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Epoxy Technology EPO-TEK® H55 Epoxy
| Category | Polymer , Thermoset , Epoxy |
| Manufacturer | Epoxy Technology |
| Trade Name | EPO-TEK® |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Epoxy Technology EPO-TEK® H55 Epoxy.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Material Description: A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.Information Provided by Epoxy Technology
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 1.06 g/cc | 1.06 g/cc | Part B |
| 1.69 g/cc | 1.69 g/cc | Part A | |
| Particle Size | <= 10 µm | <= 10 µm | |
| Viscosity | 250000 - 400000 cP @Temperature 23.0 °C |
250000 - 400000 cP @Temperature 73.4 °F |
1 rpm |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 68 | 68 | |
| Tensile Modulus | 3.77 GPa | 547 ksi | Storage |
| Shear Strength | 11.53 MPa | 1672 psi | Lap |
| >= 11.7 MPa | >= 1700 psi | Die |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | Below Tg |
| 79.0 µm/m-°C | 43.9 µin/in-°F | Above Tg | |
| Thermal Conductivity | 0.400 W/m-K | 2.78 BTU-in/hr-ft²-°F | |
| Maximum Service Temperature, Air | 250 °C | 482 °F | Continuous |
| 350 °C | 662 °F | Intermittent | |
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| -55.0 °C | -67.0 °F | Intermittent | |
| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Decomposition Temperature | 465 °C | 869 °F | Degradation Temperature |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | >= 1.16e+14 ohm-cm | >= 1.16e+14 ohm-cm | |
| Dielectric Constant | 6.32 @Frequency 1000 Hz |
6.32 @Frequency 1000 Hz |
|
| Dissipation Factor | 0.0080 @Frequency 1000 Hz |
0.0080 @Frequency 1000 Hz |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 20.0 min @Temperature 100 °C |
0.333 hour @Temperature 212 °F |
minimum |
| 45.0 min @Temperature 80.0 °C |
0.750 hour @Temperature 176 °F |
minimum | |
| Pot Life | 180 min | 180 min | |
| Shelf Life | 6.00 Month @Temperature 25.0 °C |
6.00 Month @Temperature 77.0 °F |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Color | Amber | Part B |
| White | Part A | |
| Consistency | Thixotropic paste | |
| Mix Ratio By Weight | 20:1 | |
| Number of Components | Two | |
| Weight Loss | 0.88% | 200°C |
| 1.14% | 250°C | |
| 1.52% | 300°C |
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