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Polymer Property : Cure Time = 120 min Product List

Processing Properties

Tips: 30 items are displayed at most.
Processing Properties Metric English Comments
Cure Time 120 min
<br>@Temperature 65.0 °C
2.00 hour
<br>@Temperature 149 °F
Resinlab® EP750 Clear Unfilled Epoxy Structural Adhesive
Resinlab™ EP750 Clear is a two part unfilled epoxy structural adhesive which ingredients are listed in the Code of Federal Regulations Title 21 175.105 (Adhesives) and 175.300 (Resinous and polymer..
Cure Time 120 min
<br>@Temperature 232 °C
2.00 hour
<br>@Temperature 450 °F
Recommended Postcure Cycle
Arlon 48571R005 0.0055" (0.140 mm) Uncured Silicone Rubber with Fiberglass Substrate &nbsp;(discontinued **)&l
Design/Construction:Side 1: Uncured RubberSide 2: Uncured RubberThis data represents typical values for the production material. The data should not be used to write, or in place of, material specif..
Cure Time 120 - 180 min
<br>@Temperature 93.3 °C
2.00 - 3.00 hour
<br>@Temperature 200 °F
Master Bond EP21LV35Med Two Component, Flexible USP Class VI Epoxy System
Master Bond Polymer System EP21LV3/5Med is a two part, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting that cures flexible. It cures readil..
Cure Time 120 - 180 min
<br>@Temperature 93.3 °C
2.00 - 3.00 hour
<br>@Temperature 200 °F
Master Bond EP21NDLO Low Outgassing, Room Temperature Curing Two Component Epoxy
Master Bond EP21ND-LO is a two component, room temperature curing epoxy system for bonding, sealing and coating featuring outstanding physical properties. EP21ND-LO has a convenient one to one mix r..
Cure Time 120 min
<br>@Temperature 93.3 °C
2.00 hour
<br>@Temperature 200 °F
Master Bond EP79 Two Component, Silver Coated, Nickel Filled Conductive Epoxy
Master Bond Polymer System EP79 is a two component, silver coated, nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or ..
Cure Time 120 min
<br>@Temperature 60.0 °C
2.00 hour
<br>@Temperature 140 °F
Tra-Con Tra-Duct 926H01
Information provided by Tra-Con Inc.
Cure Time 120 - 180 min
<br>@Temperature 93.3 °C
2.00 - 3.00 hour
<br>@Temperature 200 °F
Master Bond EP21FL Flexibilized and Toughened Low Viscosity Epoxy
Master Bond Polymer System EP21FL is a lower viscosity, two component, flexibilized epoxy resin system for high performance bonding, coating, sealing and encapsulating. It is formulated to cure at r..
Cure Time 120 - 180 min
<br>@Temperature 93.3 °C
2.00 - 3.00 hour
<br>@Temperature 200 °F
Master Bond EP30QF Quartz Filled, Two Component Epoxy System
Master Bond Polymer System EP30QF is a quartz filled, two component epoxy for high performance bonding, sealing, coating and casting that is formulated to cure at room temperature or more rapidly at..
Cure Time 120 min
<br>@Temperature 25.0 °C
2.00 hour
<br>@Temperature 77.0 °F
Tack Free
Chesterton ARC 10 Paste grade machinable composite
Description: A reinforced composite for the repair and protection of metal surfaces. It is machinable with excellent compressive strength, chemical resistance and corrosion resistance. It is non-sag..
Cure Time 120 min
<br>@Temperature 25.0 °C
2.00 hour
<br>@Temperature 77.0 °F
Full Chemical
Chesterton ARC 5 Paste grade Rapid Cure Abrasion Control
Description: ARC 5 is an advanced composite formulated for emergency repair and patching of metal components subject to light abrasive and corrosive conditions. It can be used to seal leaks and patc..
Cure Time 120 min
<br>@Temperature 100 °C
2.00 hour
<br>@Temperature 212 °F
Cytec EN-2552 (Conap) Potting and Encapsulation Adhesive
Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s..
Cure Time 120 min
<br>@Temperature 80.0 °C
2.00 hour
<br>@Temperature 176 °F
Minimum
Epoxy Technology EPO-TEK® T7109-19 Electrically Insulating Epoxy Paste
Material Description: A flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications. It is an alternative to EPO-TEK® T7109-17, de..
Cure Time 120 min
<br>@Temperature 93.0 °C
2.00 hour
<br>@Temperature 199 °F
Epoxyset Epoxibond EB-347 Low Expansion Epoxy Adhesive
EB-347 is a highly filled, low coefficient expansion, epoxy adhesive. This low out-gassing adhesive exhibits excellent wettability without preheating metal bonding surfaces and has a good dimensiona..
