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Polymer Property : Cure Time = 30.0 min Product List

Processing Properties

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Processing Properties Metric English Comments
Cure Time 30.0 min

@Temperature 150 °C
0.500 hour

@Temperature 302 °F
Parker Chomerics CHO-BOND SV713 Conductive Epoxy
CHO-BOND® 700 Series Adhesives for Microelectronics Packaging; these pure silver-filled epoxy pastes are designed to meet the demanding requirements of semiconductor and microelectronic packaging. ..
Cure Time 30.0 min

@Temperature 140 °C
0.500 hour

@Temperature 284 °F
Handling Time
Parker Chomerics CHOFORM® 5513 Conductive Form-in-Place Gasket
Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material..
Cure Time 30.0 min

@Temperature 150 °C
0.500 hour

@Temperature 302 °F
Handling Time
Parker Chomerics CHOFORM® 5550 Conductive Form-in-Place Gasket
Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material..
Cure Time 30.0 - 40.2 min

@Temperature 43.3 °C
0.500 - 0.670 hour

@Temperature 110 °F
De-mold Time
Northstar Polymers VEF-41 Viscoelastic Foam Formulation
Viscoelastic foam has a very unique recovery property and very low compression deflection property. When the foam is compressed by a hand it can leave imprint of the hand, and then it slowly recove..
Cure Time 30.0 min

@Temperature 23.0 °C
0.500 hour

@Temperature 73.4 °F
M10 steel, working strength
Permabond HH120 Anaerobic Threadlocker
Permabond® HH120 Threadlocker is an excellent general purpose threadlocker and sealant. It is used for locking bolts, nuts and screws that require permanent assembly. Its high viscosity allows for ..
Cure Time 30.0 - 60.0 min

@Temperature 23.0 °C
0.500 - 1.00 hour

@Temperature 73.4 °F
brass, fixture time
Permabond LH056 Anaerobic Threadsealant
Permabond LH056 is a thread sealant designed for use in sealing metal pipes and fittings in sprinkler systems which may also contain CPVC piping. Permabond LH056 prevents leaks even on pipes that ar..
Cure Time 30.0 min

@Temperature 250 °C
0.500 hour

@Temperature 482 °F
Resin Technology Group TIGA 901 Room Temperature Curing Silver Conductive Epoxy
100 parts resin to 6 parts hardener. Cure 24 hours at 25°C, 1-4 hours at 65°C, 30-60 minutes at 125°C, or 30 minutes at 150°C.TIGA 901 is an electrically conductive, silver filled epoxy adhesiv..
Cure Time 30.0 min

@Temperature 25.0 °C
0.500 hour

@Temperature 77.0 °F
Initial
Lord Adhesives Thermosetâ„¢ UR-322 Two Component Urethane Potting Compound
Lord UR-322 is a two component, room temperature curing urethane potting compound. The cured elastomer is soft, flexible and has a very low modulus at temperatures down to -80°C. Cured UR-322 als..
Cure Time 30.0 min

@Temperature 60.0 °C
0.500 hour

@Temperature 140 °F
Gwent Electronic Materials C2000218D5 Silver/Silver Chloride Paste
Silver/Silver Chloride Paste has a ratio of Silver to Silver Chloride of 90/10. It is specifically designed to give good adhesion to ceramic substrates. Applications in medical diagnostics, environm..
Cure Time 30.0 min

@Temperature 60.0 °C
0.500 hour

@Temperature 140 °F
Gwent Electronic Materials C2050106D7 Carbon Graphite Ink
This Carbon Graphite Ink is designed to be used for screen printing working electrodes. This is an ink which has been optimized to give superior electrochemical performance. It gives excellent elec..
Cure Time 30.0 min

@Temperature 60.0 °C
0.500 hour

@Temperature 140 °F
Gwent Electronic Materials C2090225D7 Silver/Silver Chloride Paste
Silver/Silver Chloride Paste has a ratio of Silver to Silver Chloride of 70/30. The paste is in a ready to use form at a viscosity suitable for automatic or semi-automatic screen printing. The paste..
Cure Time 30.0 min

@Temperature 120 °C
0.500 hour

@Temperature 248 °F
Tra-Con Supertherm 826M01 High Performance Diamond Epoxy Adhesive
SUPERTHERM 826M01 is a one-part, smooth paste ULTRA HIGH THERMALLY CONDUCTIVE diamond filled epoxy adhesive recommended for semiconductor die-attach and other micro-electronic applications where the..
Cure Time 30.0 min

