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Polymer Property : Cure Time = 30.0 min Product List

Processing Properties

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Processing Properties Metric English Comments
Cure Time 30.0 min

@Temperature 100 °C
0.500 hour

@Temperature 212 °F
Parker Chomerics CHO-BOND 592 Conductive Epoxy
Highly conductive silver-filled epoxy adhesive which combines the best properties of metals and organics. This two-component system is unique in that it combines long pot life, good electrical condu..
Cure Time 30.0 min

@Temperature 100 °C
0.500 hour

@Temperature 212 °F
Parker Chomerics CHO-BOND® 592 Conductive Adhesive
Description: CHO-BOND® 500 Series Adhesive/Sealant Compounds; These pure silver-filled materials are used where tight tolerances require thin bond lines. Various cure cycles are available, and the ..
Cure Time 30.0 min

@Temperature 65.0 °C
0.500 hour

@Temperature 149 °F
Resin Technology Group 1109-DP Oxy-Bond™ Two-Component Epoxy Adhesive
Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
Cure Time 30.0 min

@Temperature 23.0 °C
0.500 hour

@Temperature 73.4 °F
Brass, working strength
Permabond F202 Anaerobic Retainer
The unique 'toughening' process incorporated into Permabond® F202 gives this anaerobic adhesive excellent resistance to peel and impact forces. Primarily designed for use on metal surfaces, it is a..
Cure Time 30.0 min

@Temperature 23.0 °C
0.500 hour

@Temperature 73.4 °F
Zinc, handling strength
Permabond HH120 Anaerobic Threadlocker
Permabond® HH120 Threadlocker is an excellent general purpose threadlocker and sealant. It is used for locking bolts, nuts and screws that require permanent assembly. Its high viscosity allows for ..
Cure Time 30.0 min

@Temperature 23.0 °C
0.500 hour

@Temperature 73.4 °F
Zinc, handling strength
Permabond HH131 High Temperature Threadlocker
Permabond® HH131 is a very high temperature resistant, high strength anaerobic threadlocker and sealant. This material cures in the absence of air between tight fitting metal parts. It is used for ..
Cure Time 30.0 min

@Temperature 23.0 °C
0.500 hour

@Temperature 73.4 °F
Brass, working strength
Permabond HM129 Anaerobic Threadlocker
Permabond® HM129 is a high strength medium viscosity anaerobic threadlocker and sealant. This material cures in the absence of air between tight fitting metal parts. Cure is fast and reliable on st..
Cure Time 30.0 min

@Temperature 23.0 °C
0.500 hour

@Temperature 73.4 °F
Brass, working strength
Permabond MM115 Anaerobic Threadlocker
Permabond® MM115 Threadlocker is an excellent general purpose threadlocker and sealant. It is used for locking metal bolts, nuts and screws that may require disassembly for service and maintenance...
Cure Time 30.0 min

@Temperature 23.0 °C
0.500 hour

@Temperature 73.4 °F
Brass, working strength
Permabond MM115P Pure Anaerobic Threadlocker
Permabond® MM115 PURE Threadlocker is an excellent general purpose threadlocker and sealant. It is used for locking metal bolts, nuts and screws that may require disassembly for service and mainten..
Cure Time 30.0 min

@Temperature 60.0 °C
0.500 hour

@Temperature 140 °F
Gwent Electronic Materials C2000215D3 Silver / Silver Chloride Paste
C2000215D3 has a ratio of Silver to Silver Chloride of 80/20. This is used for reference electrodes in Medical Diagnostics, Environmental Sensor and the "Agri-Food" Industries. It forms part of a ..
Cure Time 30.0 min

@Temperature 80.0 °C
0.500 hour

@Temperature 176 °F
Gwent Electronic Materials C2050804D9 Platinum Polymer Ink
Platinum Ink is a screen printable ink designed for printing working electrodes in electrochemical sensor applications. The ink is designed for curing on polymer substrates. Screen Printing Equipme..
Cure Time 30.0 min

@Temperature 60.0 °C
0.500 hour

@Temperature 140 °F
Gwent Electronic Materials C2090225D7 Silver/Silver Chloride Paste
Silver/Silver Chloride Paste has a ratio of Silver to Silver Chloride of 70/30. The paste is in a ready to use form at a viscosity suitable for automatic or semi-automatic screen printing. The paste..
Cure Time 30.0 min

@Temperature 80.0 °C
0.500 hour

@Temperature 176 °F
Gwent Electronic Materials D2070412D3 Polymer Dielectric
Green colored screen printable polymer dielectric, suitable for defining electrode areas and forms a protective layer over the electrode tracking during immersion of the electrode. The formulation ..
Cure Time 30.0 min

