dimensional stability. Versatile cure schedules: ambient temperature cures or fast elevated temperature cures as required. High bonding strength to a wide variety of substrates. Good durability, thermal shock and chemical resistance. Great thermal conductivity; excellent electrical insulation properties.Information provided by MasterBond®