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- Polymer Property : Cure Time = 30.0 min
Polymer Property : Cure Time = 30.0 min Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
Tack Free Time |
| Parker Chomerics CHOFORM® 5550 Conductive Form-in-Place Gasket Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material.. |
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| Cure Time | 30.0 min @Temperature 100 °C |
0.500 hour @Temperature 212 °F |
Followed by 24 hrs @ RT |
| Parker Chomerics Tecknit® 72-08116 Silver-Filled Epoxy System Description: This is a silver filled epoxy system designed for maximum performance and lowest volume resistivity. It is easily mixed 1:1 by volume or weight, from the two one-ounce jars. Its consist.. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Brass, working strength |
| Permabond F202 Anaerobic Retainer The unique 'toughening' process incorporated into Permabond® F202 gives this anaerobic adhesive excellent resistance to peel and impact forces. Primarily designed for use on metal surfaces, it is a.. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Brass, working strength |
| Permabond HL126 Anaerobic Threadlocker PERMABOND® HL126 Threadlocker is a water thin product for locking pre-assembled parts through wicking action. PERMABOND® HL126 Threadlocker prevents vibration loosening. Because of the low viscosi.. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Brass, working strength |
| Permabond MM115P Pure Anaerobic Threadlocker Permabond® MM115 PURE Threadlocker is an excellent general purpose threadlocker and sealant. It is used for locking metal bolts, nuts and screws that may require disassembly for service and mainten.. |
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| Cure Time | 30.0 min @Temperature 25.0 °C |
0.500 hour @Temperature 77.0 °F |
Initial |
| Lord Adhesives Thermoset™ UR-322 Two Component Urethane Potting Compound Lord UR-322 is a two component, room temperature curing urethane potting compound. The cured elastomer is soft, flexible and has a very low modulus at temperatures down to -80°C. Cured UR-322 als.. |
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| Cure Time | 30.0 min @Temperature 60.0 °C |
0.500 hour @Temperature 140 °F |
|
| Gwent Electronic Materials C2000215D3 Silver / Silver Chloride Paste C2000215D3 has a ratio of Silver to Silver Chloride of 80/20. This is used for reference electrodes in Medical Diagnostics, Environmental Sensor and the "Agri-Food" Industries. It forms part of a .. |
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| Cure Time | 30.0 min @Temperature 60.0 °C |
0.500 hour @Temperature 140 °F |
|
| Gwent Electronic Materials C2000218D5 Silver/Silver Chloride Paste Silver/Silver Chloride Paste has a ratio of Silver to Silver Chloride of 90/10. It is specifically designed to give good adhesion to ceramic substrates. Applications in medical diagnostics, environm.. |
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| Cure Time | 30.0 min @Temperature 60.0 °C |
0.500 hour @Temperature 140 °F |
|
| Gwent Electronic Materials C2050106D7 Carbon Graphite Ink This Carbon Graphite Ink is designed to be used for screen printing working electrodes. This is an ink which has been optimized to give superior electrochemical performance. It gives excellent elec.. |
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| Cure Time | 30.0 min @Temperature 60.0 °C |
0.500 hour @Temperature 140 °F |
|
| Gwent Electronic Materials C2080409D2 Silver/Silver Chloride Paste Silver/Silver Chloride Paste has a ratio of Silver to Silver Chloride of 85/15. The paste is in a ready to use form at a viscosity suitable for automatic or semi-automatic screen printing. The paste.. |
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| Cure Time | 30.0 min @Temperature 180 °C |
0.500 hour @Temperature 356 °F |
box oven |
| Gwent Electronic Materials C2100203D2 Silver Ink This product is part of a range of Heat Curable Inks. These products are based on a unique curing process that results in the low temperature formation of a thermosetting polymer. This ink has exce.. |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
|
| Tra-Con Tra-Bond 293-14 Electrically Conductive Silver-Filled Epoxy Adhesive TRA-BOND 293-14 silver-filled, electrically conductive epoxy adhesive is designed to provide strong bonds to difficult-to-bond metals, such as nickel, copper, gold and solder. The stress-absorbing c.. |
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| Cure Time | 30.0 min @Temperature 70.0 °C |
0.500 hour @Temperature 158 °F |
|
