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Polymer Property : CTE, linear = 55.0 µm/m-°C Product List

Thermal Properties

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Thermal Properties Metric English Comments
CTE, linear 55.0 - 75.0 µm/m-°C
30.6 - 41.7 µin/in-°F
Polykemi
Polykemi AB POLYfill PP EIP12030F Polypropylene/EPDM, Mineral Reinforced
Information provided by Polykemi AB
CTE, linear 55.0 µm/m-°C

@Temperature -30.0 - 80.0 °C
30.6 µin/in-°F

@Temperature -22.0 - 176 °F
ASTM E228
Solvay Engineered Polymers SEQUEL® 1783 Engineered Polyolefin  (discontinued **)
Description: SEQUEL® 1783 engineered polyolefin is designed for large, mold-in-color automotive exterior applications that require dimensional stability over a broad temperature range. This materi..
CTE, linear 55.0 - 162 µm/m-°C
30.6 - 90.0 µin/in-°F
Average value: 87.4 µm/m-°C Grade Count:106
Overview of materials for Cyanoacrylate Adhesive
This property data is a summary of similar materials in the MatWeb database for the category "Cyanoacrylate Adhesive". Each property range of values reported is minimum and maximum values of appropr..
CTE, linear 55.0 µm/m-°C

@Temperature 20.0 °C
30.6 µin/in-°F

@Temperature 68.0 °F
Humiseal 1B31LSE Acrylic Conformal Coating
Humiseal 1B31LSE Acrylic Conformal CoatingHigh moisture resistanceExcellent dielectrical propertiesSelective chemical resistanceExcellent repairabilityMIL-I-46058C Approval PendingPasses thermal sho..
CTE, linear 55.0 µm/m-°C
30.6 µin/in-°F
DIN 53752
Lehmann & Voss LUVOCOM® 1502-7866/GN4 PPSU, unreinforced
Applications: Automotive industry, medical- and precision engineering, aircraft industry.Especially suitable for medical parts, superheated steam sterilizable, hydrolysis resistanceHigh chemical res..
CTE, linear 55.0 µm/m-°C
30.6 µin/in-°F
DIN 53752
Lehmann & Voss LUVOCOM® 1502-7867/BL4 PPSU, unreinforced
Applications: Automotive industry, medical- and precision engineering, aircraft industry.Especially suitable for medical parts, superheated steam sterilizable, hydrolysis resistanceHigh chemical res..
CTE, linear 55.0 µm/m-°C

@Temperature 20.0 °C
30.6 µin/in-°F

@Temperature 68.0 °F
Vertical Direction; ASTM D696
Mitsui Arlenâ„¢ A315 15% Glass Fiber-Reinforced Modified Nylon 6T (COND)
ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss..
CTE, linear 55.0 µm/m-°C

@Temperature 20.0 °C
30.6 µin/in-°F

@Temperature 68.0 °F
Vertical Direction; ASTM D696
Mitsui Arlenâ„¢ C215 15% Glass Fiber-Reinforced Modified Nylon 6T (COND)
ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss..
CTE, linear 55.0 µm/m-°C
30.6 µin/in-°F
DIN 53752
Lehmann & Voss LUVOCOM® 1-7180/EG Polyamide 66, with carbon fiber, PTFE, lubricant modified, high viscosity, heat stabilized
Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.Improved friction and wear behaviour. Emergency running property.Isotropic shrinkage characteri..
CTE, linear 55.0 µm/m-°C

@Temperature 20.0 °C
30.6 µin/in-°F

@Temperature 68.0 °F
ASTM D696
Stratasys® Polyphenylsulfone
PPSF/PPSU (polyphenylsulfone) material has the greatest strength, heat and chemical resistance of all Stratasys materials - ideal for aerospace, automotive and medical applications. Stratasys FDM (F..
CTE, linear 55.0 µm/m-°C
30.6 µin/in-°F
ASTM D696
Samyang Trirex® 3025N1 Polycarbonate, Flame Retardant
TRIREX® polycarbonate resins offer superior transparency, mechanical properties, good dimensional stability and high electrical performance, which allows it to be widely used for electrical, elec..
CTE, linear 55.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
30.6 µin/in-°F

@Temperature -22.0 - 86.0 °F
TMA
SABIC Innovative Plastics Noryl HS2000 PPE (Asia Pacific)
This data was supplied by SABIC-IP for the Asia Pacific region.
CTE, linear 55.0 µm/m-°C

@Temperature 20.0 °C
30.6 µin/in-°F

@Temperature 68.0 °F
Tra-Con Tra-Bond FS279 Blush-Free Non-Sag Structural Epoxy Adhesive
TRA-BOND FS-279 is a two-part epoxy adhesive specifically formulated to be non-sagging and have improved adhesion to smooth, non-porous substrates such as glass, ceramic, stainless steel, etc. This ..
CTE, linear 55.0 µm/m-°C

@Temperature -30.0 - 80.0 °C
30.6 µin/in-°F

@Temperature -22.0 - 176 °F
Borealis Method
Borealis Daplen™ EF267AI Polypropylene TPO Compound
Daplen™ EF267AI is a 20 % mineral filled polypropylene compound intended for injection molding. This material has an excellent balance between impact strength and stiffness and is easy to process...
CTE, linear 55.0 µm/m-°C