Cure Time 120 min
<br>@Temperature 65.0 °C
2.00 hour
<br>@Temperature 149 °F
Epoxyset Epoxiohm EO-21 Electrically Conductive Epoxy Adhesive
EO-21 is a two part, silver filled high electrical conductivity epoxy adhesive. It is designed to cure at room temperature or rapidly at elevated temperature and exhibits very excellent adhesion and..
Cure Time 120 min
<br>@Temperature 32.0 °C
2.00 hour
<br>@Temperature 89.6 °F
Tack Free
Chesterton ARC MX2 High Wear Fine Particle Wear Compound
Description: An advanced ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion and chemical attack. It is applied at a thickness of 3 mm (1/8”..
Cure Time 120 min
<br>@Temperature 25.0 °C
2.00 hour
<br>@Temperature 77.0 °F
Tack Free
Chesterton ARC MXC Castable Extreme Wear Compound
Description: An advanced ceramic composite, with flowable viscosity, for the repair and protection of all metal surfaces subjected to severe erosion, abrasion and chemical attack. It can be hand tro..
Cure Time 120 min
<br>@Temperature 204 °C
2.00 hour
<br>@Temperature 400 °F
Recommended Postcure Cycle
Arlon 55578R030 0.0325" (0.825 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate
Design/Construction: Interleave: PolyethyleneSide 1, Layer 2: Uncured Silicone Rubber Side 1, Layer 1: Cured Silicone Rubber Substrate: Style 162 Fiberglass Side 2: Cured Silicone Rubber Appearance:..
Cure Time 120 min
<br>@Temperature 204 °C
2.00 hour
<br>@Temperature 400 °F
Recommended Postcure Cycle
Arlon 55578XD028 0.028" (0.711 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate
Design/Construction:Side 1: Cured Silicone RubberSide 2: Cured/Uncured Layers Appearance: Gray silicone gum and/or rubber on fiberglass clothThis data Represents typical values for the production ma..
Cure Time 120 min
<br>@Temperature 204 °C
2.00 hour
<br>@Temperature 400 °F
Recommended Postcure Cycle
Arlon CP-310R Bulk Compound
Appearance: Red silicone gumThis data represents typical values for the production material. The data should not be used to write, or in place of, material specifications.Information provided by Arl..
Cure Time 120 min
<br>@Temperature 204 °C
2.00 hour
<br>@Temperature 400 °F
Recommended Postcure Cycle
Arlon CP-475R Bulk Compound
Appearance: Red silicone gumThis data represents typical values for the production material. The data should not be used to write, or in place of, material specifications.Information provided by Arl..
Cure Time 120 min
<br>@Temperature 93.3 °C
2.00 hour
<br>@Temperature 200 °F
Alternate Cure
Aremco Aremco-Bond™ 2220 High Performance Epoxide
Ceramic-Filled, High Chemical Resistance, Machinable. For Repairing Deeply-Corroded Parts.
Cure Time 120 min
<br>@Temperature 100 °C
2.00 hour
<br>@Temperature 212 °F
Atom Adhesives AA-DUCT 2924 Epoxy Adhesive
AA-DUCT 2924 is a two part electrically conductive composition developed for low shrinkage; low resistivity bonding applications where good electrical and physical properties over a wide temperature..
Cure Time 120 - 240 min
<br>@Temperature 100 °C
2.00 - 4.00 hour
<br>@Temperature 212 °F
2nd step
Abatron AboCast 8502-7/AboCure 8502-7 Colorless, Low-Exotherm Epoxy Casting Compound
AboCast 8502-7/AboCure 8502-7 is a rigid, heat cured, colorless, low-exotherm epoxy casting compound for larger masses. It is a 2-component structural and dielectric liquid system with extremely low..
Cure Time 120 - 240 min
<br>@Temperature 125 °C
2.00 - 4.00 hour
<br>@Temperature 257 °F
optional 3rd step
Abatron AboCast 8502-7/AboCure 8502-7 Colorless, Low-Exotherm Epoxy Casting Compound
AboCast 8502-7/AboCure 8502-7 is a rigid, heat cured, colorless, low-exotherm epoxy casting compound for larger masses. It is a 2-component structural and dielectric liquid system with extremely low..
Cure Time 120 min
<br>@Temperature 65.0 °C
2.00 hour
<br>@Temperature 149 °F
Resinlab® EP1200 Black Casting Resin
Resinlab™ EP1200 Black is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity, flexibility and a low CTE. It meets the re..
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