Processing Properties | Metric | English | Comments |
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Cure Time | 120 - 180 min @Temperature 65.0 °C |
2.00 - 3.00 hour @Temperature 149 °F |
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Resinlab® EP1294 Mineral Filled, Flame Retardant Epoxy Syntactic Foam Resinlab™ EP1294 is a two part mineral filled, flame retardant epoxy syntactic foam. It utilizes glass microspheres to reduce cured density and improve machinability. This product will be self-exti.. |
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Cure Time | 120 min @Temperature 60.0 °C |
2.00 hour @Temperature 140 °F |
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Resinlab® EP1295 Black Medium Viscosity, Halogen Free, Flame Retardant Epoxy Casting Resin Resinlab™ EP1295 Black is a medium viscosity, halogen free, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (.. |
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Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
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Master Bond EP21ARHTND Two component epoxy adhesive, sealant, coating and encapsulating system Product Description: Master Bond EP21ARHTND is a two component epoxy resin system for high performance bonding, sealing and coating. It has a convenient 100 to 50 mix ratio by weight and is formulat.. |
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Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
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Master Bond EP21LVMed Two Component, Low Viscosity USP Class VI Epoxy Master Bond EP21LVMed is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room tempera.. |
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Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
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Master Bond EP30P Epoxy Bonds Glass, Polycarbonates and Acrylics Description: Master Bond Polymer Adhesive EP30P is a two component, transparent, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is for.. |
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Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
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Master Bond EP42LV Low Viscosity Chemically Resistant Two Component Epoxy System Master Bond Polymer System EP42LV is a low viscosity room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring outstanding chemical
resistance. While EP.. |
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Cure Time | 120 min @Temperature 95.0 °C |
2.00 hour @Temperature 203 °F |
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Tra-Con Tra-Bond GA47-2LV Instrument Adhesive TRA-BOND GA47-2LV low viscosity adhesive is designed for guidance instrument applications. This adhesive exhibits excellent compatibility with conventional gyro flotation fluids. TRA-BOND GA47-2LV a.. |
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Cure Time | 120 - 240 min @Temperature 65.0 °C |
2.00 - 4.00 hour @Temperature 149 °F |
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Trelleborg Emerson & Cuming Eccobond® 23 LV General Purpose Catalyst Emerson & Cuming 23 LV Eccobond® General Purpose CatalystExcellent low temperature performance properties, excellent thermal shock/cycle and impact resistance. Good hardener for cryogenic applicati.. |
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Cure Time | 120 min @Temperature 21.0 °C |
2.00 hour @Temperature 69.8 °F |
Full Load |
Chesterton ARC NVE SYSTEM Vinyl Ester Lining Description: ARC NVE is a high performance, quartz reinforced, three-component, modified novolac vinyl ester lining capable of being applied to horizontal and vertical surfaces. The NVE system kit i.. |
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Cure Time | 120 min @Temperature 65.0 °C |
2.00 hour @Temperature 149 °F |
Minimum Bond Line |
Epoxy Technology EPO-TEK® OM125 Optical Epoxy Product Description: EPO-TEK® OM125 is two component, high Tg, optical epoxy designed for bonding multi-mode fiber optic connectors. Advantages & Application Notes: Color coded blue for easy operat.. |
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Cure Time | 120 min @Temperature 125 °C |
2.00 hour @Temperature 257 °F |
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Epoxyset Epoxiohm EO-38M-3 Electrically Conductive Epoxy Adhesive EO-38M-3 is a two components, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is used for thermal management appl.. |
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Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Postcure Cycle |
Arlon 30300R062 0.062" (1.57 mm) Uncured Silicone Rubber on Kodacel Carrier Design/Construction: Interleave: Polyethylene Side 1: Uncured Silicone RubberCarrier: KodacelAppearance: Red silicone gum on polymer linersThis data represents typical values for the production mate.. |
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Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Postcure Cycle |
Arlon 55578XC028 0.028" (0.711 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Cured Silicone RubberSide 2: Cured/Uncured Layers This data Represents typical values for the production material. The data should not be used to write, or in place of, m.. |
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Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Postcure Cycle |
Arlon 55579R043W 0.043" (1.09 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Uncured layer on top of a cured layer on one side This data Represents typical values for the production material. The data should not be used to write, or in place of, m.. |
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Cure Time | 120 min @Temperature 93.3 °C |
2.00 hour @Temperature 200 °F |
Step 1, preceeded by <1 hour air set |
Aremco Ceramabond™ 885 High Temperature Ceramic Adhesive/Paste, Zirconia Filled Aremco's ceramic adhesives are easy to use, one- and two-component systems which air dry in 1-2 hrs and are ready for use following a 200 to 700 °F cure. These materials are mostly water-based and.. |
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Cure Time | 120 - 180 min @Temperature 100 °C |
2.00 - 3.00 hour @Temperature 212 °F |
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Abatron AboCast 8103-23 High-Performance Dielectric Epoxy AboCast 8103-23 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system has a comb.. |
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Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Postcure Cycle |
Arlon 51344R020 0.020" (0.508 mm) Semi-Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Semi-Cured Silicone Rubber Appearance: Red silicone gum on fiberglass clothThis data Represents typical values for the production material. The data should not be used to.. |
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Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Postcure Cycle |
Arlon R33889R020 0.020" (0.508 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Layer-on-Layer This data Represents typical values for the production material. The data should not be used to write, or in place of, material specifications.Information .. |
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Cure Time | 120 - 240 min @Temperature 65.0 °C |
2.00 - 4.00 hour @Temperature 149 °F |
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Atom Adhesives AA-SUPERTHERM 195 Epoxy Adhesive AA-SUPERTHERM 195 is a two component, thermally conductive epoxy system recommended for staking transistors, diodes, resistors, integrated circuits and other heat sensitive components to printed cir.. |
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Cure Time | 120 min @Temperature 260 °C |
2.00 hour @Temperature 500 °F |
Step 2 |
Aremco Ceramabond™ 890 High Temperature Ceramic Adhesive/Paste, Silicon Carbide Filled Aremco's ceramic adhesives are easy to use, one- and two-component systems which air dry in 1-2 hrs and are ready for use following a 200 to 700 °F cure. These materials are mostly water-based and.. |
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Cure Time | 120 min @Temperature 23.0 °C |
2.00 hour @Temperature 73.4 °F |
M10 steel, working strength |
Permabond A025 Anaerobic Retainer Permabond® A025 is an anaerobic adhesive formulated to provide permanent locking and sealing of metal parts such as bearings, gears, studs and other threaded components. It has been designed for ap.. |