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Parker Chomerics Tecknit Teckfip™ FIP-E (SP)` Formed in Place Conductive Elastomer

Category Polymer , Thermoset , Rubber or Thermoset Elastomer (TSE)
Manufacturer Parker Chomerics Tecknit
Trade Name Teckfip™
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics Tecknit Teckfip™ FIP-E (SP)` Formed in Place Conductive Elastomer.pdf
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Material Notes:
This is the small particle version of the Ag/glass (FIP E) compound that was specifically designed for the mobile cell phone applications. It should be noted that this compound offers a low compression set, making it ideally suited to applications where by the gasket is frequently compressed and uncompressed.Information provided by Chomerics
Physical Properties Metric English Comments
Specific Gravity 1.53 - 2.07 g/cc
1.53 - 2.07 g/cc
Mechanical Properties Metric English Comments
Hardness, Shore A 60 - 80
60 - 80
Tensile Strength >= 1.88 MPa
>= 273 psi
Elongation at Break 71 %
71 %
Peel Strength >= 9.00 kN/m
>= 51.4 pli
Compression Set 10 - 25 %
10 - 25 %
7.0 %

@Temperature 70.0 °C,
Time 79200 sec
7.0 %

@Temperature 158 °F,
Time 22.0 hour
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 125 °C
257 °F
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Electrical Properties Metric English Comments
Volume Resistivity 0.0090 ohm-cm
0.0090 ohm-cm
Surface Resistance <= 0.012 ohm
<= 0.012 ohm
<= 0.012 ohm

@Temperature 85.0 °C,
Time 605000 sec
<= 0.012 ohm

@Temperature 185 °F,
Time 168 hour
Processing Properties Metric English Comments
Dry Time >= 0.200 hour
>= 0.200 hour
Tack Free
Cure Time <= 1440 min
<= 24.0 hour
Shelf Life 1.00 Month
1.00 Month
Syringe
6.00 Month
6.00 Month
Cartridge
Descriptive Properties Value Comments
Color Ivory
Filler Silver/Glass
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