Songhan Plastic Technology Co.,Ltd.
 POLYMER SEARCH

Epoxy Technology EPO-TEK® H31LV Electrically Conductive, Silver Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® H31LV Electrically Conductive, Silver Epoxy.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
Product Description: EPO-TEK® H31LV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic packaging. Low viscosity version of EPO-TEK® H31.Advantages & Application Notes: Bright /shiny silver provides high reflectance, especially good for enhancing LED overall brightness.Rheology described as pourable paste:Allows for high volume dispensing, wafer-level stamping, and pin transfer methods of application.It is capable of spray coating or paint brush coating. Suggested applications:Semiconductor: die attach chips onto lead-frames for JEDEC Level III and II packaging. Adhesion to Ag-spot leadframe.Hybrids: GaAs and Si die attach, adhesion to Au-plated chips, general electrical contacts for ceramic circuits, substrate attach to ground package.Opto-electronic: single LED packaging in TO-cans, LED arrays on PCB or substrate, adhesion to ITO in LCDs, and sensor device/OEM instrumentation.PCB/General: EMI or Rf shielding of electronicsAvailable in several different viscosity versions. Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 1.57 g/cc
1.57 g/cc
Particle Size <= 45 µm
<= 45 µm
Viscosity 2000 - 3500 cP

@Temperature 23.0 °C
2000 - 3500 cP

@Temperature 73.4 °F
100 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 85
85
Tensile Modulus 1.77 GPa
257 ksi
Storage
Shear Strength 9.65 MPa
1400 psi
Lap
>= 11.7 MPa
>= 1700 psi
Die
Thermal Properties Metric English Comments
CTE, linear 26.0 µm/m-°C
14.4 µin/in-°F
Below Tg
148 µm/m-°C
82.2 µin/in-°F
Above Tg
Thermal Conductivity 0.550 W/m-K
3.82 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 200 °C
392 °F
Continuous
300 °C
572 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 110 °C
>= 230 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—250°C @ 20°C/Min
Decomposition Temperature 387 °C
729 °F
Degradation Temperature
Electrical Properties Metric English Comments
Volume Resistivity <= 0.0080 ohm-cm
<= 0.0080 ohm-cm
Chemical Properties Metric English Comments
Ionic Impurities - Na (Sodium) 380 ppm
380 ppm
Ionic Impurities - K (Potassium) 47 ppm
47 ppm
Ionic Impurities - Cl (Chloride) 14 ppm
14 ppm
Processing Properties Metric English Comments
Cure Time 60.0 min

@Temperature 150 °C
1.00 hour

@Temperature 302 °F
Minimum Bond Line
Pot Life 4320 min
4320 min
Shelf Life 6.00 Month
6.00 Month
refrigerated
Descriptive Properties Value Comments
Color Silver
Consistency Smooth, pourable paste
Ionic Impurities NH4 8 ppm
Number of Components Single
Thixotropic Index 1.8
Weight Loss 0.13%
200°C
0.27%
250°C
1.05%
300°C
Copyright © lookpolymers.com All Rights Reserved