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Hexcel® HexPly® F263 Epoxy Resin

Category Polymer , Thermoset , Epoxy , Epoxy Cure Resin
Manufacturer Hexcel
Trade Name HexPly®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Hexcel® HexPly® F263 Epoxy Resin.pdf
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Material Notes:
HexPly® F263 is a structural, heat resistant epoxy resin formulated for excellent translation of high modulus carbon fiber properties in typically aerospace applications. HexPly® F263 is a high temperature, aerospace grade, epoxy resin for HMG with a 350ºF (177ºC) core.Information provided by HexCel
Physical Properties Metric English Comments
Specific Gravity 1.267 g/cc
1.267 g/cc
Moisture Absorption at Equilibrium 4.8 %
4.8 %
Mechanical Properties Metric English Comments
Tensile Strength, Yield 75.0 MPa
10900 psi
Elongation at Yield 2.4 %
2.4 %
Tensile Modulus 4.27 GPa
619 ksi
Fracture Toughness 0.600 MPa-m½
0.546 ksi-in½
Thermal Properties Metric English Comments
CTE, linear 16.0 µm/m-°C
8.89 µin/in-°F
Glass Transition Temp, Tg 133 °C
271 °F
Wet
188 °C
370 °F
Dry
Processing Properties Metric English Comments
Gel Time 2.00 - 9.00 min

@Temperature 177 °C
2.00 - 9.00 min

@Temperature 351 °F
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