| Trelleborg Emerson & Cuming Eccobond® 45 Two-Component General Purpose Epoxy Adhesive Emerson & Cuming 45 Eccobond® Two-Component General Purpose Epoxy AdhesiveFilled, general purpose, room temperature curing, epoxy adhesive and sealant. Flexibility can be adjusted by the amount of .. |
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| Cure Time | 30.0 - 45.0 min @Temperature 93.3 °C |
0.500 - 0.750 hour @Temperature 200 °F |
|
| Master Bond Supreme 11 High Peel and Shear Strength Epoxy Adhesive Master Bond Polymer System Supreme 11 features a unique balance of performance properties including both high shear and high peel strengths. This two component adhesive system is formulated to cure .. |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
|
| Tra-Con Tra-Bond 789-3TN1 Moisture Resistant Adhesive TRA-BOND 789-3TN1 adhesive is a thixotropic version of TRA-BOND 789-3. It is a one component, high strength, toughened adhesive designed for use in applications which require good moisture resistanc.. |
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| Cure Time | 30.0 min @Temperature 70.0 °C |
0.500 hour @Temperature 158 °F |
|
| Trelleborg Emerson & Cuming Eccobond® 45C Two-Component General Purpose Epoxy Adhesive Emerson & Cuming 45C Eccobond® Two-Component General Purpose Epoxy AdhesiveClear, unfilled, general purpose, room temperature curing, epoxy adhesive and sealant. Flexibility can be adjusted by the .. |
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| Cure Time | 30.0 min @Temperature 80.0 °C |
0.500 hour @Temperature 176 °F |
|
| Epoxy Technology EPO-TEK® 430 Epoxy Product Description: A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding .. |
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| Cure Time | 30.0 - 180 min @Temperature 50.0 - 100 °C |
0.500 - 3.00 hour @Temperature 122 - 212 °F |
Optional |
| Abatron AboCoat 8709-2 A/B Carbon-Filled Electrically Conductive Epoxy Compound AboCoat 8709-2 A/B is a high-solid carbon-epoxy coating with various conductivity ranges widely used in silk-screening. |
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| Cure Time | 30.0 - 180 min @Temperature 50.0 - 100 °C |
0.500 - 3.00 hour @Temperature 122 - 212 °F |
Optional |
| Abatron AboCoat 8709-3 A/B Carbon-Filled Electrically Conductive Epoxy Compound AboCoat 8709-3 A/B is a high-solid carbon-epoxy coating with various conductivity ranges widely used in silk-screening. |
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| Cure Time | 30.0 min @Temperature 177 °C |
0.500 hour @Temperature 350 °F |
Recommended Cure Cycle |
| Arlon 30400R040 0.04" Uncured, Unsupported Silicone Rubber on Release Carrier Design/Construction:Side 1: Uncured, Unsupported Silicone RubberSubstrate: Kodacel CarrierInterleave: 0.003" PolyethyleneThis data represents typical values for the production material and should.. |
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| Cure Time | 30.0 min @Temperature 65.0 °C |
0.500 hour @Temperature 149 °F |
|
| Atom Adhesives AA-BOND 201 Epoxy Adhesive AA-BOND 201 is an exceptional epoxy formulation recommended for lower temperature or wet industrial bonding applications where FAST CURING is required. AA-BOND 201 is versatile two-part epoxy system.. |
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| Cure Time | 30.0 min @Temperature 175 °C |
0.500 hour @Temperature 347 °F |
|
| Atom Adhesives AA-DUCT 904 Epoxy Adhesive AA-DUCT 904 is a single component, heat curing, conductive epoxy that was designed for ease in handling. This high performance conductive epoxy cures quickly at elevated temperatures making it ideal.. |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
Tack Free Time |
| Parker Chomerics CHO-FORM 5541 Conductive Form-In-Place Gaskets Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material.. |
|||
| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Stainless steel, handling strength |
| Permabond MH052 Anaerobic Threadsealant Permabond® MH052 is ideal for the sealing of threaded joints. It is approved for use with natural gas and LPG for working pressure up to 20 bar (290 psi) and also for gaseous oxygen up to 10 bar (1.. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Stainless steel, handling strength |
| Permabond A1046 Anaerobic Retainer Permabond® A1046 is a rapid curing adhesive designed to provide permanent locking and sealing of metal parts such as bearings, gears, pulleys and threaded components. It exhibits high strength and .. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Brass, working strength |
| Permabond A130 Anaerobic Threadlocker Designed for the locking and sealing of metal parts, Permabond® A130 is ideally suited for use on components that need to be dismantled for maintenance. Giving vibration resistance it can be used t.. |
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