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Polymer Property : Glass Transition Temp, Tg = 212 °F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Glass Transition Temp, Tg | 100 °C | 212 °F | ISO 11357-1 |
| Murtfeldt Murinit® SP Polyphenylene Sulfide Thanks to the low fiber content and integrated solid lubricant, Murinit® SP offers an excellent combination of good slide and wear behavior, high strength, and dimensional stability – even at high.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Lucite International Colacryl ® CRG107 Specialty Acrylic Resin Colacryl® CRG107 is a hard, methyl methacrylate based, acrylic resin with exceptional pigment wetting properties. It is soluble in chlorinated hydrocarbons, ketones and lower esters and compatibl.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Lucite International Elvacite ® 3001 Acrylic Resin Elvacite® 3001 is a medium viscosity, methyl methacrylate based resin for use in plastic and vinyl coatings and inks.Information provided by Lucite International |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Styron DL 220 Plastic Pigment Performance Features: High stiffness, fast solvent penetrationApplications: Leather BindingEuropeInformation provided by Styron |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | JIS K7121 |
| Zeon Chemicals Zeonor® 1060R Cyclo Olefin Polymer Zeonor® is a line of thermoplastic polyolefin resin with an excellent combination of optical and electronic properties. These unique Cyclo Olefin Polymer (COP) was developed by Zeon Corporation usi.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Zeon Chemicals Zeonor® 1060R Cyclo-Olefin Polymer Zeonor 1020R shall be in the form of pellets. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Zeus PFA Tubing PFA, or perfluoroalkoxy, is well recognized for its ability to maintain mechanical integrity in extreme temperatures even when exposed to caustic chemicals. PFA comes in high purity versions that ar.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | Ultimate Tg |
| Tra-Con Tra-Bond FDA15 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-15 is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Adminis.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | Onset, Cure Temperature: 100°C, Cure Time: 90 min |
| Hexcel® HexPly® M52 120°C/250°F Curing Epoxy HexPly® M52 is a modified epoxy matrix with good mechanical and temperature performance, specifically designed for rapid press curing. HexPly® M52 is ideal for small to high volume industrial appl.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Hexcel® HexPly® M32 Epoxy Matrix HexPly® M32 is specifically designed for prepreg applications with fabrics and short curing cycles for sporting (e.g. ski and snowboard production) and industrial applications. HexPly® M32 compris.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | DSC |
| Eastman Sahara Film Sahara Films are developed for use in applications where increased temperature resistance is desired.Applications/UsesHigh temperature printable films |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® 375 High Temperature Epoxy Product Description: EPO-TEK®375 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Also available in a single component frozen sy.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® 383ND High Temperature Epoxy Material Description: A slightly longer pot life version of EPO-TEK®353ND designed for high temperature, optical and structural applications inside the semiconductor, hybrid, electronic, fiber opti.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® E2116 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E2116 is a two component, silver-filled and stencil printable electrically conductive adhesive for bonding SMDs onto PCB and substrates. Can be used as a “lead-free”.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® E3001-6 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & .. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® E3035T-2 Electrically Conductive Epoxy Product Description: EPO-TEK® E3035T-2 is a single component, silver-filled epoxy for semiconductor die attach, as well as SMD attach on hybrid circuits.Advantages & Application Notes: This epoxy c.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H22 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.Advantages & Application Notes: A smooth, .. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H24 Electrically Conductive Epoxy Product Description: EPO-TEK® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.Advantages & A.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—300°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H35-175MPLV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MPLV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-el.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H44 Gold-Filled, Electrically Conductive Epoxy Product Description: EPO-TEK® H44 is a single component, gold-filled, electrically conductive epoxy adhesive designed for hybrid microelectronic packaging.Advantages & Application Notes: High visco.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H55 Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.Information Provided by Epoxy Technology |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H81A Epoxy Material Description: A two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Information Provided by Epoxy Technolo.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® OE100-T High Temperature Epoxy Material Description: A two component, high Tg, high temperature grade epoxy designed for semiconductor, underfill, hard-disk drive and hybrid micro-electronics packaging applications. The epoxy ca.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Ramp 40°C/Min to 300°C |
| Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.Advantages & Appl.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® E3035 Electrically Conductive Adhesive Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.Advantages & Application Notes: Performs exceptionally well as a die attach for sm.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Atom Adhesives AA-BOND FDA15 Epoxy Adhesive AA-BOND FDA15 is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Administr.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Atom Adhesives AA-BOND G298 Epoxy Adhesive AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Appearance: Resin: Brown, Hardener: Dark Bro.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Eastman Tenite 383A-12 CAP Cellulose Acetate Propionate
(discontinued **) 12% Plasticized. ISO data as provided by the manufacturer, Eastman Chemical. |
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