| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time |
120
min <br>@Temperature 65.0 °C
|
2.00
hour <br>@Temperature 149 °F
|
|
|
Resinlab® EP750 Clear Unfilled Epoxy Structural Adhesive
Resinlab™ EP750 Clear is a two part unfilled epoxy structural adhesive which ingredients are listed in the Code of Federal Regulations Title 21 175.105 (Adhesives) and 175.300 (Resinous and polymer..
|
|||
| Cure Time |
120
min <br>@Temperature 232 °C
|
2.00
hour <br>@Temperature 450 °F
|
Recommended Postcure Cycle |
|
Arlon 48571R005 0.0055" (0.140 mm) Uncured Silicone Rubber with Fiberglass Substrate
(discontinued **)&l
Design/Construction:Side 1: Uncured RubberSide 2: Uncured RubberThis data represents typical values for the production material. The data should not be used to write, or in place of, material specif..
|
|||
| Cure Time |
120
-
180
min <br>@Temperature 93.3 °C
|
2.00
-
3.00
hour <br>@Temperature 200 °F
|
|
|
Master Bond EP21LV35Med Two Component, Flexible USP Class VI Epoxy System
Master Bond Polymer System EP21LV3/5Med is a two part, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting that cures flexible. It cures readil..
|
|||
| Cure Time |
120
-
180
min <br>@Temperature 93.3 °C
|
2.00
-
3.00
hour <br>@Temperature 200 °F
|
|
|
Master Bond EP21NDLO Low Outgassing, Room Temperature Curing Two Component Epoxy
Master Bond EP21ND-LO is a two component, room temperature curing epoxy system for bonding, sealing and coating featuring outstanding physical properties. EP21ND-LO has a convenient one to one mix r..
|
|||
| Cure Time |
120
min <br>@Temperature 93.3 °C
|
2.00
hour <br>@Temperature 200 °F
|
|
|
Master Bond EP79 Two Component, Silver Coated, Nickel Filled Conductive Epoxy
Master Bond Polymer System EP79 is a two component, silver coated, nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or ..
|
|||
| Cure Time |
120
min <br>@Temperature 60.0 °C
|
2.00
hour <br>@Temperature 140 °F
|
|
|
Tra-Con Tra-Duct 926H01
Information provided by Tra-Con Inc.
|
|||
| Cure Time |
120
-
180
min <br>@Temperature 93.3 °C
|
2.00
-
3.00
hour <br>@Temperature 200 °F
|
|
|
Master Bond EP21FL Flexibilized and Toughened Low Viscosity Epoxy
Master Bond Polymer System EP21FL is a lower viscosity, two component, flexibilized epoxy resin system for high performance bonding, coating, sealing and encapsulating. It is formulated to cure at r..
|
|||
| Cure Time |
120
-
180
min <br>@Temperature 93.3 °C
|
2.00
-
3.00
hour <br>@Temperature 200 °F
|
|
|
Master Bond EP30QF Quartz Filled, Two Component Epoxy System
Master Bond Polymer System EP30QF is a quartz filled, two component epoxy for high performance bonding, sealing, coating and casting that is formulated to cure at room temperature or more rapidly at..
|
|||
| Cure Time |
120
min <br>@Temperature 25.0 °C
|
2.00
hour <br>@Temperature 77.0 °F
|
Tack Free |
|
Chesterton ARC 10 Paste grade machinable composite
Description: A reinforced composite for the repair and protection of metal surfaces. It is machinable with excellent compressive strength, chemical resistance and corrosion resistance. It is non-sag..
|
|||
| Cure Time |
120
min <br>@Temperature 25.0 °C
|
2.00
hour <br>@Temperature 77.0 °F
|
Full Chemical |
|
Chesterton ARC 5 Paste grade Rapid Cure Abrasion Control
Description: ARC 5 is an advanced composite formulated for emergency repair and patching of metal components subject to light abrasive and corrosive conditions. It can be used to seal leaks and patc..
|
|||
| Cure Time |
120
min <br>@Temperature 100 °C
|
2.00
hour <br>@Temperature 212 °F
|
|
|
Cytec EN-2552 (Conap) Potting and Encapsulation Adhesive
Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s..
|
|||
| Cure Time |
120
min <br>@Temperature 80.0 °C
|
2.00
hour <br>@Temperature 176 °F
|
Minimum |
|
Epoxy Technology EPO-TEK® T7109-19 Electrically Insulating Epoxy Paste
Material Description: A flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications. It is an alternative to EPO-TEK® T7109-17, de..
|
|||
| Cure Time |
120
min <br>@Temperature 93.0 °C
|
2.00
hour <br>@Temperature 199 °F
|
|
|
Epoxyset Epoxibond EB-347 Low Expansion Epoxy Adhesive
EB-347 is a highly filled, low coefficient expansion, epoxy adhesive. This low out-gassing adhesive exhibits excellent wettability without preheating metal bonding surfaces and has a good dimensiona..
