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Aremco Aremco-Bond™ 2340 High Temperature Epoxide Potting Compound

Category Polymer , Thermoset , Epoxy , Epoxy, High Temperature
Manufacturer Aremco
Trade Name Aremco-Bond™
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Aremco Aremco-Bond™ 2340 High Temperature Epoxide Potting Compound.pdf
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Material Notes:
High Temperature, Low Viscosity, Low Expansion, High Glass Transition Temperature & Chemical Resistance
Physical Properties Metric English Comments
Density 1.75 g/cc
0.0632 lb/in³
Viscosity 39000 cP
39000 cP
Mixed
Linear Mold Shrinkage 0.00340 cm/cm
0.00340 in/in
cure shrinkage
Mechanical Properties Metric English Comments
Hardness, Shore D 90.0
90.0
Flexural Strength 95.1 MPa
13800 psi
Thermal Properties Metric English Comments
CTE, linear 16.2 µm/m-°C
9.00 µin/in-°F
Maximum Service Temperature, Air 221 °C
430 °F
Minimum Service Temperature, Air -40.0 °C
-40.0 °F
Electrical Properties Metric English Comments
Volume Resistivity 3.80e+15 ohm-cm
3.80e+15 ohm-cm
Dielectric Constant 4.30

@Frequency 1000 Hz
4.30

@Frequency 1000 Hz
Dielectric Strength 18.1 kV/mm
460 kV/in
Dissipation Factor 0.00400
0.00400
Processing Properties Metric English Comments
Cure Time 120 min

@Temperature 79.4 °C
2.00 hour

@Temperature 175 °F
Step 1 of recommended 2 step cure
120 min

@Temperature 149 °C
2.00 hour

@Temperature 300 °F
Step 2 of recommended 2 step cure
360 min

@Temperature 121 °C
6.00 hour

@Temperature 250 °F
Alternate
Pot Life >= 240 min

@Temperature 23.0 °C
>= 240 min

@Temperature 73.4 °F
100 g mass
Descriptive Properties Value Comments
Chemical Resistance Excellent
Color Black
Mix Ratio 100:10
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