Thermal Properties | Metric | English | Comments |
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CTE, linear | 55.0 - 75.0 µm/m-°C | 30.6 - 41.7 µin/in-°F | Polykemi |
Polykemi AB POLYfill PP EIP12030F Polypropylene/EPDM, Mineral Reinforced Information provided by Polykemi AB |
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CTE, linear | 55.0 µm/m-°C @Temperature -30.0 - 80.0 °C |
30.6 µin/in-°F @Temperature -22.0 - 176 °F |
ASTM E228 |
Solvay Engineered Polymers SEQUEL® 1783 Engineered Polyolefin
(discontinued **) Description: SEQUEL® 1783 engineered polyolefin is designed for large, mold-in-color automotive exterior applications that require dimensional stability over a broad temperature range. This materi.. |
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CTE, linear | 55.0 - 162 µm/m-°C | 30.6 - 90.0 µin/in-°F | Average value: 87.4 µm/m-°C Grade Count:106 |
Overview of materials for Cyanoacrylate Adhesive This property data is a summary of similar materials in the MatWeb database for the category "Cyanoacrylate Adhesive". Each property range of values reported is minimum and maximum values of appropr.. |
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CTE, linear | 55.0 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
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Humiseal 1B31LSE Acrylic Conformal Coating Humiseal 1B31LSE Acrylic Conformal CoatingHigh moisture resistanceExcellent dielectrical propertiesSelective chemical resistanceExcellent repairabilityMIL-I-46058C Approval PendingPasses thermal sho.. |
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CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | DIN 53752 |
Lehmann & Voss LUVOCOM® 1502-7866/GN4 PPSU, unreinforced Applications: Automotive industry, medical- and precision engineering, aircraft industry.Especially suitable for medical parts, superheated steam sterilizable, hydrolysis resistanceHigh chemical res.. |
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CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | DIN 53752 |
Lehmann & Voss LUVOCOM® 1502-7867/BL4 PPSU, unreinforced Applications: Automotive industry, medical- and precision engineering, aircraft industry.Especially suitable for medical parts, superheated steam sterilizable, hydrolysis resistanceHigh chemical res.. |
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CTE, linear | 55.0 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
Vertical Direction; ASTM D696 |
Mitsui Arlen™ A315 15% Glass Fiber-Reinforced Modified Nylon 6T (COND) ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss.. |
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CTE, linear | 55.0 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
Vertical Direction; ASTM D696 |
Mitsui Arlen™ C215 15% Glass Fiber-Reinforced Modified Nylon 6T (COND) ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss.. |
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CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | DIN 53752 |
Lehmann & Voss LUVOCOM® 1-7180/EG Polyamide 66, with carbon fiber, PTFE, lubricant modified, high viscosity, heat stabilized Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.Improved friction and wear behaviour. Emergency running property.Isotropic shrinkage characteri.. |
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CTE, linear | 55.0 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Stratasys® Polyphenylsulfone PPSF/PPSU (polyphenylsulfone) material has the greatest strength, heat and chemical resistance of all Stratasys materials - ideal for aerospace, automotive and medical applications. Stratasys FDM (F.. |
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CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | ASTM D696 |
Samyang Trirex® 3025N1 Polycarbonate, Flame Retardant TRIREX® polycarbonate resins offer superior transparency, mechanical properties, good dimensional stability and high electrical performance, which allows it to be widely used for electrical, elec.. |
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CTE, linear | 55.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
30.6 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
SABIC Innovative Plastics Noryl HS2000 PPE (Asia Pacific) This data was supplied by SABIC-IP for the Asia Pacific region. |
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CTE, linear | 55.0 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond FS279 Blush-Free Non-Sag Structural Epoxy Adhesive TRA-BOND FS-279 is a two-part epoxy adhesive specifically formulated to be non-sagging and have improved adhesion to smooth, non-porous substrates such as glass, ceramic, stainless steel, etc. This .. |
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CTE, linear | 55.0 µm/m-°C @Temperature -30.0 - 80.0 °C |
30.6 µin/in-°F @Temperature -22.0 - 176 °F |
Borealis Method |
Borealis Daplen™ EF267AI Polypropylene TPO Compound Daplen™ EF267AI is a 20 % mineral filled polypropylene compound intended for injection molding. This material has an excellent balance between impact strength and stiffness and is easy to process... |
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CTE, linear | 55.0 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond 2104 Rigid Epoxy Staking Compound TRA-BOND 2104 is a thixotropic epoxy system recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-s.. |
