Polymer Property : Thermal Conductivity = 0.340 W/m-K Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.340 W/m-K	2.36 BTU-in/hr-ft²-°F	Z; ASTM E1461
Park Electrochemical Nelco® N8000Q Cyanate Ester Epoxy Laminate and Prepreg The Nelco N8000 is a high-Tg cyanate ester laminate and prepreg system that provides superior performance and product integrity and is ideal for board designs with higher layer counts, finer lines a..
Thermal Conductivity	0.340 W/m-K	2.36 BTU-in/hr-ft²-°F
Quadrant EPP Semitron® ESd 520HR PAI, static dissipative, extruded (ISO Data) Semitron ESd 520HR has an industry first combination of electrostatic dissipation (ESd), high strength and heat resistance. This new ESd material is ideal for making nests, sockets and contactors fo..
Thermal Conductivity	0.340 W/m-K	2.36 BTU-in/hr-ft²-°F	ASTM F433
Quadrant EPP Semitron® MP-370 (ASTM Product Data Sheet)
Thermal Conductivity	0.340 W/m-K	2.36 BTU-in/hr-ft²-°F	ASTM C177
Solvay Specialty Polymers AvaSpire® AV-722 CF30 Polyaryletherketone (PAEK) (Unverified Data**) AvaSpire AV-722 CF30 is a 30% carbon fiber reinforced version of AvaSpire AV-722. This formulation offers improved part economics relative to 30% carbon fiber reinforced PEEK while retaining most of..
Thermal Conductivity	0.340 - 0.360 W/m-K	2.36 - 2.50 BTU-in/hr-ft²-°F	Average value: 0.341 W/m-K Grade Count:15
Overview of materials for Ethylene Vinyl Alcohol (EVOH) This property data is a summary of similar materials in the MatWeb database for the category "Ethylene Vinyl Alcohol". Each property range of values reported is minimum and maximum values of appropr..
Thermal Conductivity	0.340 W/m-K	2.36 BTU-in/hr-ft²-°F	For EVAL F101
EVALCA EVAL® LC-H101BD Ethylene Vinyl Alcohol Copolymer Resin (discontinued **) 38 mol % Ethylene.Data provided by EVALCA. Applications: Blown film. EVOH is used in packaging applications because of its outstanding gas barrier properties.EVAL™ is now produced as a part of th..
Thermal Conductivity	0.340 W/m-K	2.36 BTU-in/hr-ft²-°F	For EVAL F101
EVALCA EVAL® K102 Ethylene Vinyl Alcohol Copolymer Resin (discontinued **) 38 mol % Ethylene.Data provided by EVALCA. Applications: Solid phase pressure forming. EVOH is used in packaging applications because of its outstanding gas barrier properties.EVAL™ is now produc..
Thermal Conductivity	0.340 W/m-K	2.36 BTU-in/hr-ft²-°F	For EVAL F101
EVALCA EVAL® G156A Ethylene Vinyl Alcohol Copolymer Resin (discontinued **) 48 mol % Ethylene.Data provided by EVALCA. Applications: Cast film, specialty applications. EVOH is used in packaging applications because of its outstanding gas barrier properties.EVAL™ is now p..
Thermal Conductivity	0.340 W/m-K	2.36 BTU-in/hr-ft²-°F	For EVAL F101
EVALCA EVAL® G110 Ethylene Vinyl Alcohol Copolymer Resin (discontinued **) 48 mol % Ethylene.Data provided by EVALCA. EVOH is used in packaging applications because of its outstanding gas barrier properties.EVAL™ is now produced as a part of the Kuraray product line.
Thermal Conductivity	0.340 W/m-K	2.36 BTU-in/hr-ftÂ²-Â°F	ASTM C177
Solvay Specialty Polymers AvaSpireÂ® AV-722 CF30 Polyaryletherketone (PAEK), 30% Carbon Fiber AvaSpireÂ® AV-722 CF30 is a 30% carbon fiber reinforced version of AvaSpireÂ® AV-722. This formulation offers improved part economics relative to 30% carbon fiber reinforced PEEK while retaining..
Thermal Conductivity	0.340 W/m-K	2.36 BTU-in/hr-ftÂ²-Â°F	ASTM C177
Solvay Specialty Polymers RytonÂ® XK2340 Polyphenylene Sulfide Alloy (PPS Alloy), 40% Glass Fiber RytonÂ® XK2340 40% glass fiber reinforced polyphenylene sulfide alloy compound provides excellent mechanical strength, toughness, and rigidity, along with excellent flow in thin-walled parts, low ..
Thermal Conductivity	0.340 W/m-K @Temperature 100 °C	2.36 BTU-in/hr-ft²-°F @Temperature 212 °F	ASTM E1461
Plenco 2300 Phenolic, Granular, Transfer Molded PLENCO 02300 is a general purpose organic filled molding compound formulated to offer excellent processability while maintaining mechanical strength values. UL recognized under component file E40654..
Thermal Conductivity	0.340 W/m-K @Temperature 121 °C	2.36 BTU-in/hr-ft²-°F @Temperature 250 °F
BNZ Materials Transite 1000 Low Temperature Industrial Board These non-asbestos, monolithic fiber cement industrial boards are used in environments up to 1000°F where high strength is the primary concern. These fiber cement boards are used in the foundry ind..
