Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide

Category	Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive , Polyimide, TS
Manufacturer	Epoxy Technology
Trade Name	EPO-TEK®
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Product Description: EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.Advantages & Application Notes: Low stress die-attach adhesive that is very effective for bonding quartz crystal oscillators used in Rf / Microwave wireless devices.Designed specifically for screen printing and machine dispensing applications. A lower viscosity version, called P1011S is available for die-stamping processes. Recommended for screen printing applications; long dry time. Good electrical and thermal conductivity.Suggested for ceramic and DIP packaging of hybrids, as well as TO-Cans. Information Provided by Epoxy Technology

Physical Properties	Metric	English	Comments
Specific Gravity	2.39 g/cc	2.39 g/cc
Particle Size	<= 20 µm	<= 20 µm
Viscosity	8000 - 12000 cP @Temperature 23.0 °C	8000 - 12000 cP @Temperature 73.4 °F	20 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	61	61
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die

Thermal Properties	Metric	English	Comments
CTE, linear	32.0 µm/m-°C	17.8 µin/in-°F	Below Tg
	225 µm/m-°C	125 µin/in-°F	Above Tg
Thermal Conductivity	>= 2.74 W/m-K	>= 19.0 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	225 °C	437 °F	Continuous
	325 °C	617 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 100 °C	>= 212 °F	Ramp 40°C/Min to 300°C
Decomposition Temperature	389 °C	732 °F	Degradation Temperature

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.00050 ohm-cm	<= 0.00050 ohm-cm

Chemical Properties	Metric	English
Ionic Impurities - Na (Sodium)	39 ppm	39 ppm
Ionic Impurities - K (Potassium)	18 ppm	18 ppm
Ionic Impurities - Cl (Chloride)	114 ppm	114 ppm

Processing Properties	Metric	English	Comments
Dry Time	<= 168 hour	<= 168 hour
Cure Time	30.0 min @Temperature 80.0 °C	0.500 hour @Temperature 176 °F	Pre-Bake, Minimum Bond Line
	90.0 min @Temperature 285 °C	1.50 hour @Temperature 545 °F	Post-Cure, Minimum Bond Line
Shelf Life	12.0 Month @Temperature 25.0 °C	12.0 Month @Temperature 77.0 °F

Descriptive Properties	Value	Comments
Color	Silver
Consistency	Smooth slightly thixotropic paste
Ionic Impurities NH4	27 ppm
Number of Components	Single
Thixotropic Index	1.9
Weight Loss	0.06%	200°C
	0.08%	250°C
	0.15%	300°C

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