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- Polymer Property : Glass Transition Temp, Tg = 125 °C
Polymer Property : Glass Transition Temp, Tg = 125 °C Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Glass Transition Temp, Tg | 125 - 127 °C | 257 - 261 °F | Average value: 126 °C Grade Count:3 |
| Overview of materials for Nylon, Barrier Film Copolymer This property data is a summary of similar materials in the MatWeb database for the category "Nylon, Barrier Film Copolymer". Each property range of values reported is minimum and maximum values of .. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | ISO 11357-2 |
| Menzolit Menzolit® BMC 0800 Unsaturated Polyester UP BMC 0800 is a special SMC for applications within household and kitchenware. The glass level has been selected to combine good mould ability with good strength and stiffness properties. The product .. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | ISO 11357-2 |
| Menzolit Menzolit® BMC 0900 Unsaturated Polyester UP BMC 0900 is a special BMC used in a chemically aggressive environment. The glass content is set to a level that combines good mould ability with good strength and stiffness properties. Typical appli.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | ISO 11357-2 |
| Menzolit Menzolit® SMC 0800 Unsaturated Polyester UP SMC 0800 is a special SMC for applications within househould and kitchenware. The glass level has been selected to combine good mouldability with good strength and stiffness properties. The product .. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | TMA |
| Lord Adhesives Circalokâ„¢ EP-729 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ EP-729 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.All information provided by.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | TMA |
| Lord Adhesives Circalokâ„¢ EP-937 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ EP-937 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.All information provided by.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Kuraray Genestarâ„¢ G1300H Nylon, 30% Glass Filled Standard HB grade. Halogen free, following the standards that Br is less than 900ppm, Cl is less than 900ppm, and total of halogen amount (Br and Cl) is less than 1500ppm. It is suitable for use in .. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | 10°C/min; ISO 11357-1/-2 |
| Kuraray Genestarâ„¢ G1301A-M61 Nylon, 30% Glass Filled 30% Glass reinforced and impact modified injection grade.Main Features:Higher elongation and impact strengthHeat resistanceChemical resistanceExample of applications:Quick connector |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | 10°C/min; ISO 11357-1/-2 |
| Kuraray Genestarâ„¢ G1350A-M42 Nylon, 35% Glass Filled 35% Glass reinforced injection grade. This grade was developed specifically for improved performance in a 50/50 ethylene glycol and water environment.Main Features:Hydrolysis resistanceHeat resista.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | 10°C/min; ISO 11357-1/-2 |
| Kuraray Genestarâ„¢ G1352A-M41 Nylon, 35% Glass Filled Low friction reinforced injection grade.Main Features:Low friction coefficientAbrasion resistanceExamples of applications:Friction and wear applicationGear and wheel |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Kuraray Genestarâ„¢ GA2330 Nylon, 33% Glass Filled Abrasion Resistance V-0 Grade. Can be used for applications requiring high abrasion and heat resistance, as well as flame retardancy, such as internal gear of copying machine. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Kuraray Genestarâ„¢ GN2332 Nylon, 33% Glass Filled High Flow V-0 Grade. Improves flow-ability in thin-walled parts. Used for components requiring high-flowability, such as 0.3 mm pitch connectors. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Kuraray Genestarâ„¢ GP2450NH-2 Nylon, 45% Glass Filled Standard V-0 Grade. Halogen free, following the standards that Br is less than 900ppm, Cl is less than 900ppm, and total of halogen amount (Br and Cl) is less than 1500ppm.This grade meets UL94, V-0.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Kuraray Genestarâ„¢ GT2330 Nylon, 33% Glass Filled Toughness V-0 Grade. It is well suited for components requiring a high strength in pin fitting process, due to high ductility properties. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | 10°C/min; ISO 11357-1/-2 |
| Kuraray Genestarâ„¢ N1000A-M41 Nylon Standard unreinforced injection grade. Main features:Low water absorptionChemical ResistanceExamples of application are:Friction and wear applicationGear and Wheel |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | 10°C/min; ISO 11357-1/-2 |
| Kuraray Genestarâ„¢ N1001A-M41 Nylon Low friction unreinforced injection grade. Main Features:Low friction coefficientHigh impact strengthExamples of applications are:Friction and wear applicationGear and wheel |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | 10°C/min; ISO 11357-1/-2 |
| Kuraray Genestarâ„¢ N1001D-U83/02 Nylon Standard unreinforced extrusion grade. Main Features:Outstanding fuel barrierHeat resistanceExample of applications:Multi-layered fuel tube |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | 10°C/min; ISO 11357-1/-2 |
| Kuraray Genestarâ„¢ N1002A-M41 Nylon Low friction unreinforced injection grade. Main Features:Low friction coefficientLow wearExamples of applications are:Friction and wear applicationGear and wheel |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | 10°C/min; ISO 11357-1/-2 |
| Kuraray Genestarâ„¢ N1006A-M41 Nylon Impact modified unreinforced injection grade. Main Features:High elongationHigh impact strengthExamples of applications are:Retainers for quick connectorFlexible band |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | 10°C/min; ISO 11357-1/-2 |
| Kuraray Genestarâ„¢ N1006D-H31 Nylon Standard unreinforced extrusion grade. Main Features:Chemical resistanceLong term heat resistanceExample of applications:Tube applications |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Mitsui Arlen™ A335 35% Glass Fiber-Reinforced Modified Nylon 6T (COND) ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Mitsui Arlen™ A335 35% Glass Fiber-Reinforced Modified Nylon 6T (DAM) ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Mitsui Arlen™ A350 50% Glass Fiber-Reinforced Modified Nylon 6T (DAM) ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | TMA |
| Lord Adhesives Circalokâ„¢ EP-939 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ EP-939 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.All information provided by.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | Ultimate Tg, 10°C/min; DSC |
| Tra-Con Tra-Bond F202HV Spectrally Transparent Thixotropic Epoxy Adhesive TRA-BOND F202 is a clear, thixotropic epoxy adhesive recommended for photonic applications requiring exposure to high temperatures or chemical and environmental resistance. This 100% solids system e.. |
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| Glass Transition Temp, Tg | 125 °C | 258 °F | with 3K Plain Weave AS-2 Carbon Fiber; ASTM D7028-07 |
| Zyvex Performance Materials Arovex™ HT 250 Nano-Engineered Composite Prepreg System Arovex® HT 250 Prepreg is a 180°F (82°C) to 280°F (138°C) curing carbon nanotube strengthened epoxy prepreg suitable for numerous composites applications. Normal curing takes place at 250°F (1.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Loctite® 3564 Fast flow epoxy, moderate CTE and Tg Fast Flow Underfill COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | ASTM D3418 |
| DuPont Selar® PA 2072 Nylon Barrier Resin Selar® PA 2072 is an amorphous nylon (polyamide) resin which is specially designed for blending with ethylene vinyl alcohol (EVOH) copolymers. Selar® PA 2072 can be tumble-blended with most grades.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Epoxyset Epoxibond EB-177 Unfilled Epoxy Adhesive A two-component, unfilled, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc... |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Mitsui Arlen™ AE4200 Modified Nylon 6T, for Tribolic Applications (DAM) ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it possesses .. |
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