Polymer Property : Pot Life = 960 min Product List

Processing Properties

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Processing Properties	Metric	English
Pot Life	960 min @Temperature 25.0 Â°C	960 min @Temperature 77.0 Â°F
Lord Adhesives Thermosetâ„¢ ME-531 Underfill Encapsulant LORD Thermosetâ„¢ ME-531 encapsulant is a high purity, semiconductor grade epoxy underfill product developed for the encapsulation of flip chip devices. It is formulated to reduce warpage and wit..
Pot Life	960 min	960 min
Epoxy Technology EPO-TEK® H22 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.Advantages & Application Notes: A smooth, ..