Resin Technology Group TIGA 908 Gold Bonder - Low Stress Silver Conductive

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer	Resin Technology Group
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Resin Technology Group TIGA 908 Gold Bonder - Low Stress Silver Conductive.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

100 parts resin to 6 parts hardener.TIGA 908 is a low stress, conductive silver filled epoxy adhesive. It is recommended for bonding, and sealing electronic applications which require bonding to gold, high stress absorption, conductivity, and mechanical performance. This smooth paste formulation of pure silver and epoxy is free of solvents and extraneous additives. It develops strong, durable, electrically and thermally conductive bonds between many dissimilar materials including gold and other metals, ceramics and plastic laminates.Information provided by Resin Technology Group.

Physical Properties	Metric	English	Comments
Specific Gravity	2.40 g/cc	2.40 g/cc
Solids Content	100 %	100 %	Reactive

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	80	80
Shear Strength	9.65 MPa	1400 psi	Cured 1 hour at 125°C, Al/Al
	11.0 MPa	1600 psi	Cured 30 minutes at 150°C, Al/Al
	11.7 MPa	1700 psi	Cured 1 hour at 125°C, Au/Au
	12.4 MPa	1800 psi	Cured 30 minutes at 150°C, Au/Au
	13.1 MPa	1900 psi	Cured 2 hours at 125°C, Al/Al
	13.8 MPa	2000 psi	Cured 2 hours at 125°C, Au/Au

Thermal Properties	Metric	English
Thermal Conductivity	1.55 W/m-K	10.7 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	135 °C	275 °F
Minimum Service Temperature, Air	-60.0 °C	-76.0 °F

Electrical Properties	Metric	English	Comments
Volume Resistivity	0.00020 ohm-cm	0.00020 ohm-cm	cured 2 hours at 125°C
	0.00030 ohm-cm	0.00030 ohm-cm	cured 30 minutes at 150°C
	0.00050 ohm-cm	0.00050 ohm-cm	cured 1 hour at 125°C
	0.0050 ohm-cm	0.0050 ohm-cm	cured 4 hours at 65°C

Processing Properties	Metric	English	Comments
Pot Life	240 min @Temperature 25.0 °C	240 min @Temperature 77.0 °F

Descriptive Properties	Value	Comments
Color	Silver
Viscosity	Smooth paste	After mixing

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