Thermal Properties | Metric | English | Comments |
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CTE, linear | 16.0 µm/m-°C | 8.89 µin/in-°F | X-Direction; TMA; 10°C/min; ASTM D3386; IPC-TM-650 2.4.41 |
Rogers Corporation RT/duroid® 6002 High Frequency Laminate Features:Low loss for excellent high frequency performanceTight dielectric constant and thickness controlExcellent electrical and mechanical propertiesExtremely low thermal coefficient of dielectric.. |
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CTE, linear | 16.0 µm/m-°C | 8.89 µin/in-°F | Y-Direction; TMA; 10°C/min; ASTM D3386; IPC-TM-650 2.4.41 |
Rogers Corporation RT/duroid® 6002 High Frequency Laminate Features:Low loss for excellent high frequency performanceTight dielectric constant and thickness controlExcellent electrical and mechanical propertiesExtremely low thermal coefficient of dielectric.. |
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CTE, linear | 16.0 µm/m-°C | 8.89 µin/in-°F | Below glass transition temp; ASTM D696 |
Performance Polymers IPS II PPL-C4150 PEKK (Polyetherketoneketone) Linear 30 % Glass Fiber Reinforced Molding Grade Amber pelletsInformation provided by Infinite Polymer System II. |
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CTE, linear | 16.0 µm/m-°C | 8.89 µin/in-°F | ASTM D696 |
Solvay Specialty Polymers Torlon® 5030 Polyamide-imide (PAI)
(Unverified Data**) Torlon 5030 is a 30% glass-fiber reinforced grade of polyamide-imide (PAI) resin. It offers high strength and modulus and exceptional creep resistance. It has thermal expansion characteristics simil.. |
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CTE, linear | 16.0 - 85.5 µm/m-°C | 8.89 - 47.5 µin/in-°F | Average value: 50.8 µm/m-°C Grade Count:37 |
Overview of materials for Epoxy Cure Resin This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Cure Resin". Each property range of values reported is minimum and maximum values of appropriate M.. |
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CTE, linear | 16.0 µm/m-°C @Temperature 20.0 °C |
8.89 µin/in-°F @Temperature 68.0 °F |
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Cookson Group Plaskon® SMT-B-1 LAS (146.408) Epoxy Molding Compound for PBGAs
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound optimized specifically for grid arrays (BGA/LGA) requiring low alpha particle count. It is formulated .. |
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CTE, linear | 16.0 - 55.0 µm/m-°C | 8.89 - 30.6 µin/in-°F | Average value: 35.9 µm/m-°C Grade Count:9 |
Overview of materials for Phenolic, Novolac, Mineral Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Mineral Filled". Each property range of values reported is minimum and maximum values.. |
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CTE, linear | 16.0 µm/m-°C | 8.89 µin/in-°F | DIN 53752 |
Lehmann & Voss LUVOCOM® 7/CF/30/BK Polyamide 610, with carbon fiber Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Especially suitable at dynamic.. |
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CTE, linear | 16.0 µm/m-°C | 8.89 µin/in-°F | DIN 53752 |
Lehmann & Voss LUVOCOM® 8-7190 High impact polyamide, with carbon fiber, toughness-modified Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Especially suitable at dynamic.. |
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CTE, linear | 16.0 µm/m-°C @Thickness 1.57 mm, Temperature 20.0 °C |
8.89 µin/in-°F @Thickness 0.0620 in, Temperature 68.0 °F |
x-axis; IPC-TM 650-2.4.24 |
Industrial Laminates/Norplex NP691 Paper Base Laminate Description: Flame resistant, room temperature punching grade. NP691 is very similar to NP612 in electrical properties and mechanical strength, with improved moisture resistance.Thickness Tested: 0... |
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CTE, linear | 16.0 µm/m-°C | 8.89 µin/in-°F | |
Hexcel® HexPly® F263 Epoxy Resin HexPly® F263 is a structural, heat resistant epoxy resin formulated for excellent translation of high modulus carbon fiber properties in typically aerospace applications. HexPly® F263 is a high te.. |
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CTE, linear | 16.0 µm/m-°C @Temperature 20.0 °C |
8.89 µin/in-°F @Temperature 68.0 °F |
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Cosmic Plastics D72 Short Glass Fiber Filled Ortho Diallyl Phthalate Molding Compound Data provided by the manufacturer. |
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CTE, linear | 16.0 µm/m-°C | 8.89 µin/in-°F | Absolute Drying; ASTM-D696 |
Toyobo GLAMIDE® TY-592GHV 6T-Nylon GLAMIDE® is very tough and exhibits high abrasion resistance. It has a high melting point and heat resistance, has well-balanced proportions of mechanical properties, performs self-distinguishing a.. |
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CTE, linear | 16.0 µm/m-°C @Temperature 0.000 - 100 °C |
8.89 µin/in-°F @Temperature 32.0 - 212 °F |
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CLAL-MSX NICLAL 1300 0 Annealed Copper Alloy, Free Cutting Nickel-Silver Main Characteristics: Good ductilityGood corrosion resistanceTypical Applications:High volume turned partsKeysInformation provided by CLAL-MSX |
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CTE, linear | 16.0 µm/m-°C @Temperature 0.000 - 100 °C |
8.89 µin/in-°F @Temperature 32.0 - 212 °F |
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CLAL-MSX NICLAL 1800 H12 1/2 Hard Copper Alloy, Free Cutting Nickel-Silver Main Characteristics: Good corrosion resistanceHigh mechanical propertiesTypical Applications:Parts subject to high stressHigh quality fastenersInformation provided by CLAL-MSX |
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CTE, linear | 16.0 µm/m-°C | 8.89 µin/in-°F | x, before Tg; IPC TM-650 2.4.24 |
Arlon 25FR Low-Cost Ceramic Hydrocarbon High Frequency, Low Loss Thermoset Laminate and Prepreg for Double-sided, Multilayer and Mixed Dielectric Printed Circuit BoardsLow loss ceramic-filled thermoset resinTight dielectric tolerance cont.. |
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CTE, linear | 16.0 µm/m-°C | 8.89 µin/in-°F | |
Arlon 37N Polyimide Low-Flow 37N is a polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is requir.. |
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CTE, linear | 16.0 µm/m-°C @Temperature 20.0 °C |
8.89 µin/in-°F @Temperature 68.0 °F |
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California Fine Wire Nickel Alloy 90 Copper Nickel Resistance Wire All values may vary dependent on specific design and usageCapabilities: WireRibbonSquareInsulatedPlatedInformation provided by California Fine Wire. |
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CTE, linear | 16.0 µm/m-°C @Temperature 20.0 °C |
8.89 µin/in-°F @Temperature 68.0 °F |
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AIM 80Au/20Sn Solder for Photonic Packaging Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials. |
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CTE, linear | 16.0 µm/m-°C | 8.89 µin/in-°F | x direction |
Arlon AD255A Glass, PTFE and Micro-Dispersed Ceramic Lower Loss and Improved Performance over Traditional AD Series.Information provided by Arlon Materials for Electronics (MED). |
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CTE, linear | 16.0 µm/m-°C @Temperature 0.000 - 100 °C |
8.89 µin/in-°F @Temperature 32.0 - 212 °F |
IPC TM-650 2.4.24 |
Arlon AD260A PTFE/Woven Fiberglass/Microdispersed Ceramic Filled Laminate for RF & Microwave PCBs For RF & Microwave Printed Circuit Boards. Low Loss PTFE and Ceramic Filled Composite Dielectric Constant (2.60)Low Dielectric Loss (Loss Tangent)Low Profile Copper (lower conductive losses)Low Z-d.. |