Songhan Plastic Technology Co.,Ltd.

Lord Adhesives Thermosetâ„¢ LS 213-9 Unfilled Epoxy Encapsulant

Category Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer Lord Adhesives
Trade Name Thermoset™
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Lord Adhesives Thermosetâ„¢ LS 213-9 Unfilled Epoxy Encapsulant.pdf
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Material Notes:
Lord LS 213-9 is a one component epoxy coating and impregnating compound featuring low viscosity, good moisture resistance and excellent dielectric properties. Typical applications include transformer potting and electrical lamination.All information provided by Lord.
Physical Properties Metric English Comments
Specific Gravity 1.13 g/cc
1.13 g/cc
Solids Content 100 %
100 %
Viscosity 2800 cP

@Temperature 25.0 °C
2800 cP

@Temperature 77.0 °F
Mechanical Properties Metric English Comments
Hardness, Shore D 85
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 155 °C
311 °F
Glass Transition Temp, Tg 75.0 °C
167 °F
Electrical Properties Metric English Comments
Volume Resistivity 2.00e+15 ohm-cm
2.00e+15 ohm-cm
Dielectric Constant 3.4

@Frequency 1000 Hz

@Frequency 1000 Hz
Dielectric Strength 18.9 kV/mm
480 kV/in
Dissipation Factor 0.022

@Frequency 1000 Hz

@Frequency 1000 Hz
Processing Properties Metric English Comments
Cure Time 120 min

@Temperature 121 °C
2.00 hour

@Temperature 250 °F
300 min

@Temperature 104 °C
5.00 hour

@Temperature 220 °F
480 min

@Temperature 93.3 °C
8.00 hour

@Temperature 200 °F
Descriptive Properties Value Comments
Appearance Amber
Consistency Liquid
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