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Epoxy Technology EPO-TEK® H81A Epoxy

Category	Polymer , Thermoset , Epoxy
Manufacturer	Epoxy Technology
Trade Name	EPO-TEK®
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxy Technology EPO-TEK® H81A Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Material Description: A two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Information Provided by Epoxy Technology

Physical Properties	Metric	English	Comments
Specific Gravity	5.62 g/cc	5.62 g/cc	Part B
	5.80 g/cc	5.80 g/cc	Part A
Particle Size	<= 50 µm	<= 50 µm
Viscosity	250000 - 300000 cP @Temperature 23.0 °C	250000 - 300000 cP @Temperature 73.4 °F	0.5 rpm

Mechanical Properties	Metric	English	Comments
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	250 °C	482 °F	Continuous
	350 °C	662 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 100 °C	>= 212 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature	412 °C	774 °F	Degradation Temperature

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.00090 ohm-cm	<= 0.00090 ohm-cm

Processing Properties	Metric	English	Comments
Cure Time	60.0 min @Temperature 150 °C	1.00 hour @Temperature 302 °F	Minimum
Pot Life	2880 min	2880 min
Shelf Life	12.0 Month @Temperature 25.0 °C	12.0 Month @Temperature 77.0 °F

Descriptive Properties	Value	Comments
Color	Dark Brown	Part A
	Dark Brown	Part B
Consistency	Thick paste
Mix Ratio By Weight	6:1
Number of Components	Two
Weight Loss	<0.5%	200°C
	0.07%	250°C
	0.16%	300°C

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