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- Polymer Property : Glass Transition Temp, Tg = 212 °F
Polymer Property : Glass Transition Temp, Tg = 212 °F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| NextGen Adhesives P907-03 Fiber Optic Adhesive Description: NGAC P907-03 is a low viscosity and room temperature curing adhesive specifically formulated for fiber optic terminations.Advantages and Applications: Uses include the termination of si.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | 10°C/min; ISO 11357-1/-2 |
| DuPont Performance Polymers Rynite® RE19051 BK507 PET
(Unverified Data**) Rynite® RE19051 BK507 is a 40% glass and mineral reinforced, flame retardant, polyethylene terephthalate black resin.Information provided by DuPont Performance Polymers |
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| Glass Transition Temp, Tg | 100 - 110 °C | 212 - 230 °F | |
| Hybrid Plastics POSS® EP 1050 Epoxy Adhesive EP1050 is a POSS® based, high-temperature epoxy adhesive with outstanding resistance to ozone, plasma, or atomic oxygen environments. Major applications include medical devices, optics, semicondu.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Lucite International Colacryl ® CRG107 Specialty Acrylic Resin Colacryl® CRG107 is a hard, methyl methacrylate based, acrylic resin with exceptional pigment wetting properties. It is soluble in chlorinated hydrocarbons, ketones and lower esters and compatibl.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Lucite International Elvacite ® 3001 Acrylic Resin Elvacite® 3001 is a medium viscosity, methyl methacrylate based resin for use in plastic and vinyl coatings and inks.Information provided by Lucite International |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Styron DL 220 Plastic Pigment Performance Features: Stiffness, high mechanical stability, low formaldehyde applicationsApplications: Thermo MoldableEuropeInformation provided by Styron |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Styron DL 220 Plastic Pigment Performance Features: High stiffness, fast solvent penetrationApplications: Leather BindingEuropeInformation provided by Styron |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | JIS K7121 |
| Zeon Chemicals Zeonor® 1060R Cyclo Olefin Polymer Zeonor® is a line of thermoplastic polyolefin resin with an excellent combination of optical and electronic properties. These unique Cyclo Olefin Polymer (COP) was developed by Zeon Corporation usi.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Zeon Chemicals Zeonor® 1060R Cyclo-Olefin Polymer Zeonor 1020R shall be in the form of pellets. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | DMA |
| Hexcel® HexPly® ES70 120°C Curing Epoxy Matrix HexPly® ES70 is a structural epoxy resin particularly well adapted to low pressure molding processes. This system is versatile and allows a polymerization from 100°C (212°F) up to 150°C (302°F).. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | Ultimate Tg |
| Tra-Con Tra-Bond FDA15 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-15 is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Adminis.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | Onset, Cure Temperature: 100°C, Cure Time: 90 min |
| Hexcel® HexPly® M52 120°C/250°F Curing Epoxy HexPly® M52 is a modified epoxy matrix with good mechanical and temperature performance, specifically designed for rapid press curing. HexPly® M52 is ideal for small to high volume industrial appl.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Hexcel® HexPly® M32 Epoxy Matrix HexPly® M32 is specifically designed for prepreg applications with fabrics and short curing cycles for sporting (e.g. ski and snowboard production) and industrial applications. HexPly® M32 compris.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | DSC |
| Eastman Sahara Film Sahara Films are developed for use in applications where increased temperature resistance is desired.Applications/UsesHigh temperature printable films |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® 323LP Epoxy Material Description: Longer pot life version of EPO-TEK® 353ND designed for semiconductor, hybrid, fiber-optic, hard-disk drive and medical applications.Information Provided by Epoxy Technology |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® E2001-HV Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001-HV Is a snap cure, two component, silver-filled die attach adhesive for semiconductor plastic IC packaging.Advantages & Application Notes:Snap cure adhesive or f.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & .. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® E3035T-2 Electrically Conductive Epoxy Product Description: EPO-TEK® E3035T-2 is a single component, silver-filled epoxy for semiconductor die attach, as well as SMD attach on hybrid circuits.Advantages & Application Notes: This epoxy c.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H22 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.Advantages & Application Notes: A smooth, .. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—300°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H35-175MPLV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MPLV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-el.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—300°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H35-175MPT Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35MPT is a single component, silver-filled, electrically conductive epoxy designed for military hybrid die and component attach. High viscosity version of EPO-TEK® H.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H81A Epoxy Material Description: A two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Information Provided by Epoxy Technolo.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Ramp 40°C/Min to 300°C |
| Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.Advantages & Appl.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® E3035 Electrically Conductive Adhesive Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.Advantages & Application Notes: Performs exceptionally well as a die attach for sm.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| BASF Polystyrol® 168 N Polystyrene (Europe) High molecular, heat-resistant grades used where high strength is required. Suitable for expanded film.Data was collected by ISO methods and provided by BASF. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Eastman Tenite 383A-12 CAP Cellulose Acetate Propionate
(discontinued **) 12% Plasticized. ISO data as provided by the manufacturer, Eastman Chemical. |
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