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Polymer Property : Cure Time = 0.500 hour Product List

Processing Properties

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Processing Properties Metric English Comments
Cure Time 30.0 min

@Temperature 150 °C
0.500 hour

@Temperature 302 °F
Handling Time
Parker Chomerics CHOFORM® 5550 Conductive Form-in-Place Gasket
Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material..
Cure Time 30.0 min

@Temperature 23.0 °C
0.500 hour

@Temperature 73.4 °F
Zinc, handling strength
Permabond HH120 Anaerobic Threadlocker
Permabond® HH120 Threadlocker is an excellent general purpose threadlocker and sealant. It is used for locking bolts, nuts and screws that require permanent assembly. Its high viscosity allows for ..
Cure Time 30.0 min

@Temperature 23.0 °C
0.500 hour

@Temperature 73.4 °F
Zinc, handling strength
Permabond HH131 High Temperature Threadlocker
Permabond® HH131 is a very high temperature resistant, high strength anaerobic threadlocker and sealant. This material cures in the absence of air between tight fitting metal parts. It is used for ..
Cure Time 30.0 min

@Temperature 23.0 °C
0.500 hour

@Temperature 73.4 °F
Zinc, handling strength
Permabond HH190 Anaerobic Gasketmaker
Permabond® HH190 Gasketmaker is an anaerobic curing flange sealant that can replace, or be used as a dressing for, conventional pre-cut gaskets. Since HH190 is a flowable paste, it conforms to the ..
Cure Time 30.0 min

@Temperature 23.0 °C
0.500 hour

@Temperature 73.4 °F
M10 steel, handling strength
Permabond LM012 Anaerobic Threadsealant
Permabond® LM012 is an unfilled, medium viscosity anaerobic adhesive. Its major benefit as related to other pipe sealants is that it is an unfilled resin that is compatible with hydraulic fluids. I..
Cure Time 30.0 min

@Temperature 23.0 °C
0.500 hour

@Temperature 73.4 °F
Zinc, handling strength
Permabond LM113 Anaerobic Threadlocker
Permabond® LM113 Threadlocker is a medium viscosity product for locking small threaded fasteners, such as screws and bolts or hydraulic fittings that might require disassembly. Due to its thixotrop..
Cure Time 30.0 min

@Temperature 110 °C
0.500 hour

@Temperature 230 °F
Resinlab® EP1320 Heat Cure Epoxy Conformal Coating
Resinlab™ EP1320 and EP1320LV are one part heat cure epoxy conformal coatings. They can also be used as a small mass potting compounds, structural adhesives, or insulating polymer systems where the..
Cure Time 30.0 - 60.0 min

@Temperature 125 °C
0.500 - 1.00 hour

@Temperature 257 °F
Resin Technology Group TIGA 901 Room Temperature Curing Silver Conductive Epoxy
100 parts resin to 6 parts hardener. Cure 24 hours at 25°C, 1-4 hours at 65°C, 30-60 minutes at 125°C, or 30 minutes at 150°C.TIGA 901 is an electrically conductive, silver filled epoxy adhesiv..
Cure Time 30.0 min

@Temperature 130 °C
0.500 hour

@Temperature 266 °F
Gwent Electronic Materials C2081126P2 Conductive Silver Polymer Paste
This product is a thermoplastic screen printing ink, developed for use in membrane touch switch applications as well as counter electrode in electrochemical sensors and conductive tracks. It may be ..
Cure Time 30.0 min

@Temperature 79.4 °C
0.500 hour

@Temperature 175 °F
Master Bond Supreme 3HT-80 One Component, Toughened, Heat Curing Epoxy
Master Bond Polymer System Supreme 3HT-80 is a one component, heat curing epoxy adhesive/sealant featuring excellent physical and chemical resistance properties and a minimal curing temperature of 1..
Cure Time 30.0 min

@Temperature 150 °C
0.500 hour

@Temperature 302 °F
Tra-Con Tra-Bond 933-2 Moisture Resistant Chip Encapsulant
TRA-BOND 933-2 one component, highly filled, electrically insulating epoxy encapsulant is designed for encapsulating microelectronic chips. This epoxy provides excellent environmental and mechanical..
Cure Time 30.0 min

@Temperature 4.00 °C
0.500 hour

@Temperature 39.2 °F
Tack Free
Chesterton ARC 5 Paste grade Rapid Cure Abrasion Control
Description: ARC 5 is an advanced composite formulated for emergency repair and patching of metal components subject to light abrasive and corrosive conditions. It can be used to seal leaks and patc..
Cure Time 30.0 min

@Temperature 80.0 °C
0.500 hour

@Temperature 176 °F
Epoxy Technology EPO-TEK® 431 Copper Filled Epoxy
A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding and EMI RF shielding...
Cure Time 30.0 min

