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Polymer Property : Glass Transition Temp, Tg = 212 °F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Glass Transition Temp, Tg | 100 - 110 °C | 212 - 230 °F | |
| Hybrid Plastics POSS® EP 1000 Epoxy Adhesive EP1000 is a POSS® based epoxy adhesive with outstanding oxidative resistance to ozone, plasma, or atomic oxygen environments. The EP1000 POSS® Epoxy is also well-suited for peroxide and steam... |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Styron DL 220 Plastic Pigment Performance Features: Stiffness, high mechanical stability, low formaldehyde applicationsApplications: Thermo MoldableEuropeInformation provided by Styron |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Zeon Chemicals Zeonor® 1060R Cyclo-Olefin Polymer Zeonor 1020R shall be in the form of pellets. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Zeus PFA Tubing PFA, or perfluoroalkoxy, is well recognized for its ability to maintain mechanical integrity in extreme temperatures even when exposed to caustic chemicals. PFA comes in high purity versions that ar.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Hexcel® HexPly® M32 Epoxy Matrix HexPly® M32 is specifically designed for prepreg applications with fabrics and short curing cycles for sporting (e.g. ski and snowboard production) and industrial applications. HexPly® M32 compris.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | DSC |
| Eastman Sahara Film Sahara Films are developed for use in applications where increased temperature resistance is desired.Applications/UsesHigh temperature printable films |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® 375 High Temperature Epoxy Product Description: EPO-TEK®375 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Also available in a single component frozen sy.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® 383ND High Temperature Epoxy Material Description: A slightly longer pot life version of EPO-TEK®353ND designed for high temperature, optical and structural applications inside the semiconductor, hybrid, electronic, fiber opti.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® E2001-HV Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001-HV Is a snap cure, two component, silver-filled die attach adhesive for semiconductor plastic IC packaging.Advantages & Application Notes:Snap cure adhesive or f.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® E2116 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E2116 is a two component, silver-filled and stencil printable electrically conductive adhesive for bonding SMDs onto PCB and substrates. Can be used as a “lead-free”.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® E3001-6 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & .. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® E3035T-2 Electrically Conductive Epoxy Product Description: EPO-TEK® E3035T-2 is a single component, silver-filled epoxy for semiconductor die attach, as well as SMD attach on hybrid circuits.Advantages & Application Notes: This epoxy c.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H22 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.Advantages & Application Notes: A smooth, .. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H24 Electrically Conductive Epoxy Product Description: EPO-TEK® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.Advantages & A.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—300°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H35-175MPLV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MPLV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-el.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—300°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H35-175MPT Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35MPT is a single component, silver-filled, electrically conductive epoxy designed for military hybrid die and component attach. High viscosity version of EPO-TEK® H.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H44 Gold-Filled, Electrically Conductive Epoxy Product Description: EPO-TEK® H44 is a single component, gold-filled, electrically conductive epoxy adhesive designed for hybrid microelectronic packaging.Advantages & Application Notes: High visco.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H55 Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.Information Provided by Epoxy Technology |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H81A Epoxy Material Description: A two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Information Provided by Epoxy Technolo.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Ramp 40°C/Min to 300°C |
| Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.Advantages & Appl.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Ramp 40°C/Min to 300°C |
| Epoxy Technology EPO-TEK® P1011S Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-a.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® E3035 Electrically Conductive Adhesive Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.Advantages & Application Notes: Performs exceptionally well as a die attach for sm.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Armstrong A-5/E Epoxy Adhesive Information provided by Ellsworth Adhesives. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Armstrong C-1/E Epoxy Adhesive A versatile, low viscosity, unfilled resin used for electrical potting and laminating applications. It is an excellent insulator, and provides outstanding chemical resistance to most compoundsInfor.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| BASF Polystyrol® 158 K Polystyrene (Global) Heat-resistant, rapid freezing general-purpose grade. Suitable for expanded film and for blending with Styrolux and impact-modified Polystyrol in heat contact applications (e.g. coffee cups).Data w.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | ASTM D7426 |
| Perstorp Compounds Akestra™ 100 Thermoplastic Copolyester Excellent appearance, clarity, hydrolytic stability, heat resistance and high strength. Used for extrusion and injection molded articles, blow molding, films and sheets. It can be used as a polyst.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | ASTM D7426 |
| Perstorp Compounds Akestra™ 110 Thermoplastic Copolyester Transparent sparkling glass-like appearance. Suitable for films, sheets, blow molding, foams and injection molding. It can be used as a polystyrene alternative for heat resistant thin wall contain.. |
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