Thermal Conductivity	0.340 W/m-K	2.36 BTU-in/hr-ft²-°F	ASTM C 177
Adamas Adalon® 252 PTFE, 28% Glass Fiber Information provided by Adamas, HPM
Thermal Conductivity	0.340 W/m-K	2.36 BTU-in/hr-ft²-°F	DIN 52612
BASF Ultramid® B3ZG3 BK 30564 15% Glass Filled PA6-1 (Conditioned) Description: Impact-modified and 15% glass fiber reinforced injection-molding grade, for instance, for automotive cable conduits.Information provided by BASF
Thermal Conductivity	0.340 W/m-K @Temperature 121 °C	2.36 BTU-in/hr-ft²-°F @Temperature 250 °F
BNZ Materials Transite HT Low Temperature Industrial Board These non-asbestos, monolithic fiber cement industrial boards are used in environments up to 1000°F where high strength is the primary concern. These fiber cement boards are used in the foundry ind..
Thermal Conductivity	0.340 W/m-K	2.36 BTU-in/hr-ft²-°F	DIN 52612-1
BASF Ultramid® A3EG5 25% Glass Filled PA66 (Dry) Description: Glass fiber reinforced injection molding grade for machinery components and housings of high stiffness and dimensional stability such as coil formers and bearing cages. Also used for el..
Thermal Conductivity	0.340 W/m-K	2.36 BTU-in/hr-ft²-°F	DIN 52612
BASF Ultramid® A3HG6 HR BK 23591 30% Glass Filled PA66 (Dry) Description: 30% glass-fiber reinforced injection-molding grade with enhanced hydrolysis resistance, e.g., for applications in vehicle cooling systems.Information provided by BASF
Thermal Conductivity	0.340 W/m-K	2.36 BTU-in/hr-ft²-°F	DIN 52612
BASF Ultramid® A3X2G7 35% Glass Filled PA66 (Conditioned) Ultramid A3X2G7 is a 35% glass fiber reinforced injection molding PA66 grade with improved flame retardance and enhanced long-term stability. Flame retardant based on red phosphorus; very high stif..
Thermal Conductivity	0.340 W/m-K	2.36 BTU-in/hr-ft²-°F	DIN 52612
BASF Ultramid® A3X2G7 35% Glass Filled PA66 (Dry) Ultramid A3X2G7 is a 35% glass fiber reinforced injection molding PA66 grade with improved flame retardance and enhanced long-term stability. Flame retardant based on red phosphorus; very high stif..
Thermal Conductivity	0.340 W/m-K	2.36 BTU-in/hr-ft²-°F	DIN 52612
BASF Ultramid® B35EG3 15% Glass Filled PA6 (Dry) Description: 15% glass-fiber reinforced injection-molding grade for gIT applications such as, for example, steering column switches, vehicle mirror housings and the wheels of mountain bikes.Informat..
Thermal Conductivity	0.340 W/m-K	2.36 BTU-in/hr-ft²-°F	DIN 52612
BASF Ultramid® B35EG3 BK 00564 15% Glass Filled PA6 (Dry) Description: 15% glass-fiber reinforced injection-molding grade for gIT applications such as, for example, steering column switches, vehicle mirror housings and the wheels of mountain bikes.Informat..
Thermal Conductivity	0.340 W/m-K	2.36 BTU-in/hr-ft²-°F	DIN 52612
BASF Ultramid® B3EG3 15% Glass Filled PA6 (Conditioned) Description: 15% glass-fiber reinforced injection-molding grade with enhanced impact resistance, for example, for vehicle mirror housings as well as for the wheels of mountain bikes.Information prov..
Thermal Conductivity	0.340 W/m-K	2.36 BTU-in/hr-ft²-°F	DIN 53765
BASF Ultramid® B3GK24 10/20% Glass Bead/Fiber Filled PA6 (Conditioned) Ultramid B3GK24 is 30% combined glass-fiber and glass bead injection molding PA6 grade for industrial articles having very high dimensional stability.
Thermal Conductivity	0.340 W/m-K	2.36 BTU-in/hr-ft²-°F	DIN 52612
BASF Ultramid® B3GK24 BK 00564 10/20% Glass/Glass Bead Filled PA6 (Dry) Description: combined 10% glass-fiber and 20% glass-bead reinforced injection-molding grade for technical articles of very good dimensional stability, for instance, vehicle ash tray housings and ele..
Thermal Conductivity	0.340 W/m-K	2.36 BTU-in/hr-ft²-°F	ASTM C177
Solvay Specialty Polymers Algoflon® 15GL PTFE; Glass Fiber Filled (discontinued **) Data provided by the manufacturer.15 wt.% Glass Fiber. Suspension polymer powder grade recommended for compression molding. Pure PTFE possesses high inertness, excellent dielectric properties, almos..
Thermal Conductivity	0.340 W/m-K	2.36 BTU-in/hr-ft²-°F	ASTM C 177
Adamas Adalon® 131 PTFE, 25% Soft Carbon Filled Information provided by Adamas, HPM
Thermal Conductivity	0.340 W/m-K	2.36 BTU-in/hr-ft²-°F	For EVAL F101
EVALCA EVAL® EF-XL Ethylene Vinyl Alcohol Copolymer Film (discontinued **) Biaxially oriented type film; property values for 15 µm film.Data provided by EVALCA. EVOH is used in packaging applications because of its outstanding gas barrier properties.EVAL™ is now produ..
Thermal Conductivity	0.340 W/m-K	2.36 BTU-in/hr-ft²-°F	ASTM C 177
Adamas Adalon® 254 PTFE, 28% Glass Fiber Information provided by Adamas, HPM
Thermal Conductivity	0.340 W/m-K	2.36 BTU-in/hr-ft²-°F	For EVAL F101
EVALCA EVAL® LC-T101 Ethylene Vinyl Alcohol Copolymer Resin (discontinued **) 32 mol % Ethylene.Data provided by EVALCA. Applications: Solid phase pressure forming. EVOH is used in packaging applications because of its outstanding gas barrier properties.EVAL™ is now produc..