Epoxy Technology EPO-TEK® H20S Electrically Conductive, Silver Epoxy for Die Stamping

Product Description: EPO-TEK® H20S is a modified version of EPO-TEK® H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK®H20S is a highly reliable, two component, silver-filled epoxy with a smooth, thixotropic consistency. In addition to the high electrical conductivity, the short curing cycles, the proven reliability, and the convenient mix ratio, EPO-TEK® H20S is extremely simple to use.Advantages & Application Notes: Especially recommended for use in high speed epoxy chip bonding systems where fast cures are highly desirable.Suggested for JEDEC Level III and II plastic IC packaging.The low temperature cure makes it ideal for flex circuitry and other low stress applications.It is used extensively for bonding quartz crystal oscillators and other stress sensitive chips.Used for die and SMD bonding inside hybrid/hermetic packages such as DIP and TO-Cans; also EMI/Rf shielding of micro-electronics.Ideal for making ITO electrical contacts in LCD packaging; and suggested for LED die-attach.Information Provided by Epoxy Technology