@Temperature 20.0 °C
30.6 µin/in-°F

@Temperature 68.0 °F
Tra-Con Tra-Bond 2104 Rigid Epoxy Staking Compound
TRA-BOND 2104 is a thixotropic epoxy system recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-s..
CTE, linear 55.0 µm/m-°C

@Temperature 20.0 °C
30.6 µin/in-°F

@Temperature 68.0 °F
Tra-Con Tra-Bond 2105 Clear Rigid, Medium Viscosity Epoxy Adhesive
TRA-BOND 2105 is a clear, medium viscosity epoxy adhesive which contains no solvents or other additives which can be harmful to the environment or to its users. It has excellent adhesion to glass, c..
CTE, linear 55.0 µm/m-°C

@Temperature 20.0 °C
30.6 µin/in-°F

@Temperature 68.0 °F
Tra-Con Tra-Bond 2115 Clear High Strength Epoxy Adhesive
TRA-BOND 2115 is a clear, low viscosity epoxy formulation used in the fabrication of lasers. It is capable of withstanding 30 seconds of 60 watt direct laser energy. The low cure shrinkage (using a ..
CTE, linear 55.0 µm/m-°C

@Temperature 23.0 - 260 °C
30.6 µin/in-°F

@Temperature 73.4 - 500 °F
ASTM D696
Daelim H&L Plavis-N CM Unfilled Aromatic Polyimide Bearing
Compression Molded. Plavis-N: Best physical properties, maximum electrical and thermal insulation, low out-gassing, superior radiation resistance.General Plavis information for all grades:PLAVIS po..
CTE, linear 55.0 µm/m-°C
30.6 µin/in-°F
Below Tg
Epoxy Technology EPO-TEK® 509FM-1 General Purpose Epoxy
Product Description: EPO-TEK® 509FM-1 is a two component, optically opaque epoxy designed for potting of semiconductors, PCB and systems-level electronics. It can be used in many electronic indust..
CTE, linear 55.0 µm/m-°C
30.6 µin/in-°F
Hippe PI
Wide temperature range for use. High oxidation resistance. UV stability, low coefficient of linear expansion, good strength at high temperatures, resistance against stress cracking.Information pro..
CTE, linear 55.0 µm/m-°C
30.6 µin/in-°F
ASTM E831
Addiplast Addinyl A2 ZP40 Nylon 66, 40% Mineral Filled
Mineral filled, increased thermal aging stabilityInformation provided by Addiplast.
CTE, linear 55.0 µm/m-°C

@Temperature 20.0 °C
30.6 µin/in-°F

@Temperature 68.0 °F
Armstrong A-2/A Epoxy Adhesive
This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac..
CTE, linear 55.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
30.6 µin/in-°F

@Temperature -22.0 - 86.0 °F
ASTM D696
Beijing Chemical Industry KAIFA® 201-G20R PBT Resin
15% glass fiber reinforced, good flow and toughnessInformation provided by Beijing Chemical Industry Research Institute (Group)
CTE, linear 55.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
30.6 µin/in-°F

@Temperature -22.0 - 86.0 °F
ASTM D696
Beijing Chemical Industry KAIFA® 301-G10F PBT Resin
10% glass fiber reinforced, flame retardant, good flow, low bleedingInformation provided by Beijing Chemical Industry Research Institute (Group)
CTE, linear 55.0 µm/m-°C

@Temperature 20.0 °C
30.6 µin/in-°F

@Temperature 68.0 °F
ASTM D696
Chang Chun Plastic PBT4115 Fire Retardant & 15% Glass Fiber Enforced Grade PBT
Information provided by Dowell Trading Company Ltd.
CTE, linear 55.0 µm/m-°C
30.6 µin/in-°F
Resinlab® EP1026HP Epoxy Adhesive
Resinlab™ EP1026HP is a high performance fast setting epoxy adhesive designed for bonding metals, ceramics, glass and most plastics. This product gives good resistance to water salt spray, inorgan..
CTE, linear 55.0 µm/m-°C
30.6 µin/in-°F
ASTM D696
Gromax CCP PBT 3010-104 10% Glass Fiber Filled
Product Description: PBT glass fiber 10% reinforced injection molding grade.Characteristics:Excellent electrical property Excellent temperature resistance, high heat distortion temperature Excellent..
CTE, linear 55.0 µm/m-°C

@Temperature 20.0 °C
30.6 µin/in-°F

@Temperature 68.0 °F
Vertical Direction; ASTM D696
Mitsui Arlen™ C215 15% Glass Fiber-Reinforced Modified Nylon 6T (DAM)
ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it possesses ..
CTE, linear 55.0 - 65.0 µm/m-°C

@Temperature 20.0 °C
30.6 - 36.1 µin/in-°F

@Temperature 68.0 °F
Abatron AboCast/AboCure 8109-7
Processing: 100/80 pbw; Potlife: 6-7 days/20°C (68°F), 12-24 h/40°C (105°F), 0.75-7 h /60°C (140°F); mix at 50-80°C (120-175°F); cures in: 1 h/100°C (212°F) + 4 h/150°C (300°F) postcure...
CTE, linear 55.0 µm/m-°C
30.6 µin/in-°F
Resinlab® EP1310 Medium Reactivity Epoxy Encapsulant
Resinlab™ EP1310 is a two part medium reactivity epoxy encapsulant capable of being quickly gelled prior to full cure by exposing to a UV light source. Usually 5- 10 seconds is sufficient to gel th..
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