Songhan Plastic Technology Co.,Ltd.
 POLYMER SEARCH

Arlon 37N Polyimide Low-Flow

Category Polymer , Thermoset , Polyimide, TS
Manufacturer Arlon
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Arlon 37N Polyimide Low-Flow.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
37N is a polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is required.Tg > 200°C and expansion characteristics typical of polyimide greatly improves PTH reliabilityGood bond strength to Kapton® polyimide, copper and other metalsCurable at temperatures as low as 350°FExcellent thermal stabilityAvailable in different flow ranges and fiberglass styles for optimal process flexibilityElectrical and mechanical properties meeting the requirements of IPC-4101/42Compatible with lead-free solder processingRoHS/WEEE compliantTypical Applications:Bonding multilayer polyimide rigid-flexAttaching heat sinks to polyimide MLBsOther applications where minimal and uniform resin flow is requiredThis data represents typical values for the production material and should not be used as material specifications.Information provided by ARLON Silicone Technologies Division.
Physical Properties Metric English Comments
Water Absorption <= 1.0 %
<= 1.0 %
IPC TM-650 2.6.2.1
Mechanical Properties Metric English Comments
Tensile Strength 221 MPa
32000 psi
IPC TM-650 2.4.18.3
Flexural Strength 414 MPa
60000 psi
IPC TM-650 2.4.4
Poissons Ratio 0.17
0.17
ASTM D3039
Peel Strength 0.736 kN/m
4.20 pli
To Kapton, as received
0.964 kN/m
5.50 pli
To Copper (1 oz./35 micron); At Elevated Temperatures; IPC TM-650 2.4.8.2
1.19 kN/m
6.80 pli
To Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8
1.61 kN/m
9.20 pli
To Copper (1 oz./35 micron); After Process Solutions; IPC TM-650 2.4.8
Thermal Properties Metric English Comments
CTE, linear 16.0 µm/m-°C
8.89 µin/in-°F
CTE, linear, Transverse to Flow 76.0 µm/m-°C
42.2 µin/in-°F
z, below Tg; IPC TM-650 2.4.24
252 µm/m-°C
140 µin/in-°F
z, above Tg; IPC TM-650 2.4.24
Thermal Conductivity 0.300 W/m-K
2.08 BTU-in/hr-ft²-°F
ASTM E1461
Glass Transition Temp, Tg 210 °C
410 °F
TMA; IPC TM-650 2.4.24
Decomposition Temperature 322 °C
612 °F
Onset; IPC TM-650 2.3.41
340 °C
644 °F
5 percent; IPC TM-650 2.3.41
Flammability, UL94 V-0
V-0
Electrical Properties Metric English Comments
Volume Resistivity 4.70e+15 ohm-cm
4.70e+15 ohm-cm
E24/125; IPC TM-650 2.5.17.1
8.20e+15 ohm-cm
8.20e+15 ohm-cm
C96/35/90; IPC TM-650 2.5.17.1
Surface Resistance 4.40e+12 ohm
4.40e+12 ohm
C96/35/90; IPC TM-650 2.5.17.1
1.20e+15 ohm
1.20e+15 ohm
E24/125; IPC TM-650 2.5.17.1
Dielectric Constant 4.25

@Frequency 1.00e+6 Hz
4.25

@Frequency 1.00e+6 Hz
may vary with resin %; IPC TM-650 2.5.5.3
Dielectric Strength 52.4 kV/mm
1330 kV/in
IPC TM-650 2.5.6.2
Dissipation Factor 0.018

@Frequency 1.00e+6 Hz
0.018

@Frequency 1.00e+6 Hz
IPC TM-650 2.5.5.3
Arc Resistance 124 sec
124 sec
IPC TM-650 2.5.1
Descriptive Properties Value Comments
IPC Delamination - T260 (minutes) > 60
IPC TM-650 2.4.24.1
IPC Delamination - T288 (minutes) 5
IPC TM-650 2.4.24.1
IPC Delamination - T300 (minutes) 2
IPC TM-650 2.4.24.1
Z-Axis Expansion (%) 2.3
IPC TM-650 2.4.24 (50-260°C)
Copyright © lookpolymers.com All Rights Reserved