Songhan Plastic Technology Co.,Ltd.
 POLYMER SEARCH

Epoxy Technology EPO-TEK® H22 Electrically Conductive, Silver Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® H22 Electrically Conductive, Silver Epoxy.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
Product Description: EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.Advantages & Application Notes: A smooth, free flowing, slightly thixotropic paste, using a 100% solids system. It can be dispensed, screen printed, or manually applied.High Tg allows it to be used for high temperature applications.Outstanding high temperature properties and excellent solvent, chemical and moisture resistance.Extended pot life and fast curing at relatively low temperatures < 100°C.Designed to be used in the 300°C range for applications such as wire bonding operations and eutectic lid-sealing processes.Contains no solvents or thinners. Passes NASA low outgassing standard ASTM E595 with proper cureCan be used instead of eutectic solders for near-hermetic sealing.Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 1.03 g/cc
1.03 g/cc
Part B
2.03 g/cc
2.03 g/cc
Part A
Particle Size <= 45 µm
<= 45 µm
Viscosity 12000 - 20000 cP

@Temperature 23.0 °C
12000 - 20000 cP

@Temperature 73.4 °F
20 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 80
80
Tensile Modulus 3.7240 GPa
540.12 ksi
Storage
Shear Strength >= 11.7 MPa
>= 1700 psi
Die
13.7 MPa
1980 psi
Lap
Thermal Properties Metric English Comments
CTE, linear 39.0 µm/m-°C
21.7 µin/in-°F
Below Tg
224 µm/m-°C
124 µin/in-°F
Above Tg
Thermal Conductivity 0.940 W/m-K
6.52 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 250 °C
482 °F
Continuous
350 °C
662 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 100 °C
>= 212 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 454 °C
849 °F
Degradation Temperature
Electrical Properties Metric English Comments
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Chemical Properties Metric English Comments
Ionic Impurities - Na (Sodium) 60 ppm
60 ppm
Ionic Impurities - K (Potassium) 6.0 ppm
6.0 ppm
Ionic Impurities - Cl (Chloride) 175 ppm
175 ppm
Processing Properties Metric English Comments
Cure Time 5.00 min

@Temperature 150 °C
0.0833 hour

@Temperature 302 °F
Minimum Bond Line
10.0 min

@Temperature 120 °C
0.167 hour

@Temperature 248 °F
Minimum Bond Line
20.0 min

@Temperature 100 °C
0.333 hour

@Temperature 212 °F
Minimum Bond Line
Pot Life 960 min
960 min
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Amber
Part B
Silver
Part A
Consistency Smooth flowing paste
Ionic Impurities NH4 148 ppm
Mix Ratio By Weight 100:4.5
Number of Components Two
Thixotropic Index 2.36
Weight Loss 0.09%
200°C
0.23%
250°C
0.42%
300°C
Copyright © lookpolymers.com All Rights Reserved