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Park Electrochemical Nelco® N8000Q Cyanate Ester Epoxy Laminate and Prepreg

Category Polymer , Thermoset , Epoxy
Manufacturer Park Electrochemical Corp.
Trade Name Nelco®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Park Electrochemical Nelco® N8000Q Cyanate Ester Epoxy Laminate and Prepreg.pdf
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Material Notes:
The Nelco N8000 is a high-Tg cyanate ester laminate and prepreg system that provides superior performance and product integrity and is ideal for board designs with higher layer counts, finer lines and spaces and larger panel sizes.Key Features and Benefits:High thermal performanceSelf adhesive bond to foam coresSuperior electrical propertiesTypical Cyanate Ester processingS-glass and Quartz optionsApplications:Fine-Line MultilayersBackplanesSurface-Mount MultilayersBGA MultilayersMCM-L'sDirect Chip AttachAutomotiveUnderhood AutomotiveWireless CommuncationsHigh Speed ComputingRadomes and Secondary Aerospace StructureInformation provided by Park Electrochemical Corp.
Physical Properties Metric English Comments
Density 1.73 g/cc
0.0625 lb/in³
50% resin content
Mechanical Properties Metric English Comments
Modulus of Elasticity 15.9 GPa
2300 ksi
Y; ASTM D3039
17.9 GPa
2600 ksi
X; ASTM D3039
Poissons Ratio 0.16
0.16
X; ASTM D3039
0.16
0.16
Y; ASTM D3039
Peel Strength 1.75 kN/m
10.0 pli
1 oz. Cu, after solder float; IPC-TM-650.2.4.8
1.75 kN/m
10.0 pli
1 oz. Cu, after exposure to process solutions; IPC-TM-650.2.4.8
Thermal Properties Metric English Comments
CTE, linear 70.0 µm/m-°C

@Temperature 50.0 - 250 °C
38.9 µin/in-°F

@Temperature 122 - 482 °F
Z-Axis, Alpha 1; IPC-TM-650.2.4.41
374 µm/m-°C

@Temperature 250 - 260 °C
208 µin/in-°F

@Temperature 482 - 500 °F
Z-Axis, Alpha 2; IPC-TM-650.2.4.41
Specific Heat Capacity 0.9991 J/g-°C
0.2388 BTU/lb-°F
ASTM E1461
Thermal Conductivity 0.340 W/m-K
2.36 BTU-in/hr-ft²-°F
Z; ASTM E1461
0.540 W/m-K
3.75 BTU-in/hr-ft²-°F
X-Y; ASTM E1461
Glass Transition Temp, Tg 240 °C
464 °F
TMA; IPC-TM-650.2.4.24c
250 °C
482 °F
DSC; IPC-TM-650.2.4.25c
300 °C
572 °F
DMA (Tan d Peak); IPC-TM-650.2.4.24.3
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+13 ohm-cm
1.00e+13 ohm-cm
C - 96/35/90; IPC-TM-650.2.5.17.1
1.00e+13 ohm-cm
1.00e+13 ohm-cm
E - 24/125; IPC-TM-650.2.5.17.1
Surface Resistance 1.00e+13 ohm
1.00e+13 ohm
C - 96/35/90; IPC-TM-650.2.5.17.1
1.00e+13 ohm
1.00e+13 ohm
E - 24/125; IPC-TM-650.2.5.17.1
Dielectric Constant 3.2

@Frequency 1.00e+10 Hz
3.2

@Frequency 1.00e+10 Hz
50% Resin Content; Stripline; IPC-TM-650.2.5.5.5
3.3

@Frequency 1.00e+9 Hz
3.3

@Frequency 1.00e+9 Hz
50% Resin Content; RF Impedance; IPC-TM-650.2.5.5.9
Dielectric Strength 59.1 kV/mm
1500 kV/in
IPC-TM-650.2.5.6.2
Dielectric Breakdown >= 50000 V
>= 50000 V
IPC-TM-650.2.5.6
Dissipation Factor 0.0060

@Frequency 1.00e+10 Hz
0.0060

@Frequency 1.00e+10 Hz
50% Resin Content; Stripline; IPC-TM-650.2.5.5.5
Arc Resistance 125 sec
125 sec
IPC-TM-650.2.5.1
Descriptive Properties Value Comments
Pressure Cooker Pass
60 min then solder dip @288°C until failure (max 10 min.); IPC-TM-650.2.6.16 (modified)
T260 (minutes) 60+
IPC-TM-650.2.4.24.1
T288 (minutes) 30+
IPC-TM-650.2.4.24.1
Z Axis Expansion (%) 2.5
50-260°C; IPC-TM-650.2.4.41
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