Processing Properties | Metric | English | Comments |
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Pot Life | 960 min @Temperature 25.0 °C |
960 min @Temperature 77.0 °F |
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Lord Adhesives Thermosetâ„¢ ME-531 Underfill Encapsulant LORD Thermosetâ„¢ ME-531 encapsulant is a high purity, semiconductor grade epoxy underfill product developed for the encapsulation of flip chip devices. It is formulated to reduce warpage and wit.. |
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Pot Life | 960 min | 960 min | |
Epoxy Technology EPO-TEK® H22 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.Advantages & Application Notes: A smooth, .. |