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Polymer Property : CTE, linear = 55.0 µm/m-°C Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 55.0 - 65.0 µm/m-°C | 30.6 - 36.1 µin/in-°F | Polykemi |
| Polykemi AB POLYelast TPE HJ753 Thermoplastic Elastomer, PP/Elastomer, Mineral Reinforced Information provided by Polykemi AB |
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| CTE, linear | 55.0 - 75.0 µm/m-°C | 30.6 - 41.7 µin/in-°F | Polykemi |
| Polykemi AB POLYfill PP EIP12030F Polypropylene/EPDM, Mineral Reinforced Information provided by Polykemi AB |
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| CTE, linear | 55.0 µm/m-°C @Temperature 23.0 - 100 °C |
30.6 µin/in-°F @Temperature 73.4 - 212 °F |
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| Quadrant EPP Quadrant PPSU unfilled, extruded (ISO Data) Quadrant PPSU is a black, amorphous high performance thermoplastic, offering better impact strength and chemical resistance than polysulfone and polyetherimide. Quadrant PPSU also has superior hydro.. |
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| CTE, linear | 55.0 µm/m-°C @Temperature -30.0 - 80.0 °C |
30.6 µin/in-°F @Temperature -22.0 - 176 °F |
ASTM E228 |
| Solvay Engineered Polymers SEQUEL® 1733HI Engineered Polyolefin
(discontinued **) Description: SEQUEL® 1733HI engineered polyolefin is designed for large, painted automotive exterior applications that require dimensional stability over a broad temperature range. This material e.. |
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| CTE, linear | 55.0 - 75.0 µm/m-°C | 30.6 - 41.7 µin/in-°F | Polykemi |
| Polykemi AB POLYfill PP EIP12030RF Polypropylene/EPDM, Mineral Reinforced Information provided by Polykemi AB |
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| CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1502-7867/BL4 PPSU, unreinforced Applications: Automotive industry, medical- and precision engineering, aircraft industry.Especially suitable for medical parts, superheated steam sterilizable, hydrolysis resistanceHigh chemical res.. |
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| CTE, linear | 55.0 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
Vertical Direction; ASTM D696 |
| Mitsui Arlen™ C215 15% Glass Fiber-Reinforced Modified Nylon 6T (COND) ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss.. |
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| CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1100-7337/WT Polyether sulfone, unreinforced Applications: Apparatus- and precision engineering, film- and photo industry, sporting- and leisure goods, medical- and electrical enineering, aircraft- and aerospace industry.High dimensionally sta.. |
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| CTE, linear | 55.0 µm/m-°C @Temperature 40.0 - 130 °C |
30.6 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
| Plenco 2369 Phenolic, Granular, Compression Molded PLENCO 02369 is a general purpose, organic filled phenolic molding compound, formulated to minimize the generation of free ammonia for applications that are sensitive to such formation. PLENCO 02369.. |
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| CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | Absolute Drying; ASTM-D696 |
| Toyobo GLAMIDE® TY-145TZ Nylon-6 GLAMIDE® is very tough and exhibits high abrasion resistance. It has a high melting point and heat resistance, has well-balanced proportions of mechanical properties, performs self-distinguishing a.. |
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| CTE, linear | 55.0 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
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| Tra-Con Tra-Bond 2111 Rigid Epoxy Staking Compound TRA-BOND 2111 is a thixotropic epoxy resin and hardener formulation developed for industrial adhesive, staking, laminating, repair and manufacturing applications where long pot-life, good wetting, n.. |
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| CTE, linear | 55.0 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
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| Tra-Con Tra-Bond 2135D High Impact Epoxy Adhesive TRA-BOND 2135D is a medium viscosity epoxy adhesive recommended for bonding, laminating, sealing, and structural repair applications where easy mixing and good wetting combined with high impact stre.. |
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| CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | Below Tg |
| Tra-Con Tra-Bond 77-1S One Component SMD Adhesive TRA-BOND 77-1S one component, solvent-free, insulating epoxy adhesive is designed specifically for attaching surface mounted devices (SMDs) to printed circuit boards prior to wave solder. TRA-BOND 7.. |
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| CTE, linear | 55.0 - 65.0 µm/m-°C | 30.6 - 36.1 µin/in-°F | |
