Epoxy Technology EPO-TEK® E2101 Electrically Conductive, Silver Epoxy

Product Description: EPO-TEK® E2101 is a two component, thixotropic, electrically conductive adhesive. It may be used for circuit assembly and semiconductor applications. Advantages & Application Notes:Thixotropic paste allows for application by stencil or screen printing. SMD caps and resistors as small as the 0402 format have been mounted to PCB without silver bridging between the 2 electrodes.Capable of adhering to PCB metals like Au, Cu, OSP / Cu, Ag, Ag-Pd.Used for making electrical connections to PZT electrodes in ink-jetting or medical / ultrasound applicationsSuitable for low temperature flip chip packaging. “Bumps” of E2101 may be used instead of Sn/Pb solder balls.Suited for high speed automated syringe dispensing techniques.Low flow, low resin bleedout on gold surfaces.Passes NASA low outgassing standard ASTM E595 with proper cureJEDEC Level III and II semiconductor packaging materialInformation Provided by Epoxy Technology