|
|||
| Cure Time |
120
min <br>@Temperature 65.0 °C
|
2.00
hour <br>@Temperature 149 °F
|
|
|
Epoxyset Epoxiohm EO-21 Electrically Conductive Epoxy Adhesive
EO-21 is a two part, silver filled high electrical conductivity epoxy adhesive. It is designed to cure at room temperature or rapidly at elevated temperature and exhibits very excellent adhesion and..
|
|||
| Cure Time |
120
min <br>@Temperature 32.0 °C
|
2.00
hour <br>@Temperature 89.6 °F
|
Tack Free |
|
Chesterton ARC MX2 High Wear Fine Particle Wear Compound
Description: An advanced ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion and chemical attack. It is applied at a thickness of 3 mm (1/8”..
|
|||
| Cure Time |
120
min <br>@Temperature 25.0 °C
|
2.00
hour <br>@Temperature 77.0 °F
|
Tack Free |
|
Chesterton ARC MXC Castable Extreme Wear Compound
Description: An advanced ceramic composite, with flowable viscosity, for the repair and protection of all metal surfaces subjected to severe erosion, abrasion and chemical attack. It can be hand tro..
|
|||
| Cure Time |
120
min <br>@Temperature 204 °C
|
2.00
hour <br>@Temperature 400 °F
|
Recommended Postcure Cycle |
|
Arlon 55578R030 0.0325" (0.825 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate
Design/Construction: Interleave: PolyethyleneSide 1, Layer 2: Uncured Silicone Rubber Side 1, Layer 1: Cured Silicone Rubber Substrate: Style 162 Fiberglass Side 2: Cured Silicone Rubber Appearance:..
|
|||
| Cure Time |
120
min <br>@Temperature 204 °C
|
2.00
hour <br>@Temperature 400 °F
|
Recommended Postcure Cycle |
|
Arlon 55578XD028 0.028" (0.711 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate
Design/Construction:Side 1: Cured Silicone RubberSide 2: Cured/Uncured Layers Appearance: Gray silicone gum and/or rubber on fiberglass clothThis data Represents typical values for the production ma..
|
|||
| Cure Time |
120
min <br>@Temperature 204 °C
|
2.00
hour <br>@Temperature 400 °F
|
Recommended Postcure Cycle |
|
Arlon CP-310R Bulk Compound
Appearance: Red silicone gumThis data represents typical values for the production material. The data should not be used to write, or in place of, material specifications.Information provided by Arl..
|
|||
| Cure Time |
120
min <br>@Temperature 204 °C
|
2.00
hour <br>@Temperature 400 °F
|
Recommended Postcure Cycle |
|
Arlon CP-475R Bulk Compound
Appearance: Red silicone gumThis data represents typical values for the production material. The data should not be used to write, or in place of, material specifications.Information provided by Arl..
|
|||
| Cure Time |
120
min <br>@Temperature 93.3 °C
|
2.00
hour <br>@Temperature 200 °F
|
Alternate Cure |
|
Aremco Aremco-Bond™ 2220 High Performance Epoxide
Ceramic-Filled, High Chemical Resistance, Machinable. For Repairing Deeply-Corroded Parts.
|
|||
| Cure Time |
120
min <br>@Temperature 100 °C
|
2.00
hour <br>@Temperature 212 °F
|
|
|
Atom Adhesives AA-DUCT 2924 Epoxy Adhesive
AA-DUCT 2924 is a two part electrically conductive composition developed for low shrinkage; low resistivity bonding applications where good electrical and physical properties over a wide temperature..
|
|||
| Cure Time |
120
-
240
min <br>@Temperature 100 °C
|
2.00
-
4.00
hour <br>@Temperature 212 °F
|
2nd step |
|
Abatron AboCast 8502-7/AboCure 8502-7 Colorless, Low-Exotherm Epoxy Casting Compound
AboCast 8502-7/AboCure 8502-7 is a rigid, heat cured, colorless, low-exotherm epoxy casting compound for larger masses. It is a 2-component structural and dielectric liquid system with extremely low..
|
|||
| Cure Time |
120
-
240
min <br>@Temperature 125 °C
|
2.00
-
4.00
hour <br>@Temperature 257 °F
|
optional 3rd step |
|
Abatron AboCast 8502-7/AboCure 8502-7 Colorless, Low-Exotherm Epoxy Casting Compound
AboCast 8502-7/AboCure 8502-7 is a rigid, heat cured, colorless, low-exotherm epoxy casting compound for larger masses. It is a 2-component structural and dielectric liquid system with extremely low..
|
|||
| Cure Time |
120
min <br>@Temperature 65.0 °C
|
2.00
hour <br>@Temperature 149 °F
|
|
|
Resinlab® EP1200 Black Casting Resin
Resinlab™ EP1200 Black is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity, flexibility and a low CTE. It meets the re..
|
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