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Epoxy Technology EPO-TEK® H35-175MPLV Electrically Conductive, Silver Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® H35-175MPLV Electrically Conductive, Silver Epoxy.pdf
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Material Notes:
Product Description: EPO-TEK® H35-175MPLV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic packaging. It is a lower viscosity version of EPO-TEK® H35-175MPAdvantages & Application Notes:Performs exceptionally well as a die attach for small chips such as GaAs, LEDs and diodes.Capable of resisting 260°C green reflow process, low outgassing in hermetic lid-seal processes near 300°C, and organic burn-in up to 150°C/1000 hours storage.Certified to MIL-STD 883/Test Method 5011.Capable of JEDEC Level II die-attach packaging on die-paddles and lead-frames.Widely used epoxy; popular choice for silver-filled epoxies; opto-packaging, hybrids, and many types of substrates including kovar, ceramic and BT.Available in many different viscosity rangesDesigned for improved flow for smaller needle gauge dispensing, or stamping operationsInformation Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 2.65 g/cc
2.65 g/cc
Particle Size <= 20 µm
<= 20 µm
Viscosity 10500 - 16500 cP

@Temperature 23.0 °C
10500 - 16500 cP

@Temperature 73.4 °F
10 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 75
75
Tensile Modulus 3.41 GPa
495 ksi
Storage
Shear Strength 12.85 MPa
1864 psi
Lap
>= 23.4 MPa
>= 3400 psi
Die
Thermal Properties Metric English Comments
CTE, linear 47.0 µm/m-°C
26.1 µin/in-°F
Below Tg
190 µm/m-°C
106 µin/in-°F
Above Tg
Thermal Conductivity 1.50 W/m-K
10.4 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 180 °C
356 °F
Continuous
280 °C
536 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 100 °C
>= 212 °F
Dynamic Cure 20—300°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 330 °C
626 °F
Degradation Temperature
Electrical Properties Metric English Comments
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Chemical Properties Metric English Comments
Ionic Impurities - Na (Sodium) <= 50 ppm
<= 50 ppm
Ionic Impurities - K (Potassium) <= 50 ppm
<= 50 ppm
Ionic Impurities - Cl (Chloride) <= 200 ppm
<= 200 ppm
Processing Properties Metric English Comments
Cure Time 60.0 min

@Temperature 180 °C
1.00 hour

@Temperature 356 °F
Minimum Bond Line
90.0 min

@Temperature 165 °C
1.50 hour

@Temperature 329 °F
Minimum Bond Line
Pot Life 40320 min
40320 min
Shelf Life 12.0 Month

@Temperature -40.0 °C
12.0 Month

@Temperature -40.0 °F
Descriptive Properties Value Comments
Color Silver
Consistency Smooth paste
Ionic Impurities NH4 32 ppm
Number of Components Single
Thixotropic Index 2.66
Weight Loss 0.04%
200°C
0.06%
250°C
0.19%
300°C
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