| Master Bond UV15DC80 One Component, UV and Heat Curable Epoxy System Master Bond UV15DC80 is a special dual cure epoxy based system which offers a primary cure utilizing UV light along with a secondary heat curing mechanism. This system addresses the problem of curin.. |
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| CTE, linear | 55.0 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
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| Tra-Con Tra-Bond FS12 Fast Cure Epoxy Adhesive System TRA-BOND FS12 is an epoxy resin formulation developed for room temperature bonding applications where a fast cure epoxy adhesive is needed. This effective epoxy formulation consists of 100% reactive.. |
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| CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® OG142-112 UV Cure Optical Epoxy Material Description: Single component, medium viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application. Replacement version of EPO-TE.. |
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| CTE, linear | 55.0 - 60.0 µm/m-°C | 30.6 - 33.3 µin/in-°F | |
| Hippe PEI A material with very high mechanical strength and high thermoforming stability which can be used at high temperatures. Distinguished by constant dielectric properties, a wide range of frequency and .. |
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| CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | ASTM E831 |
| Addiplast Addinyl A2 ZP40 Nylon 66, 40% Mineral Filled Mineral filled, increased thermal aging stabilityInformation provided by Addiplast. |
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| CTE, linear | 55.0 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
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| Armstrong A-271 Epoxy Adhesive A clear amber adhesive system. A-271 is a medium viscosity liquid with excellent wetting ability. It is ideal for bonding glass or similar smooth surfaces. It features very low shrinkage coupled .. |
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| CTE, linear | 55.0 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Chang Chun Plastic PBT4815 Fire Retardant & 15% Glass Fiber Enforced Grade PBT Information provided by Dowell Trading Company Ltd. |
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| CTE, linear | 55.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
30.6 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM D696 |
| Beijing Chemical Industry KAIFA® 301-G10F PBT Resin 10% glass fiber reinforced, flame retardant, good flow, low bleedingInformation provided by Beijing Chemical Industry Research Institute (Group) |
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| CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | |
| Atom Adhesives AA-BOND 2112 Epoxy Adhesive AA-BOND 2112 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-s.. |
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| CTE, linear | 55.0 - 65.0 µm/m-°C | 30.6 - 36.1 µin/in-°F | Polykemi |
| Polykemi AB POLYfill PPH BF405510 VT1 Polypropylene Homopolymer, Reinforced, Heat Resistant Information provided by Polykemi AB |
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| CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | ASTM D696 |
| Gromax CCP PBT 3010-104 10% Glass Fiber Filled Product Description: PBT glass fiber 10% reinforced injection molding grade.Characteristics:Excellent electrical property Excellent temperature resistance, high heat distortion temperature Excellent.. |
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| CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | ASTM D696 |
| Gromax CCP PBT 4815-NCB 15% Glass Fiber Filled Product Description: A glass fiber 15% reinforced injection molding grade. Characteristics:Excellent electrical property Excellent temperature resistance, high heat distortion temperature Excellent .. |
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| CTE, linear | 55.0 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
Vertical Direction; ASTM D696 |
| Mitsui Arlen™ C215 15% Glass Fiber-Reinforced Modified Nylon 6T (DAM) ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it possesses .. |
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| CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | |
| Resinlab® EP1310 Medium Reactivity Epoxy Encapsulant Resinlab™ EP1310 is a two part medium reactivity epoxy encapsulant capable of being quickly gelled prior to full cure by exposing to a UV light source. Usually 5- 10 seconds is sufficient to gel th.. |
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| CTE, linear | 55.0 - 75.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
30.6 - 41.7 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
| SABIC Innovative Plastics NORYL EX130 PPE+HIPS (Asia Pacific) PPE+PS Auto Exterior Grade |
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