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Polymer Property : Cure Time = 30.0 min Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 30.0 min @Temperature 100 °C |
0.500 hour @Temperature 212 °F |
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| Parker Chomerics CHO-BOND 592 Conductive Epoxy Highly conductive silver-filled epoxy adhesive which combines the best properties of metals and organics. This two-component system is unique in that it combines long pot life, good electrical condu.. |
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| Cure Time | 30.0 min @Temperature 100 °C |
0.500 hour @Temperature 212 °F |
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| Parker Chomerics CHO-BOND® 592 Conductive Adhesive Description: CHO-BOND® 500 Series Adhesive/Sealant Compounds; These pure silver-filled materials are used where tight tolerances require thin bond lines. Various cure cycles are available, and the .. |
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| Cure Time | 30.0 min @Temperature 65.0 °C |
0.500 hour @Temperature 149 °F |
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| Resin Technology Group 1109-DP Oxy-Bond™ Two-Component Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma.. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Brass, working strength |
| Permabond F202 Anaerobic Retainer The unique 'toughening' process incorporated into Permabond® F202 gives this anaerobic adhesive excellent resistance to peel and impact forces. Primarily designed for use on metal surfaces, it is a.. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Zinc, handling strength |
| Permabond HH120 Anaerobic Threadlocker Permabond® HH120 Threadlocker is an excellent general purpose threadlocker and sealant. It is used for locking bolts, nuts and screws that require permanent assembly. Its high viscosity allows for .. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Zinc, handling strength |
| Permabond HH131 High Temperature Threadlocker Permabond® HH131 is a very high temperature resistant, high strength anaerobic threadlocker and sealant. This material cures in the absence of air between tight fitting metal parts. It is used for .. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Brass, working strength |
| Permabond HM129 Anaerobic Threadlocker Permabond® HM129 is a high strength medium viscosity anaerobic threadlocker and sealant. This material cures in the absence of air between tight fitting metal parts. Cure is fast and reliable on st.. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Brass, working strength |
| Permabond MM115 Anaerobic Threadlocker Permabond® MM115 Threadlocker is an excellent general purpose threadlocker and sealant. It is used for locking metal bolts, nuts and screws that may require disassembly for service and maintenance... |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Brass, working strength |
| Permabond MM115P Pure Anaerobic Threadlocker Permabond® MM115 PURE Threadlocker is an excellent general purpose threadlocker and sealant. It is used for locking metal bolts, nuts and screws that may require disassembly for service and mainten.. |
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| Cure Time | 30.0 min @Temperature 60.0 °C |
0.500 hour @Temperature 140 °F |
|
| Gwent Electronic Materials C2000215D3 Silver / Silver Chloride Paste C2000215D3 has a ratio of Silver to Silver Chloride of 80/20. This is used for reference electrodes in Medical Diagnostics, Environmental Sensor and the "Agri-Food" Industries. It forms part of a .. |
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| Cure Time | 30.0 min @Temperature 80.0 °C |
0.500 hour @Temperature 176 °F |
|
| Gwent Electronic Materials C2050804D9 Platinum Polymer Ink Platinum Ink is a screen printable ink designed for printing working electrodes in electrochemical sensor applications. The ink is designed for curing on polymer substrates. Screen Printing Equipme.. |
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| Cure Time | 30.0 min @Temperature 60.0 °C |
0.500 hour @Temperature 140 °F |
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| Gwent Electronic Materials C2090225D7 Silver/Silver Chloride Paste Silver/Silver Chloride Paste has a ratio of Silver to Silver Chloride of 70/30. The paste is in a ready to use form at a viscosity suitable for automatic or semi-automatic screen printing. The paste.. |
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| Cure Time | 30.0 min @Temperature 80.0 °C |
0.500 hour @Temperature 176 °F |
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| Gwent Electronic Materials D2070412D3 Polymer Dielectric Green colored screen printable polymer dielectric, suitable for defining electrode areas and forms a protective layer over the electrode tracking during immersion of the electrode. The formulation .. |
