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3M Scotch-Weld™ DP100 Plus Clear Epoxy Adhesive

Category	Polymer , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer	3M
Trade Name	Scotch-Weld™
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	3M Scotch-Weld™ DP100 Plus Clear Epoxy Adhesive.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

3M™ Scotch-Weld™ Epoxy Adhesive DP100 Plus Clear is a fast setting, two-part, 1:1 mix ratio mercaptan-cured epoxy adhesive. It is a unique among fast setting mercaptan cure epoxies in that it combines high shear strength with good peel performance properties. It is transparent and slightly flexible when cured.Information provided by 3M

Physical Properties	Metric	English	Comments
Brookfield Viscosity	4000 - 11000 cP	4000 - 11000 cP	Base, RVF #7 spindle, 20 rpm @ 27°C
	7000 - 13000 cP	7000 - 13000 cP	Accelerator, RVF #7 spindle, 20 rpm @ 27°C

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	83	83	ASTM D2240
Tensile Strength at Break	12.8 MPa	1860 psi	ASTM D882
Elongation at Break	75 %	75 %	ASTM D882
Shear Strength	0.552 MPa	80.0 psi	Overlap, Polypropylene
	1.72 MPa	250 psi	Overlap, Glass, Borosilicate
	1.93 MPa	280 psi	Overlap, ABS
	2.07 MPa	300 psi	Overlap, +3M Scotch-Weld Primer EC3901
	2.07 MPa	300 psi	Overlap, Acrylic
	3.10 MPa	450 psi	Overlap, PVC
	4.14 MPa	600 psi	Overlap, Polycarbonate
	4.83 MPa	700 psi	Overlap, Wood, Fir
	10.3 MPa	1500 psi	Overlap, Fiberglass
	11.7 MPa	1700 psi	Overlap, Cold Rolled Steel
	12.4 MPa	1800 psi	Overlap, Sanded Aluminum
	24.1 MPa	3500 psi	Overlap, Etched Aluminum
	1.38 MPa @Temperature 82.0 °C	200 psi @Temperature 180 °F	Overlap
	2.76 MPa @Temperature 66.0 °C	400 psi @Temperature 151 °F	Overlap
	5.17 MPa @Temperature 49.0 °C	750 psi @Temperature 120 °F	Overlap
	20.7 MPa @Temperature -55.0 °C	3000 psi @Temperature -67.0 °F	Overlap
	24.1 MPa @Temperature 21.0 °C	3500 psi @Temperature 69.8 °F	Overlap
Peel Strength	0.175 kN/m	1.00 pli
	0.351 kN/m	2.00 pli	180°
	0.351 kN/m	2.00 pli	180°
	2.28 kN/m	13.0 pli	180°
	2.63 kN/m	15.0 pli	180°

Thermal Properties	Metric	English	Comments
CTE, linear	93.0 µm/m-°C @Temperature 5.00 - 20.0 °C	51.7 µin/in-°F @Temperature 41.0 - 68.0 °F	Below Tg
	182 µm/m-°C @Temperature 40.0 - 140 °C	101 µin/in-°F @Temperature 104 - 284 °F	Above Tg
Thermal Conductivity	0.133 W/m-K @Thickness 6.35 mm, Temperature 44.3 °C	0.923 BTU-in/hr-ft²-°F @Thickness 0.250 in, Temperature 112 °F
Glass Transition Temp, Tg	23.0 °C	73.4 °F	Onset
	29.0 °C	84.2 °F	Mid-point

Electrical Properties	Metric	English	Comments
Volume Resistivity	6.70e+11 ohm-cm	6.70e+11 ohm-cm	ASTM D257
Dielectric Constant	6.6 @Frequency 1000 Hz	6.6 @Frequency 1000 Hz	ASTM D150
Dielectric Strength	28.0 kV/mm @Thickness 0.762 mm	710 kV/in @Thickness 0.0300 in	ASTM D150
Dissipation Factor	0.060 @Frequency 1000 Hz	0.060 @Frequency 1000 Hz	ASTM D150

Processing Properties	Metric	English	Comments
Cure Time	9.00 - 10.0 min	0.150 - 0.167 hour	Tack-Free
	2880 min	48.0 hour

Descriptive Properties	Value	Comments
Appearance	Clear
	Clear	Base
	Clear	Accelerator

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