Epoxy Technology EPO-TEK® EE165-3 Silver Filled Epoxy

Category	Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer	Epoxy Technology
Trade Name	EPO-TEK®
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxy Technology EPO-TEK® EE165-3 Silver Filled Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

A two component, silver-filled, electrically conductive epoxy made for bonding of SMDs, and general solder replacement at the PCB level and circuit assembly. It was designed to be low modulus and flexible in order to resist PCB drop testing.Information Provided by Epoxy Technology

Physical Properties	Metric	English	Comments
Specific Gravity	1.06 g/cc	1.06 g/cc	Part B
	4.03 g/cc	4.03 g/cc	Part A
Particle Size	<= 20 µm	<= 20 µm
Viscosity	13000 - 18000 cP @Temperature 23.0 °C	13000 - 18000 cP @Temperature 73.4 °F	20 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	77	77
Tensile Modulus	1.38 GPa	201 ksi	Storage
Shear Strength	9.598 MPa	1392 psi	Lap
	>= 11.7 MPa	>= 1700 psi	Die

Thermal Properties	Metric	English	Comments
CTE, linear	30.0 µm/m-°C	16.7 µin/in-°F	Below Tg
	212 µm/m-°C	118 µin/in-°F	Above Tg
Thermal Conductivity	2.30 W/m-K	16.0 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	200 °C	392 °F	Continuous
	300 °C	572 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 20.0 °C	>= 68.0 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature	363 °C	685 °F	Degradation Temperature

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.00020 ohm-cm	<= 0.00020 ohm-cm

Processing Properties	Metric	English
Cure Time	60.0 min @Temperature 150 °C	1.00 hour @Temperature 302 °F
	120 min @Temperature 125 °C	2.00 hour @Temperature 257 °F
Pot Life	600 min	600 min
Shelf Life	12.0 Month @Temperature 25.0 °C	12.0 Month @Temperature 77.0 °F

Descriptive Properties	Value	Comments
Color	Amber	Part B
	Silver	Part A
Consistency	Smooth thixotropic paste
Mix Ratio By Weight	10:2.5
Number of Components	Two
Thixotropic Index	4.8
Weight Loss	0.26%	200°C
	0.56%	250°C

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