Polymer Property : Shear Strength = 11.7 MPa Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Shear Strength	11.7 MPa	1700 psi	ASTM D732
Quadrant EPP Fluorosint® 207 PTFE, Compression Molded Synthetic Mica-filled PTFE (ASTM Product Data Sheet)
Shear Strength	11.7 MPa	1700 psi	Cured 1 hour at 125°C, Au/Au
Resin Technology Group TIGA 908 Gold Bonder - Low Stress Silver Conductive 100 parts resin to 6 parts hardener.TIGA 908 is a low stress, conductive silver filled epoxy adhesive. It is recommended for bonding, and sealing electronic applications which require bonding to gol..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® 430 Epoxy Product Description: A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding ..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® B9021-6 Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® B912-8 Epoxy Product Description: A single component, thermally and electrically conductive, epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a pot..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® E3001 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® E4110-PFC Electrically Conductive Epoxy Product Description: EPO-TEK®E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotr..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® EE165-3 Silver Filled Epoxy A two component, silver-filled, electrically conductive epoxy made for bonding of SMDs, and general solder replacement at the PCB level and circuit assembly. It was designed to be low modulus and f..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die after 1000 hrs 85C/85%R
Epoxy Technology EPO-TEK® EK1000 Epoxy Material Description: A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding ..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® EV2002 Silver-filled, electrically conductive, flexible epoxy Material Description: Silver-filled, electrically conductive, flexible epoxyInformation Provided by Epoxy Technology
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H20E-8 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-8 is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscos..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H20E-MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-MP is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is al..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H31D Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H31D is a single component, electrically conductive silver epoxy designed for die-bonding of semiconductors, including IC’s, resistors, capacitors, transistors, and d..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H31LV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H31LV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electron..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H81A Epoxy Material Description: A two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Information Provided by Epoxy Technolo..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® OG159-2 UV Cure Optical Epoxy Material Description: A single component, high viscosity, UV curable epoxy adhesive designed for sealing glass plates together in the LCD/OLED/display industry. It contains 1mil glass beads for bon..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.Advantages & Appl..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H20E-LV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-LV is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a ..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H31 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H31 is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic..
Shear Strength	11.7 MPa	1700 psi	Overlap, Stainless Steel MEK/abrade/MEK
3M Scotch-Weld™ DP420 Off-White Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive are high performance, two-part epoxy adhesives offering outstanding shear and peel adhesion, and very high levels of durability.Information provided by 3M
Shear Strength	11.7 MPa	1700 psi	Overlap, Aluminum-MEK/abrade/MEK-Adhesive Failure/Cohesive Failure; ASTM D1002
3M Scotch-Weld™ LSB90 Flexible Epoxy 3M™ Scotch-Weld™ Epoxy Adhesive LSB90 is a high performance, two-part, flexible epoxy adhesive offering high shear and peel adhesion and very high levels of durability. It has a 90 minute worklife..
Shear Strength	11.7 MPa	1700 psi	Die, @ 23°C: = 5 Kg
Atom Adhesives AA-BOND G298 Epoxy Adhesive AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Appearance: Resin: Brown, Hardener: Dark Bro..
Shear Strength	11.7 MPa @Temperature 24.0 °C	1700 psi @Temperature 75.2 °F	Overlap, Etched Aluminum; ASTM D1002
3M Scotch-Weld™ 2216 B/A Translucent Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive 2216 B/A is a flexible, two-part, room temperature curing epoxy with high peel and shear strength. Scotch-Weld epoxy adhesive 2216 B/A is identical to 3M Scotch-Wel..