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| Cure Time | 30.0 min @Temperature 75.0 °C |
0.500 hour @Temperature 167 °F |
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| Tra-Con Tra-Bond 868-3N1 Room Temperature Cure Adhesive TRA-BOND 868-3N1 room temperature cure adhesive provides strong bonds to difficult-to-bond metals, such as gold, silver, copper, brass, and solder.Information provided by Tra-Con Inc. |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
|
| Trelleborg Emerson & Cuming Eccobond® C429-2 One-Component Silver Filled Electrically Conductive Epoxy Adhesive Emerson & Cuming C429-2 Eccobond® One-Component Silver Filled Electrically Conductive Epoxy AdhesiveOne component, high strength, moderate cost, silver filled, electrically conductive, epoxy adhesi.. |
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| Cure Time | 30.0 min @Temperature 43.0 °C |
0.500 hour @Temperature 109 °F |
Tack Free |
| Chesterton ARC BX1 Sliding Wear Compound Description: An advanced contractor grade ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is normally applied at.. |
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| Cure Time | 30.0 min @Temperature 80.0 °C |
0.500 hour @Temperature 176 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® 353ND-T Black High Temperature Thixotropic Epoxy Product Description: EPO-TEK® 353ND-T Black is a two component, high temperature, thixotropic epoxy for fiber optic, PCB and various medical applications. Advantages & Application Notes: This produ.. |
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| Cure Time | 30.0 min @Temperature 80.0 °C |
0.500 hour @Temperature 176 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® 353ND-T4 Thixotropic Epoxy Product Description: EPO-TEK® 353ND-T4 is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. This is a higher viscosity version of EPO-TEK® 353.. |
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| Cure Time | 30.0 min @Temperature 80.0 °C |
0.500 hour @Temperature 176 °F |
Pre-Bake, Minimum Bond Line |
| Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.Advantages & Appl.. |
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| Cure Time | 30.0 min @Temperature 43.0 °C |
0.500 hour @Temperature 109 °F |
Full Load |
| Chesterton ARC MX5 Rapid Curing Fine Particle Wear Compound Description: An advanced ceramic reinforced composite for the emergency repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is applied at a th.. |
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| Cure Time | 30.0 min @Temperature 4.00 °C |
0.500 hour @Temperature 39.2 °F |
Tack Free |
| Chesterton MRS 5 Metal Rebuilding System MRS 5 is an advanced composite formulated for emergency repair and patching of metal components subject to light abrasive and corrosive conditions. It can be used to seal leaks and patch holes as we.. |
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| Cure Time | 30.0 min @Temperature 177 °C |
0.500 hour @Temperature 350 °F |
Recommended Cure Cycle |
| Arlon 30400R040 0.04" Uncured, Unsupported Silicone Rubber on Release Carrier Design/Construction:Side 1: Uncured, Unsupported Silicone RubberSubstrate: Kodacel CarrierInterleave: 0.003" PolyethyleneThis data represents typical values for the production material and should.. |
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| Cure Time | 30.0 min @Temperature 177 °C |
0.500 hour @Temperature 350 °F |
Recommended Cure Cycle |
| Arlon 55531R060 0.061" (1.55 mm) Uncured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Uncured Silicone RubberSide 2: Uncured Silicone Rubber Appearance: Red silicone gum on fiberglass clothThis data Represents typical values for the production material. Th.. |
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| Cure Time | 30.0 - 180 min @Temperature 50.0 - 100 °C |
0.500 - 3.00 hour @Temperature 122 - 212 °F |
Optional |
| Abatron 8509-3 A/B Carbon-Filled Electrically Conductive Epoxy Compound 8509-3 A/B is a solventless carbon-epoxy system used as an adhesive and silk-screening material with anti-static and other lower-conductivity requirements. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
M10 steel, working strength |
| Permabond A1046 Anaerobic Retainer Permabond® A1046 is a rapid curing adhesive designed to provide permanent locking and sealing of metal parts such as bearings, gears, pulleys and threaded components. It exhibits high strength and .. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Brass, working strength |
| Permabond A113 Anaerobic Threadlocker Designed for the locking and sealing of metal parts, Permabond® A113 is ideally suited for use on components that need to be dismantled for maintenance. Giving vibration resistance it can be used .. |
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