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Epoxy Technology EPO-TEK® E2036 Epoxy

Category	Polymer , Thermoset , Epoxy
Manufacturer	Epoxy Technology
Trade Name	EPO-TEK®
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxy Technology EPO-TEK® E2036 Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Product Description: A two component, slightly flexible, silver-filled, electrically conductive adhesive for semiconductor and electronic assemblies. It is a low Tg epoxy, intended for many kinds of electronics at the PCB level, flex circuitry, or optical and medical devices. It can be used for resisting thermal cycles, high vibration applications or resisting PCB drop tests.Information Provided by Epoxy Technology

Physical Properties	Metric	English	Comments
Specific Gravity	2.81 g/cc	2.81 g/cc	Part A
	3.52 g/cc	3.52 g/cc	Part B
Particle Size	<= 20 µm	<= 20 µm
Viscosity	10000 - 20000 cP @Temperature 23.0 °C	10000 - 20000 cP @Temperature 73.4 °F	20 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	75	75
Tensile Modulus	4.40 GPa	638 ksi	Storage
Shear Strength	10.29 MPa	1492 psi	Lap
	>= 11.7 MPa	>= 1700 psi	Die

Thermal Properties	Metric	English	Comments
CTE, linear	39.0 µm/m-°C	21.7 µin/in-°F	Below Tg
	178 µm/m-°C	98.9 µin/in-°F	Above Tg
Thermal Conductivity	1.53 W/m-K	10.6 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	250 °C	482 °F	Continuous
	350 °C	662 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 30.0 °C	>= 86.0 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature	444 °C	831 °F	Degradation Temperature

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 0.00030 ohm-cm	>= 0.00030 ohm-cm

Chemical Properties	Metric	English
Ionic Impurities - Na (Sodium)	1.0 ppm	1.0 ppm
Ionic Impurities - K (Potassium)	8.0 ppm	8.0 ppm
Ionic Impurities - Cl (Chloride)	422 ppm	422 ppm

Processing Properties	Metric	English
Cure Time	60.0 min @Temperature 150 °C	1.00 hour @Temperature 302 °F
Pot Life	4320 min	4320 min
Shelf Life	12.0 Month @Temperature 25.0 °C	12.0 Month @Temperature 77.0 °F

Descriptive Properties	Value	Comments
Color	Silver	Part A
	Silver	Part B
Consistency	Soft, smooth paste
Ionic Impurities NH4	159 ppm
Mix Ratio By Weight	3:1
Number of Components	Two
Thixotropic Index	3.95
Weight Loss	0.13%	200°C
	0.32%	250°C
	0.65%	300°C

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