Polymer Property : Shear Strength = 11.7 MPa Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Shear Strength	11.7 MPa	1700 psi	ASTM D732
Quadrant EPP Fluorosint® 207 PTFE, Compression Molded Synthetic Mica-filled PTFE (ASTM Product Data Sheet)
Shear Strength	11.7 MPa	1700 psi	Cured 1 hour at 125°C, Au/Au
Resin Technology Group TIGA 908 Gold Bonder - Low Stress Silver Conductive 100 parts resin to 6 parts hardener.TIGA 908 is a low stress, conductive silver filled epoxy adhesive. It is recommended for bonding, and sealing electronic applications which require bonding to gol..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® 301-1 Optical Grade Epoxy Material Description: A two component, room temperature curing, optical grade epoxy, designed for optics, medical, and opto-electronic packaging of semiconductor devices, components, and electronics..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® 302 Fast Setting, Optical Epoxy Product Description: EPO-TEK® 302 is a two component, fast-gelling, room temperature curing epoxy, designed for electronic, optical, medical, and general applications. Advantages & Application No..
Shear Strength	11.7 MPa	1700 psi	Die
Epoxy Technology EPO-TEK® 310M-2 Optically Clear, Flexible Epoxy Material Description: A two component, optically clear, flexible epoxy adhesive designed for optical applications within semiconductor, fiber optic and medical industries. An alternative to EPO-TEK..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® B9021-6 Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® E2036 Epoxy Product Description: A two component, slightly flexible, silver-filled, electrically conductive adhesive for semiconductor and electronic assemblies. It is a low Tg epoxy, intended for many kinds o..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® E2101 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E2101 is a two component, thixotropic, electrically conductive adhesive. It may be used for circuit assembly and semiconductor applications. Advantages & Application ..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® E3001 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® EE165-3 Silver Filled Epoxy A two component, silver-filled, electrically conductive epoxy made for bonding of SMDs, and general solder replacement at the PCB level and circuit assembly. It was designed to be low modulus and f..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die after 1000 hrs 85C/85%R
Epoxy Technology EPO-TEK® EK1000-MP Epoxy Material Description: A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding ..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H20E-8 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-8 is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscos..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H20E-PFC Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-PFC is a two component, semiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method.Advantages & Application Notes: Stencil..
Shear Strength	11.7 MPa	1700 psi	Lap
Epoxy Technology EPO-TEK® H20-HC Electrically Conductive Epoxy Product Description: EPO-TEK® H20E-HC is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is al..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H20S Electrically Conductive, Silver Epoxy for Die Stamping Product Description: EPO-TEK® H20S is a modified version of EPO-TEK® H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK®H20S is a highly reliable, two ..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H31LV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H31LV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electron..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H81A Epoxy Material Description: A two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Information Provided by Epoxy Technolo..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® OG159-2 UV Cure Optical Epoxy Material Description: A single component, high viscosity, UV curable epoxy adhesive designed for sealing glass plates together in the LCD/OLED/display industry. It contains 1mil glass beads for bon..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H20E Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also ..
Shear Strength	11.7 MPa	1700 psi	Overlap, Cold Rolled Steel
3M Scotch-Weld™ DP100 Plus Clear Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive DP100 Plus Clear is a fast setting, two-part, 1:1 mix ratio mercaptan-cured epoxy adhesive. It is a unique among fast setting mercaptan cure epoxies in that it comb..
Shear Strength	11.7 MPa	1700 psi	Overlap, Stainless Steel MEK/abrade/MEK
3M Scotch-Weld™ DP420 Off-White Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive are high performance, two-part epoxy adhesives offering outstanding shear and peel adhesion, and very high levels of durability.Information provided by 3M
Shear Strength	11.7 MPa	1700 psi	Overlap, Aluminum-MEK/abrade/MEK-Adhesive Failure/Cohesive Failure; ASTM D1002
3M Scotch-Weld™ LSB90 Flexible Epoxy 3M™ Scotch-Weld™ Epoxy Adhesive LSB90 is a high performance, two-part, flexible epoxy adhesive offering high shear and peel adhesion and very high levels of durability. It has a 90 minute worklife..
Shear Strength	11.7 MPa	1700 psi	Die, @ 23°C: = 5 Kg
Atom Adhesives AA-BOND G298 Epoxy Adhesive AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Appearance: Resin: Brown, Hardener: Dark Bro..
Shear Strength	11.7 MPa	1700 psi	Overlap, Steel; ASTM D1002-64
3M Scotch-Weld™ CA40 Instant Adhesive 3M™ Scotch-Weld™ Instant Adhesives are single component, high strength cyanoacrylate adhesives. Very fast setting and excellent adhesion to many substrates including flexible vinyl and EPDM rubbe..