@Temperature 120 °C
0.500 hour

@Temperature 248 °F
Tra-Con Tra-Bond 342-13ACC Single Component Low Viscosity Epoxy Adhesive
TRA-BOND 342-13ACC single component, low viscosity epoxy adhesive exhibits high bond strength and excellent thermal shock characteristics. This adhesive may be cured at room temperature in 24 hours ..
Cure Time 30.0 min

@Temperature 120 °C
0.500 hour

@Temperature 248 °F
Minimum Bond Line
Epoxy Technology EPO-TEK® 354 High Temperature Epoxy
Product Description: EPO-TEK® 354 is a two component, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies. It is an electrically and thermally i..
Cure Time 30.0 min

@Temperature 80.0 °C
0.500 hour

@Temperature 176 °F
Pre-Bake, Minimum Bond Line
Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide
Product Description: EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.Advantages & Appl..
Cure Time 30.0 min

@Temperature 170 °C
0.500 hour

@Temperature 338 °F
Dow BETAMATE™ 1496 V Epoxy
BETAMATE™ 1496 V is a one component, epoxy based adhesive especially developed for the body shop. The product has the following properties: Good rheology performance (Wash-out resistant, excelle..
Cure Time 30.0 - 60.0 min

@Temperature 80.0 - 120 °C
0.500 - 1.00 hour

@Temperature 176 - 248 °F
Abatron AboCast 8005-6/AboCure 8005-6 Epoxy
AboCast 8005-6 is a tan, viscous filled liquid resin with a weight of approximately 11 lbs/gallon. AboCure 8005-6 is an amber, viscous liquid converter with a weight of approximately 10 lbs/gallon. ..
Cure Time 30.0 min

@Temperature 65.0 °C
0.500 hour

@Temperature 149 °F
Atom Adhesives AA-BOND 201 Epoxy Adhesive
AA-BOND 201 is an exceptional epoxy formulation recommended for lower temperature or wet industrial bonding applications where FAST CURING is required. AA-BOND 201 is versatile two-part epoxy system..
Cure Time 30.0 - 180 min

@Temperature 50.0 - 100 °C
0.500 - 3.00 hour

@Temperature 122 - 212 °F
Optional
Abatron 8509-3 A/B Carbon-Filled Electrically Conductive Epoxy Compound
8509-3 A/B is a solventless carbon-epoxy system used as an adhesive and silk-screening material with anti-static and other lower-conductivity requirements.
Cure Time 30.0 min

@Temperature 177 °C
0.500 hour

@Temperature 350 °F
Recommended Cure Cycle
Arlon R31551R030 0.030" (0.762 mm) Uncured Silicone Rubber with Fiberglass Substrate
Design/Construction:Side 1: Uncured Silicone Rubber Side 2: Uncured Silicone Rubber This data Represents typical values for the production material. The data should not be used to write, or in place..
Cure Time 30.0 min

@Temperature 204 °C
0.500 hour

@Temperature 400 °F
alternate cure
Aremco Aremco-Bond™ 2330 High Performance Epoxide
Single-Part, Heat Curable, Silicone Elastomer Adhesive
Cure Time 30.0 min

@Temperature 150 °C
0.500 hour

@Temperature 302 °F
Full Cure
Parker Chomerics CHO-FORM 5541 Conductive Form-In-Place Gaskets
Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material..
Cure Time 30.0 min

@Temperature 150 °C
0.500 hour

@Temperature 302 °F
Handling Time
Parker Chomerics CHOFORM® 5560 Conductive Form-in-Place Gasket
Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material..
Cure Time 30.0 min

@Temperature 23.0 °C
0.500 hour

@Temperature 73.4 °F
Brass, working strength
Permabond A011 Anaerobic Threadlocker
Permabond® A011 is an anaerobic adhesive designed for locking and sealing threaded or coaxially fitting metal parts where subsequent dismantling is required. Its controlled strength ensures fatigue..
Cure Time 30.0 min

@Temperature 23.0 °C
0.500 hour

@Temperature 73.4 °F
M10 steel, working strength
Permabond A1042 Anaerobic Threadlocker
Permabond® A1042 is a rapid curing adhesive designed to lock and seal metal parts that subsequently may need to be dismantled for maintenance. The high vibration resistance makes Permabond A1042 pa..
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