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Epoxy Technology EPO-TEK® H20S Electrically Conductive, Silver Epoxy for Die Stamping

Category Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® H20S Electrically Conductive, Silver Epoxy for Die Stamping.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
Product Description: EPO-TEK® H20S is a modified version of EPO-TEK® H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK®H20S is a highly reliable, two component, silver-filled epoxy with a smooth, thixotropic consistency. In addition to the high electrical conductivity, the short curing cycles, the proven reliability, and the convenient mix ratio, EPO-TEK® H20S is extremely simple to use.Advantages & Application Notes: Especially recommended for use in high speed epoxy chip bonding systems where fast cures are highly desirable.Suggested for JEDEC Level III and II plastic IC packaging.The low temperature cure makes it ideal for flex circuitry and other low stress applications.It is used extensively for bonding quartz crystal oscillators and other stress sensitive chips.Used for die and SMD bonding inside hybrid/hermetic packages such as DIP and TO-Cans; also EMI/Rf shielding of micro-electronics.Ideal for making ITO electrical contacts in LCD packaging; and suggested for LED die-attach.Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 1.74 g/cc
1.74 g/cc
Part A
3.07 g/cc
3.07 g/cc
Part B
Particle Size <= 20 µm
<= 20 µm
Viscosity 1800 - 2800 cP

@Temperature 23.0 °C
1800 - 2800 cP

@Temperature 73.4 °F
100 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 64
64
Tensile Modulus 2.3423 GPa
339.72 ksi
Storage
Shear Strength 8.55 MPa
1240 psi
Lap
>= 11.7 MPa
>= 1700 psi
Die
Thermal Properties Metric English Comments
CTE, linear 31.0 µm/m-°C
17.2 µin/in-°F
Below Tg
120 µm/m-°C
66.7 µin/in-°F
Above Tg
Thermal Conductivity 3.25 W/m-K
22.6 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 200 °C
392 °F
Continuous
300 °C
572 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 80.0 °C
>= 176 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 414 °C
777 °F
Degradation Temperature
Electrical Properties Metric English Comments
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Chemical Properties Metric English Comments
Ionic Impurities - Na (Sodium) 0.00 ppm
0.00 ppm
Ionic Impurities - K (Potassium) 4.0 ppm
4.0 ppm
Ionic Impurities - Cl (Chloride) 162 ppm
162 ppm
Processing Properties Metric English Comments
Cure Time 0.750 min

@Temperature 175 °C
0.0125 hour

@Temperature 347 °F
Minimum Bond Line
5.00 min

@Temperature 150 °C
0.0833 hour

@Temperature 302 °F
Minimum Bond Line
15.0 min

@Temperature 120 °C
0.250 hour

@Temperature 248 °F
Minimum Bond Line
45.0 min

@Temperature 100 °C
0.750 hour

@Temperature 212 °F
Minimum Bond Line
Pot Life 4320 min
4320 min
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Silver
Part A
Silver
Part B
Consistency Smooth thixotropic paste
Ionic Impurities NH4 82 ppm
Mix Ratio By Weight 1:1
Number of Components Two
Thixotropic Index 5
Weight Loss 0.4%
200°C
0.6%
250°C
1.37%
300°C
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