Epoxy Technology EPO-TEK® B9021-6 Epoxy Paste

Category	Polymer , Thermoset , Epoxy
Manufacturer	Epoxy Technology
Trade Name	EPO-TEK®
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxy Technology EPO-TEK® B9021-6 Epoxy Paste.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate attach. For opto-packaging, it can be used as the main gasket seal of glass plates in LCDs, or for sealing filter windows onto optosensors. It is a higher viscosity version of EPO-TEK® B9021-1.Information Provided by Epoxy Technology

Physical Properties	Metric	English	Comments
Specific Gravity	1.23 g/cc	1.23 g/cc
Particle Size	<= 20 µm	<= 20 µm
Viscosity	15000 - 32000 cP @Temperature 23.0 °C	15000 - 32000 cP @Temperature 73.4 °F	10 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	68	68
Tensile Modulus	1.28 GPa	186 ksi	Storage
Shear Strength	8.00 MPa	1160 psi	Lap
	>= 11.7 MPa	>= 1700 psi	Die

Thermal Properties	Metric	English	Comments
CTE, linear	32.0 µm/m-°C	17.8 µin/in-°F	Below Tg
	37.0 µm/m-°C	20.6 µin/in-°F	Above Tg
Maximum Service Temperature, Air	160 °C	320 °F	Continuous
	260 °C	500 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 68.0 °C	>= 154 °F
Decomposition Temperature	311 °C	592 °F	Degradation Temperature

Processing Properties	Metric	English	Comments
Dry Time	<= 24.0 hour	<= 24.0 hour
Cure Time	30.0 min @Temperature 75.0 °C	0.500 hour @Temperature 167 °F	minimum, Pre-cure
Pot Life	40320 min	40320 min	Closed container
Shelf Life	12.0 Month	12.0 Month	refrigerated

Descriptive Properties	Value	Comments
Color	Cream	before cure
Consistency	Smooth Thixotropic paste
Number of Components	Single
Weight Loss	5.47%	200°C

Users viewing this material also viewed the following: