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Polymer Property : Cure Time = 30.0 min Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 30.0 min @Temperature 140 °C |
0.500 hour @Temperature 284 °F |
Handling Time |
| Parker Chomerics CHOFORM® 5513 Conductive Form-in-Place Gasket Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material.. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Zinc, handling strength |
| Permabond HH190 Anaerobic Gasketmaker Permabond® HH190 Gasketmaker is an anaerobic curing flange sealant that can replace, or be used as a dressing for, conventional pre-cut gaskets. Since HH190 is a flowable paste, it conforms to the .. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Brass, working strength |
| Permabond HM129 Anaerobic Threadlocker Permabond® HM129 is a high strength medium viscosity anaerobic threadlocker and sealant. This material cures in the absence of air between tight fitting metal parts. Cure is fast and reliable on st.. |
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| Cure Time | 30.0 min @Temperature 93.3 °C |
0.500 hour @Temperature 200 °F |
De-mold Time |
| Northstar Polymers MGG-A70DQ High Performance Polyurethane Cast Elastomer System 70A This is a PTMEG/MDI base high-performance polyurethane casting system. This system is recommended to applications in which the part requires high rebound, slide abrasion, constant water contact and.. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
M10 steel, working strength |
| Permabond MM115P Pure Anaerobic Threadlocker Permabond® MM115 PURE Threadlocker is an excellent general purpose threadlocker and sealant. It is used for locking metal bolts, nuts and screws that may require disassembly for service and mainten.. |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
|
| Lord Adhesives Thermosetâ„¢ ME-531 Underfill Encapsulant LORD Thermosetâ„¢ ME-531 encapsulant is a high purity, semiconductor grade epoxy underfill product developed for the encapsulation of flip chip devices. It is formulated to reduce warpage and wit.. |
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| Cure Time | 30.0 min @Temperature 25.0 °C |
0.500 hour @Temperature 77.0 °F |
Initial |
| Lord Adhesives Thermoset™ UR-322 Two Component Urethane Potting Compound Lord UR-322 is a two component, room temperature curing urethane potting compound. The cured elastomer is soft, flexible and has a very low modulus at temperatures down to -80°C. Cured UR-322 als.. |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
|
| Gwent Electronic Materials C2011009D1 Curable Silver Range This product is based on a unique curing process that results in the low temperature formation of a thermosetting conductive adhesive that combines good adhesion with excellent electrical properties.. |
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| Cure Time | 30.0 min @Temperature 180 °C |
0.500 hour @Temperature 356 °F |
|
| Gwent Electronic Materials C2030701D3 Solderable Silver Ink This product is based on a unique curing process that results in the low temperature formation of a thermosetting conductive adhesive that combines good adhesion and electrical conductivity with che.. |
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| Cure Time | 30.0 min @Temperature 80.0 °C |
0.500 hour @Temperature 176 °F |
|
| Gwent Electronic Materials C2050804D9 Platinum Polymer Ink Platinum Ink is a screen printable ink designed for printing working electrodes in electrochemical sensor applications. The ink is designed for curing on polymer substrates. Screen Printing Equipme.. |
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| Cure Time | 30.0 min @Temperature 60.0 °C |
0.500 hour @Temperature 140 °F |
|
| Gwent Electronic Materials C60531D1 Silver / Silver Chloride Paste C60531D1 has a ratio of Silver to Silver Chloride of 90/10. This is used for reference electrodes in Medical Diagnostics, Environmental Sensor and the "Agri-Food" Industries. It forms part of a fa.. |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
|
| Trelleborg Emerson & Cuming Eccobond® C429-2 One-Component Silver Filled Electrically Conductive Epoxy Adhesive Emerson & Cuming C429-2 Eccobond® One-Component Silver Filled Electrically Conductive Epoxy AdhesiveOne component, high strength, moderate cost, silver filled, electrically conductive, epoxy adhesi.. |