@Temperature 80.0 °C
0.500 hour

@Temperature 176 °F
minimum
Epoxy Technology EPO-TEK® OE188 High Temperature Silica-Filled Epoxy
Product Description: EPO-TEK® OE188 is a low CTE, designed for semiconductor and fiber optic applications. Advantages & Application Notes: Paste-like viscosity allows for application by dispensing..
Cure Time 30.0 - 60.0 min

@Temperature 80.0 - 120 °C
0.500 - 1.00 hour

@Temperature 176 - 248 °F
Abatron AboCast 8005-6/AboCure 8005-6 Epoxy
AboCast 8005-6 is a tan, viscous filled liquid resin with a weight of approximately 11 lbs/gallon. AboCure 8005-6 is an amber, viscous liquid converter with a weight of approximately 10 lbs/gallon. ..
Cure Time 30.0 - 180 min

@Temperature 50.0 - 100 °C
0.500 - 3.00 hour

@Temperature 122 - 212 °F
Optional
Abatron AboCoat 8709-5 A/B Carbon-Filled Electrically Conductive Epoxy Compound
AboCoat 8709-5 A/B is a high-solid carbon-epoxy coating with various conductivity ranges widely used in silk-screening.
Cure Time 30.0 min

@Temperature 93.3 °C
0.500 hour

@Temperature 200 °F
Step 1, preceeded by >30 min. air set
Aremco Aremco-Seal™ 617 High Temperature Glass Coating
Glass-filled adhesive/sealer for use with porous ceramics and refractories to 1500 ºF (816 ºC).
Cure Time 30.0 min

@Temperature 65.0 °C
0.500 hour

@Temperature 149 °F
Atom Adhesives AA-BOND 201 Epoxy Adhesive
AA-BOND 201 is an exceptional epoxy formulation recommended for lower temperature or wet industrial bonding applications where FAST CURING is required. AA-BOND 201 is versatile two-part epoxy system..
Cure Time 30.0 min

@Temperature 125 °C
0.500 hour

@Temperature 257 °F
ACC QSil 550SB QSI Quantum Silicones Self-Priming Silicone Potting Material
QSil 550SB is a 100% silicone solids elastomer designed for electronic potting applications. The two-component system offers a hard, thermally conductive, low modulus material that is readily repair..
Cure Time 30.0 min

@Temperature 150 °C
0.500 hour

@Temperature 302 °F
Handling Time
Parker Chomerics CHOFORM® 5560 Conductive Form-in-Place Gasket
Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material..
Cure Time 30.0 min

@Temperature 149 °C
0.500 hour

@Temperature 300 °F
3M Scotchcast™ 260 CG Electrical Epoxy Powder Resin
3M Scotchcast Electrical Resin 260 is a widely used, well-known general purpose epoxy powder resin. A one-part, green pigmented, rapid heat-curing product, it is designed to provide a continuous, to..
Cure Time 30.0 min

@Temperature 23.0 °C
0.500 hour

@Temperature 73.4 °F
Zinc, handling strength
Permabond A1042 Anaerobic Threadlocker
Permabond® A1042 is a rapid curing adhesive designed to lock and seal metal parts that subsequently may need to be dismantled for maintenance. The high vibration resistance makes Permabond A1042 pa..
Cure Time 30.0 min

@Temperature 43.0 °C
0.500 hour

@Temperature 109 °F
Tack Free
Chesterton MRS 58 Metal Rebuilding System
An advanced ceramic composite for the repair and protection of all metal surfaces subjected to erosion, corrosion and chemical attack. It is normally applied at a thickness of 1.5 mm (60 mils) or mo..
Cure Time 30.0 min

@Temperature 23.0 °C
0.500 hour

@Temperature 73.4 °F
Stainless steel, handling strength
Permabond A1046 Anaerobic Retainer
Permabond® A1046 is a rapid curing adhesive designed to provide permanent locking and sealing of metal parts such as bearings, gears, pulleys and threaded components. It exhibits high strength and ..
Cure Time <= 30.0 min

@Temperature 23.0 °C
<= 0.500 hour

@Temperature 73.4 °F
M10 steel, handling strength
Permabond A136 Anaerobic Gasketmaker
Permabond® A136 is an anaerobic material designed for making 'formed in situ' gaskets between metal surfaces. It is capable of replacing a wide range of conventional gaskets thereby offering potent..
Cure Time 30.0 min

@Temperature 30.0 °C
0.500 hour

@Temperature 86.0 °F
Gwent Electronic Materials C2000802P2 Carbon Graphite Ink
This product is designed to be used for screen-printing working electrodes. This ink has been optimized to give superior electrochemical performance. It combines good line definition and good electr..
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