@Temperature 75.0 °C
0.500 hour

@Temperature 167 °F
Tra-Con Tra-Bond 868-3N1 Room Temperature Cure Adhesive
TRA-BOND 868-3N1 room temperature cure adhesive provides strong bonds to difficult-to-bond metals, such as gold, silver, copper, brass, and solder.Information provided by Tra-Con Inc.
Cure Time 30.0 min

@Temperature 150 °C
0.500 hour

@Temperature 302 °F
Trelleborg Emerson & Cuming Eccobond® C429-2 One-Component Silver Filled Electrically Conductive Epoxy Adhesive
Emerson & Cuming C429-2 Eccobond® One-Component Silver Filled Electrically Conductive Epoxy AdhesiveOne component, high strength, moderate cost, silver filled, electrically conductive, epoxy adhesi..
Cure Time 30.0 min

@Temperature 43.0 °C
0.500 hour

@Temperature 109 °F
Tack Free
Chesterton ARC BX1 Sliding Wear Compound
Description: An advanced contractor grade ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is normally applied at..
Cure Time 30.0 min

@Temperature 80.0 °C
0.500 hour

@Temperature 176 °F
Minimum Bond Line
Epoxy Technology EPO-TEK® 353ND-T Black High Temperature Thixotropic Epoxy
Product Description: EPO-TEK® 353ND-T Black is a two component, high temperature, thixotropic epoxy for fiber optic, PCB and various medical applications. Advantages & Application Notes: This produ..
Cure Time 30.0 min

@Temperature 80.0 °C
0.500 hour

@Temperature 176 °F
Minimum Bond Line
Epoxy Technology EPO-TEK® 353ND-T4 Thixotropic Epoxy
Product Description: EPO-TEK® 353ND-T4 is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. This is a higher viscosity version of EPO-TEK® 353..
Cure Time 30.0 min

@Temperature 80.0 °C
0.500 hour

@Temperature 176 °F
Pre-Bake, Minimum Bond Line
Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide
Product Description: EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.Advantages & Appl..
Cure Time 30.0 min

@Temperature 43.0 °C
0.500 hour

@Temperature 109 °F
Full Load
Chesterton ARC MX5 Rapid Curing Fine Particle Wear Compound
Description: An advanced ceramic reinforced composite for the emergency repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is applied at a th..
Cure Time 30.0 min

@Temperature 4.00 °C
0.500 hour

@Temperature 39.2 °F
Tack Free
Chesterton MRS 5 Metal Rebuilding System
MRS 5 is an advanced composite formulated for emergency repair and patching of metal components subject to light abrasive and corrosive conditions. It can be used to seal leaks and patch holes as we..
Cure Time 30.0 min

@Temperature 177 °C
0.500 hour

@Temperature 350 °F
Recommended Cure Cycle
Arlon 30400R040 0.04" Uncured, Unsupported Silicone Rubber on Release Carrier
Design/Construction:Side 1: Uncured, Unsupported Silicone RubberSubstrate: Kodacel CarrierInterleave: 0.003" PolyethyleneThis data represents typical values for the production material and should..
Cure Time 30.0 min

@Temperature 177 °C
0.500 hour

@Temperature 350 °F
Recommended Cure Cycle
Arlon 55531R060 0.061" (1.55 mm) Uncured Silicone Rubber with Fiberglass Substrate
Design/Construction:Side 1: Uncured Silicone RubberSide 2: Uncured Silicone Rubber Appearance: Red silicone gum on fiberglass clothThis data Represents typical values for the production material. Th..
Cure Time 30.0 - 180 min

@Temperature 50.0 - 100 °C
0.500 - 3.00 hour

@Temperature 122 - 212 °F
Optional
Abatron 8509-3 A/B Carbon-Filled Electrically Conductive Epoxy Compound
8509-3 A/B is a solventless carbon-epoxy system used as an adhesive and silk-screening material with anti-static and other lower-conductivity requirements.
Cure Time 30.0 min

@Temperature 23.0 °C
0.500 hour

@Temperature 73.4 °F
M10 steel, working strength
Permabond A1046 Anaerobic Retainer
Permabond® A1046 is a rapid curing adhesive designed to provide permanent locking and sealing of metal parts such as bearings, gears, pulleys and threaded components. It exhibits high strength and ..
Cure Time 30.0 min

@Temperature 23.0 °C
0.500 hour

@Temperature 73.4 °F
Brass, working strength
Permabond A113 Anaerobic Threadlocker
Designed for the locking and sealing of metal parts, Permabond® A113 is ideally suited for use on components that need to be dismantled for maintenance. Giving vibration resistance it can be used ..
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