Epoxy Technology EPO-TEK® 509FM-1 General Purpose Epoxy

Category	Polymer , Thermoset , Epoxy
Manufacturer	Epoxy Technology
Trade Name	EPO-TEK®
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxy Technology EPO-TEK® 509FM-1 General Purpose Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Product Description: EPO-TEK® 509FM-1 is a two component, optically opaque epoxy designed for potting of semiconductors, PCB and systems-level electronics. It can be used in many electronic industries such as consumer, military, medical and optical/OEM. Advantages & Application Notes:Low viscosity resin allows for ease of pouring and potting into cavities with minimal void formation.Special care should be used when mixing large masses.Opaque black while maintaining its high insulation propertiesAlso, available in a thixotropic version called EPO-TEK® 509EBT-M1. Compatible with dispensing, pouring and spin coating applicationsSuggested Applications:Optics: cutting of IR and VIS light in range of 300 to 2000 nm.Electronics; potting cables and wires into connectors, electrically isolating pins of connectors Semiconductor: a glob top over IC’s using the COB packaging formatInformation Provided by Epoxy Technology

Physical Properties	Metric	English	Comments
Specific Gravity	1.01 g/cc	1.01 g/cc	Part B
	1.16 g/cc	1.16 g/cc	Part A
Viscosity	400 - 1000 cP @Temperature 23.0 °C	400 - 1000 cP @Temperature 73.4 °F	100 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	85	85
Tensile Modulus	2.26 GPa	328 ksi	Storage
Shear Strength	11.75 MPa	1704 psi	Lap
	>= 23.4 MPa	>= 3400 psi	Die

Thermal Properties	Metric	English	Comments
CTE, linear	55.0 µm/m-°C	30.6 µin/in-°F	Below Tg
	191 µm/m-°C	106 µin/in-°F	Above Tg
Maximum Service Temperature, Air	200 °C	392 °F	Continuous
	300 °C	572 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 40.0 °C	>= 104 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature	365 °C	689 °F	Degradation Temperature

Optical Properties	Metric	English	Comments
Transmission, Visible	<= 5.0 % @Wavelength 400 - 2500 nm	<= 5.0 % @Wavelength 400 - 2500 nm	Spectral

Electrical Properties	Metric	English
Volume Resistivity	<= 3.00e+13 ohm-cm	<= 3.00e+13 ohm-cm
Dielectric Constant	3.65 @Frequency 1000 Hz	3.65 @Frequency 1000 Hz
Dissipation Factor	0.0070 @Frequency 1000 Hz	0.0070 @Frequency 1000 Hz

Processing Properties	Metric	English	Comments
Cure Time	120 min @Temperature 60.0 °C	2.00 hour @Temperature 140 °F	Minimum Bond Line
	1440 min @Temperature 23.0 °C	24.0 hour @Temperature 73.4 °F	Minimum Bond Line
Pot Life	20 min	20 min
Shelf Life	12.0 Month @Temperature 25.0 °C	12.0 Month @Temperature 77.0 °F

Descriptive Properties	Value	Comments
Color	Amber	Part B
	Black	Part A
Consistency	Pourable liquid
Mix Ratio By Weight	100:65
Number of Components	Two
Weight Loss	0.29%	200°C
	1.14%	250°C
	3.47%	300°C

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