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| Cure Time | 30.0 min @Temperature 4.00 °C |
0.500 hour @Temperature 39.2 °F |
Tack Free |
| Chesterton ARC 5 Paste grade Rapid Cure Abrasion Control Description: ARC 5 is an advanced composite formulated for emergency repair and patching of metal components subject to light abrasive and corrosive conditions. It can be used to seal leaks and patc.. |
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| Cure Time | 30.0 min @Temperature 43.0 °C |
0.500 hour @Temperature 109 °F |
Tack Free |
| Chesterton ARC 858 Abrasion resistant rebuilding and faring composite An advanced ceramic composite for the repair and protection of all metal surfaces subjected to erosion, corrosion and chemical attack. It is normally applied at a thickness of 0.15 mm (60 mils) or m.. |
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| Cure Time | 30.0 min @Temperature 80.0 °C |
0.500 hour @Temperature 176 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® 330 Low Viscosity, Optical Epoxy Product Description: EPO-TEK® 330 is a two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications.Advan.. |
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| Cure Time | 30.0 min @Temperature 80.0 °C |
0.500 hour @Temperature 176 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® 353ND-T1 High Temperature Thixotropic Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed for fiber optic, electronics and medical applications. It is a more viscous alternative to EPO-TEK® 353ND-T.I.. |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
|
| Epoxyset Epoxibond EB-115 Unfilled Epoxy Adhesive A two-component, unfilled, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc... |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
|
| Epoxyset Epoxibond EB-119SP Unfilled Epoxy Adhesive A two-component, unfilled, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc... |
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| Cure Time | 30.0 - 180 min @Temperature 50.0 - 100 °C |
0.500 - 3.00 hour @Temperature 122 - 212 °F |
|
| Abatron AboCoat 8709-8/AboCure 50-12 Nickel-Filled Electrically Conductive Epoxy Compound AboCoat 8709-8/AboCure 50-12 is a versatile nickel-epoxy conductive coating. |
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| Cure Time | 30.0 - 180 min @Temperature 50.0 - 100 °C |
0.500 - 3.00 hour @Temperature 122 - 212 °F |
Optional |
| Abatron AboWeld 8505-1 A/B Silver-Filled Electrically Conductive Epoxy Compound AboWeld 8505-1 A/B is a solventless silver-epoxy adhesive and resurfacer. It has high rigidity, chemical and heat resistance. It also has good adhesion to most rigid materials. |
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| Cure Time | 30.0 min @Temperature 75.0 °C |
0.500 hour @Temperature 167 °F |
Dry to handle, at 50% humidity and 75°C |
| Blue River Coatings Primer Sealer-PSWP BLUE RIVER COATINGS PRIMER SEALER-PSWP is a high quality, single component primer formulated specifically for priming wood, vinyl, and most plastic substrates. Performance obtained is equal or super.. |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
Handling Time |
| Parker Chomerics CHOFORM® 5560 Conductive Form-in-Place Gasket Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material.. |
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| Cure Time | 30.0 - 180 min @Temperature 50.0 - 100 °C |
0.500 - 3.00 hour @Temperature 122 - 212 °F |
Optional |
| Abatron 8602-2 A/B Carbon-Filled Electrically Conductive Epoxy Compound 8602-2 A/B is a solventless carbon-epoxy system used as an adhesive and silk-screening material with anti-static and other lower-conductivity requirements. |
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| Cure Time | 30.0 min @Temperature 60.0 °C |
0.500 hour @Temperature 140 °F |
|
| Gwent Electronic Materials C2030519P5 Carbon Graphite Ink This Carbon Graphite Ink is designed to be used for screen printing working electrodes. These electrodes when used in conjunction with NAD+/NADH dependent dehydrogenase enzymes, enable the detection.. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Brass, working strength |
| Permabond A136 Anaerobic Gasketmaker Permabond® A136 is an anaerobic material designed for making 'formed in situ' gaskets between metal surfaces. It is capable of replacing a wide range of conventional gaskets thereby offering potent.. |
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