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CTE, linear | 55.0 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond 2105 Clear Rigid, Medium Viscosity Epoxy Adhesive TRA-BOND 2105 is a clear, medium viscosity epoxy adhesive which contains no solvents or other additives which can be harmful to the environment or to its users. It has excellent adhesion to glass, c.. |
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CTE, linear | 55.0 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond 2115 Clear High Strength Epoxy Adhesive TRA-BOND 2115 is a clear, low viscosity epoxy formulation used in the fabrication of lasers. It is capable of withstanding 30 seconds of 60 watt direct laser energy. The low cure shrinkage (using a .. |
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CTE, linear | 55.0 µm/m-°C @Temperature 23.0 - 260 °C |
30.6 µin/in-°F @Temperature 73.4 - 500 °F |
ASTM D696 |
Daelim H&L Plavis-N CM Unfilled Aromatic Polyimide Bearing Compression Molded. Plavis-N: Best physical properties, maximum electrical and thermal insulation, low out-gassing, superior radiation resistance.General Plavis information for all grades:PLAVIS po.. |
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CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® 509FM-1 General Purpose Epoxy Product Description: EPO-TEK® 509FM-1 is a two component, optically opaque epoxy designed for potting of semiconductors, PCB and systems-level electronics. It can be used in many electronic indust.. |
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CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | |
Hippe PI Wide temperature range for use. High oxidation resistance. UV stability, low coefficient of linear expansion, good strength at high temperatures, resistance against stress cracking.Information pro.. |
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CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | ASTM E831 |
Addiplast Addinyl A2 ZP40 Nylon 66, 40% Mineral Filled Mineral filled, increased thermal aging stabilityInformation provided by Addiplast. |
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CTE, linear | 55.0 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
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Armstrong A-2/A Epoxy Adhesive This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac.. |
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CTE, linear | 55.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
30.6 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM D696 |
Beijing Chemical Industry KAIFA® 201-G20R PBT Resin 15% glass fiber reinforced, good flow and toughnessInformation provided by Beijing Chemical Industry Research Institute (Group) |
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CTE, linear | 55.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
30.6 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM D696 |
Beijing Chemical Industry KAIFA® 301-G10F PBT Resin 10% glass fiber reinforced, flame retardant, good flow, low bleedingInformation provided by Beijing Chemical Industry Research Institute (Group) |
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CTE, linear | 55.0 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Chang Chun Plastic PBT4115 Fire Retardant & 15% Glass Fiber Enforced Grade PBT Information provided by Dowell Trading Company Ltd. |
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CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | |
Resinlab® EP1026HP Epoxy Adhesive Resinlab™ EP1026HP is a high performance fast setting epoxy adhesive designed for bonding metals, ceramics, glass and most plastics. This product gives good resistance to water salt spray, inorgan.. |
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CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | ASTM D696 |
Gromax CCP PBT 3010-104 10% Glass Fiber Filled Product Description: PBT glass fiber 10% reinforced injection molding grade.Characteristics:Excellent electrical property Excellent temperature resistance, high heat distortion temperature Excellent.. |
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CTE, linear | 55.0 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
Vertical Direction; ASTM D696 |
Mitsui Arlen™ C215 15% Glass Fiber-Reinforced Modified Nylon 6T (DAM) ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it possesses .. |
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CTE, linear | 55.0 - 65.0 µm/m-°C @Temperature 20.0 °C |
30.6 - 36.1 µin/in-°F @Temperature 68.0 °F |
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Abatron AboCast/AboCure 8109-7 Processing: 100/80 pbw; Potlife: 6-7 days/20°C (68°F), 12-24 h/40°C (105°F), 0.75-7 h /60°C (140°F); mix at 50-80°C (120-175°F); cures in: 1 h/100°C (212°F) + 4 h/150°C (300°F) postcure... |
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CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | |
Resinlab® EP1310 Medium Reactivity Epoxy Encapsulant Resinlab™ EP1310 is a two part medium reactivity epoxy encapsulant capable of being quickly gelled prior to full cure by exposing to a UV light source. Usually 5- 10 seconds is sufficient to gel th.. |